Abstract: A semiconductor circuit and method of fabrication is disclosed. In one embodiment, the semiconductor circuit comprises a metal-insulator-metal trench capacitor in a silicon substrate. A field effect transistor is disposed on the silicon substrate adjacent to the metal-insulator-metal trench capacitor, and a silicide region is disposed between the field effect transistor and the metal-insulator-metal trench capacitor. Electrical connectivity between the transistor and capacitor is achieved without the need for a buried strap.

Abstract: Contact with a floating body of an FET in SOI may be formed in a portion of one of the two diffusions of the FET, wherein the portion of the diffusion (such as N?, for an NFET) which is “sacrificed” for making the contact is a portion of the diffusion which is not immediately adjacent (or under) the gate. This works well with linked body FETs, wherein the diffusion does not extend all the way to BOX, hence the linked body (such as P?) extends under the diffusion where the contact is being made. An example showing making contact for ground to two NFETs (PG and PD) of a 6T SRAM cell is shown.

Abstract: A structure and method for forming isolation and a buried plate for a trench capacitor is disclosed. Embodiments of the structure comprise an epitaxial layer serving as the buried plate, and a bounded deep trench isolation area serving to isolate one or more deep trench structures. Embodiments of the method comprise angular implanting of the deep trench isolation area to form a P region at the base of the deep trench isolation area that serves as an anti-punch through implant.

Abstract: A trench and method of fabrication is disclosed. The trench shape is cylindrosymmetric, and is created by forming a dopant profile that is monotonically increasing in dopant concentration level as a function of depth into the substrate. A dopant sensitive etch is then performed, resulting in a trench shape providing increased surface area, yet having relatively smooth trench walls.

Abstract: A method of forming an MIM capacitor having interdigitated capacitor plates. Metal and dielectric layers are alternately deposited in an opening in a layer of insulator material. After each deposition of the metal layer, the metal layer is removed at an angle from the side to form the capacitor plate. The side from which the metal layer is removed is alternated with every metal layer that is deposited. When all the capacitor plates have been formed, the remaining opening in the layer of insulator material is filled with dielectric material then planarized, followed by the formation of contacts with the capacitor plates. There is also an MIM capacitor structure having interdigitated capacitor plates.

Abstract: A method includes providing an SOI substrate including a layer of silicon disposed atop a layer of an oxide, the layer of an oxide being disposed atop the semiconductor substrate; forming a deep trench having a sidewall extending through the layer of silicon and the layer of an oxide and into the substrate; depositing a continuous spacer on the sidewall to cover the layer of silicon, the layer of an oxide and a part of the substrate; depositing a first conformal layer of a conductive material throughout the inside of the deep trench; creating a silicide within the deep trench in regions extending through the sidewall into an uncovered part of the substrate; removing the first conformal layer from the continuous spacer; removing the continuous spacer; depositing a layer of a high k dielectric material throughout the inside of the deep trench, and depositing a second conformal layer of a conductive material onto the layer of a high-k dielectric material.

Abstract: Deep trenches formed beneath contact level in a semiconductor substrate function as crackstops, in a die area or in a scribe area of the wafer, and may be disposed in rows of increasing distance from a device which they are intended to protect, and may be located under a lattice work crackstop structure in an interconnect stack layer. The deep trenches may remain unfilled, or may be filled with a dielectric material or conductor. The deep trenches may have a depth into the substrate of approximately 1 micron to 100 microns, and a width of approximately 10 nm to 10 microns.

Abstract: A method of fabricating a trench capacitor is provided in which a material composition of a semiconductor region of a substrate varies in a quantity of at least one component therein such that the quantity alternates with depth a plurality of times between at least two different values. For example, a concentration of a dopant or a weight percentage of a second semiconductor material in a semiconductor alloy can alternate between with depth a plurality of times between higher and lower values. In such method, the semiconductor region can be etched in a manner dependent upon the material composition to form a trench having an interior surface which undulates in a direction of depth from the major surface of the semiconductor region. Such method can further include forming a trench capacitor having an undulating capacitor dielectric layer, wherein the undulations of the capacitor dielectric layer are at least partly determined by the undulating interior surface of the trench.

Abstract: A method and system for repairing photomasks is disclosed. A scanning electron microscope (SEM) is used to identify, measure, and correct defects. The SEM is operated in multiple modes, including a measuring mode and a repair mode. The repair mode is of higher landing energy and exposure time than the measuring mode, and induces shrinkage in the photoresist to correct various features, such as vias that are too small.

Abstract: A method and apparatus for forming connections within a semiconductor device is disclosed. The semiconductor device incorporates a contact bridge between transistor contacts in close proximity. The contact bridge comprises a plurality of metal pillars each having a lower end in electrical contact with first and second transistor elements, respectively; one or more intermediate metal pillars disposed between and in electrical contact with an upper end of the metal pillars; and one or more separation regions of dielectric disposed below the intermediate metal pillar and between the lower ends of the first and second metal pillars.

Abstract: A method and apparatus for adaptively adjusting the operating voltage of an integrated circuit in response to tester-to-system variations, worst-case testing techniques, process variations, temperature variations, or reliability wearout mechanisms. The minimum operating voltage of an integrated circuit is determined either during external testing of the integrated circuit or during built-in-self-testing. The minimum operating voltage is transmitted to a variable voltage regulator where it is used to set the output of the regulator. The output of the regulator supplies the integrated circuit with its operating voltage. This technique enables tailoring of the operating voltage of integrated circuits on a part-by-part basis which results in power consumption optimization by adapting operating voltage in response to tester-to-system variations, worst-case testing techniques, process variations, temperature variations or reliability wearout mechanisms.

Abstract: An SOI layer has an initial trench extending therethrough, prior to deep trench etch. An oxidation step, such as thermal oxidation is performed to form a band of oxide on an inner periphery of the SOI layer to protect it during a subsequent RIE step for forming a deep trench. The initial trench may stop on BOX underlying the SOI. The band of oxide may also protect the SOI during buried plate implant or gas phase doping.

Abstract: A design process includes inputting a design file representing a circuit design embodied in a non-transitory computer-readable medium, and using a computer to translate the circuit design into a netlist. The netlist comprises a representation of a plurality of wires, transistors, and logic gates, and is stored in the non-transitory computer-readable medium. When executed by the computer, the netlist produces the circuit design. The circuit design comprises a static random access memory (“SRAM”) including a plurality of SRAM cells arranged in an array, including a plurality of rows and a plurality of columns, and a plurality of column voltage control circuits corresponding to respective ones of the plurality of columns of the array.

Abstract: An apparatus is provided which includes a common signal node operable to conduct a first signal, a first circuit coupled to the common signal node to utilize the first signal and a signal-handling element coupled to the common signal node. The signal-handling element includes an isolating circuit coupled to the first conductor, a second conductor operable to conduct an output of the isolating circuit, and a signal-handling circuit coupled to the second conductor. The signal-handling circuit is operable to perform a signal-handling function in response to the output of the isolating circuit. By virtue of the isolating circuit, the signal-handling circuit and the first circuit are isolated from the second conductor and the signal-handling circuit. Preferably, the achieved isolation permits a communication signal included in the first signal to be conducted within a communication apparatus with less capacitance, and producing less return loss of that signal.

Abstract: A design structure for a signal-handing apparatus or communication apparatus is provided which includes a common signal node operable to conduct a first signal, a first circuit coupled to the common signal node to utilize the first signal and a signal-handling element coupled to the common signal node. A signal-handling apparatus may include an isolating circuit coupled to a first conductor, a second conductor to conduct an output of the isolating circuit, and a signal-handling circuit coupled to the second conductor. A signal-handling circuit can perform a signal-handling function in response to the output of the isolating circuit. The signal-handling circuit and the first circuit may be isolated from the second conductor and the signal-handling circuit such that a communication signal may be conducted with less capacitance and be subject to less return loss.

Abstract: A single unified level one instruction(s) cache in which some lines may contain traces and other lines in the same congruence class may contain blocks of instruction(s) consistent with conventional cache lines. Formation of trace lines in the cache is delayed on initial operation of the system to assure quality of the trace lines stored.

Abstract: A fuse includes a fuse link region, a first region and a second region. The fuse link region electrically connects the first region to the second region. A SiGe layer is disposed only in the fuse link region and the first region.

Abstract: A method of recovering gain in a bipolar transistor includes: providing a bipolar transistor including an emitter, a collector, and a base disposed between junctions at the emitter and the collector; reverse biasing the junction disposed between the emitter and the base with an operational voltage and for an operational time period, so that a current gain ? of the transistor is degraded; idling the transistor, and generating a repair current Ibr into the base, while forward biasing the junction disposed between the emitter and the base with a first repair voltage (VEBR), and while at least partly simultaneously reverse biasing the junction disposed between the collector and the base with a second repair voltage (VCBR), for a repair time period (TR), so that the gain is at least party recovered; wherein VEBR, VCBR and TR have the proportional relationship: TR ? (??)2×exp [1/(Tam+Rth×le×VCER)], VCER=VBER+VCBR, and le=?×Ibr, ? is the normal current gain of the transistor, ?? is the target recovery gain of the tr

Abstract: A single unified level one instruction(s) cache in which some lines may contain traces and other lines in the same congruence class may contain blocks of instruction(s) consistent with conventional cache lines. Formation of trace lines in the cache is delayed on initial operation of the system to assure quality of the trace lines stored.

Abstract: In a field effect transistor (FET), halo features may be formed by etching into the surface of a silicon layer followed by a step of growing a first epitaxial silicon (epi-Si) layer on the etched silicon layer. Source (S) and drain (D), as well as S/D extension features may similarly be formed by etching an epitaxial silicon layer, then filling with another epitaxial layer. Source and Drain, and extensions, and halo, which are normally formed by diffusion, may be formed as discrete elements by etching and filling (epi-Si). This may provide a shallow, highly activated, abrupt S/D extension, an optimally formed halo and deep S/D diffusion doping, and maximized improvement of channel mobility from the compressive or tensile stress from e-SiGe or e-SiC.