Patents Represented by Attorney, Agent or Law Firm Konrad Kaeding
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Patent number: 7476489Abstract: The invention relates to low-temperature curable photosensitive compositions containing a polyamic acid, which compositions are developable in aqueous alkaline solutions and are curable, at a temperature of at least 160° C. and up to 200° C., to low modulus polyimides suitable for use in electronic circuitry applications, and which are particularly suitable for use in flexible circuit applications where low curl, low temperature curing, and good adhesion is a significant advantage.Type: GrantFiled: November 10, 2005Date of Patent: January 13, 2009Assignee: E.I. DuPont de NemoursInventors: Thomas E. Dueber, Michael W. J. West, Kuppusamy Kanakarajan, Brian C. Auman
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Patent number: 6860802Abstract: An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness. The pad exhibits a stable morphology that can be reproduced easily and consistently. The pad surface resists glazing, thereby requiring less frequent and less aggressive conditioning.Type: GrantFiled: June 30, 2000Date of Patent: March 1, 2005Assignee: Rohm and Haas Electric Materials CMP Holdings, Inc.Inventors: Arun Vishwanathan, David B. James, Lee Melbourne Cook, Peter A. Burke, David Shidner
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Patent number: 6749485Abstract: An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness and hydrolytic stability.Type: GrantFiled: September 20, 2000Date of Patent: June 15, 2004Assignee: Rodel Holdings, Inc.Inventors: David B. James, Arun Vishwanathan, Lee Melbourne Cook, Peter A. Burke, David Shidner, Joseph K. So, John V. H. Roberts
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Patent number: 6739962Abstract: Polishing pads are provided having a polishing surface formed from a material. The polishing surface has a topography produced by a thermoforming process. The topography consists of large and small features that facilitate the flow of polishing fluid and facilitate smoothing and planarizing.Type: GrantFiled: May 1, 2002Date of Patent: May 25, 2004Assignee: Rodel Holdings, Inc.Inventors: John V. H. Roberts, David B. James, Lee Melbourne Cook, Charles W. Jenkins
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Patent number: 6736709Abstract: An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing, pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness. The pad also exhibits a stable morphology that can be reproduced easily and consistently. The pad surface has macro-texture that includes perforations as well as surface groove designs The surface groove designs have specific relationships between groove depth and overall pad thickness and groove.area and land area.Type: GrantFiled: August 3, 2000Date of Patent: May 18, 2004Assignee: Rodel Holdings, Inc.Inventors: David B. James, Arun Vishwanathan, Lee Melbourne Cook, Peter A. Burke, David Shidner, Joseph K. So, John V. H. Roberts
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Patent number: 6582283Abstract: An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness. The pad exhibits a stable morphology that can be reproduced easily and consistently. The pad surface resists glazing, thereby requiring less frequent and less aggressive conditioning.Type: GrantFiled: July 11, 2002Date of Patent: June 24, 2003Assignee: Rodel Holdings, Inc.Inventors: David B. James, Arun Vishwanathan, Lee Melbourne Cook, Peter A. Burke, David Shidner
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Patent number: 6488570Abstract: A method of making a polishing pad composition comprising a high modulus phase component and a low modulus phase component, and a method of polishing a semiconductor substrate by creating nanoasperities at a polishing interface between the polishing layer and the wafer during polishing by providing the high modulus phase component at the polishing interface, either as protrusions from the polishing layer, or by being released from the polishing layer into the polishing interface.Type: GrantFiled: September 20, 2000Date of Patent: December 3, 2002Assignee: Rodel Holdings Inc.Inventors: David B. James, William D. Budinger, John V. H. Roberts, Michael R. Oliver, Nina G. Chechik, Richard M. Levering, Jr., Lee Melbourne Cook
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Patent number: 6464741Abstract: A method of making a slurry, by mixing a quantity of water with dissolvable constituents of an aqueous slurry used for polishing, with the dissolvable constituents being apportioned according to their desired per cent concentrations thereof in the aqueous slurry, and drying the mixture to obtain a reconstitutable slurry having solids of the dissolvable constituents.Type: GrantFiled: February 21, 2002Date of Patent: October 15, 2002Assignee: Rodel Holdings Inc.Inventor: Paul J. Yancey
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Patent number: 6464576Abstract: A stacked polishing pad includes an upper polishing layer and a lower sub-layer having major faces which are in contact with each other. The polishing layer is substantially impermeable to liquid while the sub-layer is liquid absorbent. The sub-layer has an outer peripheral edge which is sealed to prevent absorption of liquid into the sub-layer through the outer peripheral edge. When the stacked polishing pad is mounted on a platen of a polishing machine, the sub-layer has no exposed surface which can absorb liquid.Type: GrantFiled: August 10, 2000Date of Patent: October 15, 2002Assignee: Rodel Holdings Inc.Inventors: Peter W. Freeman, Marco A. Acevedo, Jon D. Jacobs, Jr.
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Patent number: 6454634Abstract: An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness. The pad exhibits a stable morphology that can be reproduced easily and consistently. The pad surface resists glazing, thereby requiring less frequent and less aggressive conditioning.Type: GrantFiled: August 3, 2000Date of Patent: September 24, 2002Assignee: Rodel Holdings Inc.Inventors: David B. James, Arun Vishwanathan, Lee Melbourne Cook, Peter A. Burke, David Shidner
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Patent number: 6454633Abstract: A polishing pad is provided which is comprised of vertically oriented hollow fibers. Such pads can be produced by electrostatically flocking fibers onto a substrate.Type: GrantFiled: June 22, 2000Date of Patent: September 24, 2002Assignee: Rodel Holdings Inc.Inventors: Heinz F. Reinhardt, Elmer W. Jensen, Jr.
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Patent number: 6447373Abstract: A slurry for use in chemical-mechanical polishing of a metal layer comprising particles dispersed in an aqueous medium. The slurry particles will tend to agglomerate when the slurry is at rest and will de-agglomerate with simple stirring. Such metastable slurry systems have been found to be particularly advantageous for metal polishing, particularly the polishing of metal layers during the manufacture of semiconductor devices.Type: GrantFiled: June 21, 2000Date of Patent: September 10, 2002Assignee: Rodel Holdings Inc.Inventors: Craig D. Lack, Qiuliang Luo, Qianqiu (Christine) Ye, Vikas Sachan, Terence M. Thomas, Peter A. Burke
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Patent number: 6447375Abstract: A polishing method uses a dry particulate solids composition that is reconstituted into an aqueous composition for delivery to a polishing apparatus. In one aspect of the invention, the dry particulate solids composition is provided in a package size that is just substantially sufficient to make a reconstituted slurry for completing the polishing of a predetermined number of work pieces. The quantity of dry particulate solids delivered to a reconstitution apparatus can be an amount appropriate for polishing one work piece or a small number of work pieces, or the system can operate in larger batches or a continuous flow mode. The reconstituted aqueous polishing solution can be monitored for physical or chemical properties, filtered, blended with other chemical mixtures, or modified in other ways prior to being used in the polishing apparatus.Type: GrantFiled: April 18, 2001Date of Patent: September 10, 2002Assignee: Rodel Holdings Inc.Inventors: Paul J. Yancey, Robert L. Rhoades
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Patent number: 6443812Abstract: A composition is provided which is useful for the polishing of a semiconductor wafer substrate comprising an organic polymer having a backbone comprised of at least 16 carbon atoms, the polymer having a plurality of moieties with affinity to surface groups on the semiconductor wafer surface. Another composition is provided which is useful for the polishing of a semiconductor wafer substrate comprising a surfactant having a carbon chain backbone comprised of at least 16 carbon atoms.Type: GrantFiled: August 8, 2000Date of Patent: September 3, 2002Assignee: Rodel Holdings Inc.Inventors: Wesley D. Costas, James Shen
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Patent number: 6439989Abstract: An article or polishing pad for altering a surface of a workpiece includes a polymeric matrix having a work surface and a subsurface proximate to the work surface. When the article is in contact with a working environment, the work surface is made relatively softer than the subsurface as a result of exposure to the working environment. As the work surface wears during use, the subsurface immediately adjacent to the work surface becomes exposed to the working environment and becomes the relatively softer work surface. As a result, the relatively softer work surface is continuously regenerated. In an alternative embodiment, an article for altering a surface of a workpiece includes a work surface having a texture, and the texture includes artifacts arranged in a fractal pattern.Type: GrantFiled: August 4, 1999Date of Patent: August 27, 2002Assignee: Rodel Holdings Inc.Inventors: Heinz F. Reinhardt, John V. H. Roberts, Harry George McClain, William D. Budinger, Elmer William Jensen
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Patent number: 6428586Abstract: Manufacture of a polishing pad for polishing a semiconductor substrate, involves, transporting a backing layer to successive manufacturing stations, supplying a fluid phase polymer composition onto the transported backing layer, shaping the fluid phase polymer composition into a surface layer having a measured thickness, and curing the polymer composition on the transported backing layer in a curing oven to convert the liquid phase polymer composition to a solid phase polishing layer attached to the transported backing layer.Type: GrantFiled: December 11, 2000Date of Patent: August 6, 2002Assignee: Rodel Holdings Inc.Inventor: Paul J. Yancey
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Patent number: 6425816Abstract: Polishing pads are provided having a polishing surface formed from a material. The polishing surface has a topography produced by a thermoforming process. The topography consists of large and small features that facilitate the flow of polishing fluid and facilitate smoothing and planarizing.Type: GrantFiled: May 22, 2001Date of Patent: July 30, 2002Assignee: Rodel Holdings Inc.Inventors: John V. H. Roberts, David B. James, Lee Melbourne Cook, Charles W. Jenkins
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Patent number: 6425803Abstract: A polishing pad is provided comprising an upper surface and a lower surface, substantially parallel to one another, wherein the pad has enhanced flexibility produced by scoring of either or both surfaces. The pad thickness is generally greater than 500 &mgr;. The scoring creates slits having a depth of less than 90% of the thickness.Type: GrantFiled: May 17, 2000Date of Patent: July 30, 2002Assignee: Rodel Holdings Inc.Inventor: Arthur Richard Baker, III
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Patent number: 6419553Abstract: The present invention relates to methods for break-in and conditioning polishing pads containing a fixed abrasive matrix. The polishing pads are useful for chemical-mechanical polishing (CMP). The present invention also relates to a method of determining the wear rate of a fixed abrasive polishing pad.Type: GrantFiled: January 4, 2001Date of Patent: July 16, 2002Assignee: Rodel Holdings, Inc.Inventors: Vilas N. Koinkar, Reza Golzarian, Matthew VanHanehem, Qiuliang Luo, James Shen, Peter A. Burke
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Patent number: 6419556Abstract: A polishing pad for polishing hard surfaces such as glass and silicon wafers and a method of polishing using such a polishing pad.Type: GrantFiled: June 6, 2000Date of Patent: July 16, 2002Assignee: Rodel Holdings Inc.Inventors: Walter J. Urbanavage, Heinz F. Reinhardt