Abstract: A semiconductor device and its method of fabrication are provided. The semiconductor device includes a substrate, a patterning stop region, an insulating overlayer, a container region within the insulating overlayer, a charge storage lamina or conductive layer over an interior surface of the container region; a contact region defined by the charge storage lamina or conductive layer; and an electrical contact in the contact region, wherein respective portions of the electrical contact and the charge storage lamina or conductive layer occupy collectively substantially all of the container region. A bit line terminal is coupled to the charge storage lamina through a switching structure.

Abstract: A heat-transferable security stamp is provided including a carrier sheet, a top coat layer, at least one design layer between the carrier sheet and the top coat layer, a release layer between the carrier sheet and the design layer, and a base coat layer between the release layer and the design layer. The release layer includes a water-borne release component. The base coat layer includes a water-borne base coat component. The design layer includes a water-borne design component. The top coat layer includes a water-borne top coat component. The carrier sheet is resistant to heat above a predetermined heat transfer temperature. The adhesive release component of the release layer is operative to secure the carrier sheet to the base coat layer at temperatures below the heat transfer temperature and to permit release of the carrier sheet from the base coat layer at temperatures above the heat transfer temperature.

Abstract: A capacitive energy storage device for use at cryogenic temperatures is provided including first and second electrode layers having a layer of dielectric material there between. The electrode layers include an electrically conductive material having a formula selected from YBa2Cu3Ox and Bi2Ca2Sr2Cu3Oy. A method of storing electrical charge in a capacitive energy storage device is also provided.

Abstract: Methods and devices are disclosed utilizing a silicon-containing barrier layer. A method of forming a barrier layer on a semiconductor device is disclosed. A semiconductor device is provided. A silicon-containing material is deposited on the semiconductor device. The silicon-containing material is processed in a reactive ambient. The barrier layer can be made primarily oxide, primarily nitride or both by the reactive ambient selected. A semiconductor device is disclosed. The semiconductor device includes a substrate, a gate oxide, a silicon-containing barrier layer and a gate electrode. The gate oxide is formed over the substrate. The silicon-containing barrier layer is formed over the gate oxide by causing silicon atoms of a precursor layer react with a reactive agent. The gate electrode is formed over the silicon-containing barrier layer. Other embodiments utilizing a barrier layer are disclosed.

Abstract: A business form includes a carrier sheet having an upper surface and a lower surface, and defining a die cut opening there through, with a patch of liner material mounted on the lower surface of the carrier sheet. The patch extends over the opening. The liner material has an upper surface facing the die cut opening in the carrier sheet, and carries a release coating on the upper surface. A two ply label assembly is mounted on the patch of liner material in the die cut opening. The two ply label assembly includes a transparent ply mounted on the upper surface of the patch of liner material, and a label ply mounted on the transparent ply. The form is manufactured by: a.) die cutting an opening in a piece of carrier material; b.) adhesively affixing a patch of liner material to the piece of carrier material; c.) mounting a transparent ply on the patch of liner material within the die cut opening; and d.) mounting a label ply on the transparent ply. The form is used by: a.

Abstract: A mailer intermediate is formed from a sheet having at least one transverse fold line dividing the sheet into a first panel and a second panel such that the first panel longitudinal dimensions are equal to, or exceed the second panel longitudinal dimensions. The second panel is folded over onto the first panel. A temporary tacking agent is applied to the face of the sheet to temporarily tack down the folded over, transverse edge of the lower panel. The mailer intermediate may be processed in this pre-folded condition according to the user's variable imaging needs because there are no loose edges to catch in printer output stacking trays, or jam in internal components of printers. The longitudinal edges of the return envelope panel may be permanently sealed prior to printing, or may be sealed later during processing through folder/sealer equipment.

Abstract: A cryotransfer holder for side entry transmission electron microscopes is provided. The cryotransfer holder design permits a specimen to be rotated about its axis as well as tilted while being maintained at a low temperature. The holder allows two sets of tilt data, preferably perpendicular to one another, to be collected from a single frozen specimen.

Abstract: A protective case to be worn by an individual for carrying a medical device that may be required in case of allergic or asthmatic reactions or diabetic reactions. The case includes a rigid receptacle to protect the medical device. The case can be worn on a person's belt or it may be permanently fixed to a belt or a band that can be worn around the waist, an arm or a leg. For a standard syringe, the receptacle comprises an elongated, rigid cylindrical tube which fits closely about the syringe. The receptacle further includes an open end that is covered by a cap that can be readily removed to provide easy access to the syringe inside the tube and which protects the syringe from contamination. The case is unobtrusive in appearance and does not hamper the individual's movements thus allowance it to be worn at all times.

Abstract: A phase change composition is provided which includes a nucleating agent to reduce supercooling of the composition. The phase change composition may comprise a eutectic mixture of water and sodium chloride. The nucleating agent may comprise calcium oxide, calcium hydroxide, or pentaerythritol. The phase change composition may also include silica particles such that it is provided in the form of a gel or powder. The phase change composition may be used in a variety of applications including thermal shipping containers.

Abstract: The cure-through rate of one-part silylated polymer adhesive/sealant compositions is improved by the addition of a small but effective amount of an alcohol-free hydrophilic solvent. The composition is particularly suitable for packaging in aluminum or aluminum-lined cartridges.

Abstract: An electric discharge machining module for forming a hole in a workpiece with an electrode is provided, comprising a module body, a spindle assembly and a piston assembly. The module body defines a throughbore extending along an axis. The spindle assembly is at least partially positioned within the throughbore for rotation around the axis and includes a first electrode passageway which is coaxial with the axis for receiving the electrode therethrough. The piston assembly is positioned within the throughbore for movement along the axis between a released position and an engaged position. The piston assembly includes a second electrode passageway which is coaxial with the axis for receiving the electrode therethrough. A collet closer of the piston assembly engages a collet of the spindle assembly when the piston assembly is in the engaged position such that the collet grips the electrode for unitary rotational movement of the electrode and the spindle assembly.

Abstract: The described current distributor has a bus bar, a plug socket connected to the bus bar, at least one contact element which comprises an access connection, a consumer tapping and an element connecting the access connection and the consumer tapping, at least one plug connection for the plug contacts of a protective switch, which has a plug socket of the bus bar and an access socket of a contact element, and two signaling lines. In order to produce such a current distributor inexpensively and to ensure reliability of operation, it is provided in accordance with the invention that the contact element comprises a one-piece member.

Abstract: A tuck label for placing on a shipping package. The tuck label includes a substrate portion and a single sheet label portion with adhesive included on a surface. The label portion further includes one or more fold lines that define upper and lower adjacent print panels, both of which can receive printable indicia. A score line is placed in the label portion to define a mount region, a printable surface region and a pull tab region. The pull tab region is disposed between the mount region and the printable surface region, and includes a pull tab with at least one layer of adhesive so that, upon folding of the label portion along the one or more fold lines, the pull tab becomes multi-layered for increased strength and durability.

Abstract: A security document and a device for authenticating the security document are provided. The device for authenticating the security document comprises an optical imaging device and a specially programmed controller. The security document comprises a unique combination of covert triggers, overt triggers, and overt secure document indicators arranged to enhance the security of the document at issue and enable high speed machine authentication of the document at issue. In accordance with one embodiment of the present invention, a device for authenticating a security document is provided. The security document includes a security image printed on a face thereof. The security image is defined by a collection of security image elements and defines at least one document authentication scheme. The document authentication scheme is arranged to provide a primary indication of document authenticity. The authentication device comprises an optical imaging device and a specially programmed controller.

Abstract: A stretcher comprised of a roller base, a scissor-type lift frame having a lower end rotatably connected to the base, a tubular undercarriage rotatably and slidably connected to an upper end of the frame, a foldable rigid support positionable over the undercarriage, a soft, foldable cushion positionable over the support and connected thereto to prevent disassociation therefrom, and first and second side-arm supports rotatably connected to the undercarriage. The lift frame includes left and right side assemblies, each side assembly having a fixed-length leg member and a telescoping variable-length leg member, both of which are rotatably connected to the base, and rotatably and/or slidably connected to the undercarriage. The leg members of each side assembly are connected to one another at their respective mid-sections by a joint, and are rotatable with respect to one another along an axis of the joint, which is offset from the member's central axes.

Abstract: The optical sensor (305,306) comprises a trapezoidal light guide (34, 104), a broadband light source (350) fo illuminating a banknote via the light guide (34, 104) and sensors (351, 352, 353) for detecting light reflected from the banknote via the light guide (34, 104). Filters (354, 355, 356) are arranged in front of the sensors (351, 352, 353). The light guide (34,104) is inclined relative to the banknote path (6).

Abstract: A side-entry specimen holder for transmission electron microscopy is provided. The specimen holder is capable of rotating a specimen and tilting it in two axes. The specimen, when mounted in the holder, can be tilted in the plus/minus direction of the X-axis, the plus/minus direction of the Y-axis, and simultaneously have the ability of 360° rotation in the axis of the electron beam to permit alignment of microstructural features of the specimen for optimal viewing and analysis.

Abstract: A spring element used in a temporary package for testing semiconductors is provided. The spring element is compressed so as to press the semiconductor, either in the form of a bare semiconductor die or as part of a package, against an interconnect structure. The spring element is configured so that it provides sufficient pressure to keep the contacts on the semiconductor in electrical contact with the interconnect structure. Material is added and/or removed from the spring element so that it has the desired modulus of elasticity. The shape of the spring element may also be varied to change the modulus of elasticity, the spring constant, and the force transfer capabilities of the spring element.

Abstract: A business form or mailer intermediate providing fold-over carbonless imaging is provided. The form or mailer includes separate CB and CF coating portions on a single sheet. When the form or mailer is folded about a fold line, the CB portion comes in contact with the CF portion. An image is created when the fold-over carbonless area is subjected to an imaging force.