Patents Represented by Attorney, Agent or Law Firm Laff, Whitesel & Saret, Ltd.
  • Patent number: 6951892
    Abstract: A continuous output system makes paper coating by combining an emulsifier with ASA particles having a mean average size in the low to sub-micron region. A turbine, pump, blender or other device exposes the ASA to a number of repeated episodes of high shear until the resulting ASA is in the form of particles having a mean average diameter in approximately the 1? range. The measure of the amount of high shear is identified by an energy factor index. A system for cooling the ASA enables the processing without causing a hydrolyzing of the ASA, even when a heated cooked emulsion is used.
    Type: Grant
    Filed: January 5, 2001
    Date of Patent: October 4, 2005
    Assignee: Norchem Industries, Inc.
    Inventor: Dennis Pardikes
  • Patent number: 6447314
    Abstract: In order to prevent damage to an electroconductive member during an assembly process or when using electronic equipment, a hinge connector is constituted primarily by a main unit connector assembly to be connected to a connector of a computer main unit, an LCD connector assembly to which an FPC from an LCD is connected, and an electroconductive member to be installed in these connector assemblies. The electroconductive member is comprised of connections provided at both ends and a flexible portion located between the connections. The flexible portion has a plurality of slits that extend in a direction for connecting the connections so that the flexible portion is contractible in the foregoing direction.
    Type: Grant
    Filed: December 8, 1999
    Date of Patent: September 10, 2002
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Nobukazu Kato, Kazukuni Hisatomi, Kazuhito Hisamatsu, Kazuhiro Fujino
  • Patent number: 6437835
    Abstract: A system for transferring video data includes a difference detector for detecting the difference between a current field information and the preceding field information. The preceding information is obtained from an entered interlaced video signal. An interpolator generates current display frame information in response to an interpolation based upon the current filed information with regard to an area of the video signal in which there is a difference value between successive fields that exceeds a predetermined threshold value. The interframe difference between the current display frame information and preceding display frame information is detected by the difference detector. Only the interframe difference is transferred over a system bus to enable a frame display to be presented on non-interlacing display device.
    Type: Grant
    Filed: October 2, 1997
    Date of Patent: August 20, 2002
    Assignee: NEC Corporation
    Inventor: Susumu Sakamoto
  • Patent number: 6431910
    Abstract: Disclosed is a contact device adapted to be mounted on a heat-dissipating device for hot swap in a system. The contact device includes a main body having a resilient member protruding from one side thereof, a conductive member disposed in the main body for electrically connecting the heat-dissipating device and the system, and a first engaging member disposed on the resilient member for engaging with a second engaging member of the heat-dissipating device to allow the main body to be detachably mounted on the heat-dissipating device.
    Type: Grant
    Filed: February 11, 2000
    Date of Patent: August 13, 2002
    Assignee: Delta Electronics, Inc.
    Inventors: Te-Tsai Chuang, Kuo-Cheng Lin
  • Patent number: 6430092
    Abstract: When a /RAS (/row address strobe) signal is input to a memory device, a control logic of the memory device issues an internal /RAS signal corresponding to the /RAS signal and then a row decoder drives a selected wordline in response to the internal /RAS signal. A predetermined time internal passes from the issuance of the internal /RAS signal to the drive of the selected wordline, depending upon a circuit layout of the memory device, skew and so forth. The predetermined time interval is utilized for a time of pre-booting at a booting circuit.
    Type: Grant
    Filed: April 13, 2001
    Date of Patent: August 6, 2002
    Assignee: NEC Corporation
    Inventor: Yasuhiro Nanba
  • Patent number: 6421207
    Abstract: In a contact type magnetic disk drive, a suspension spring or a load beam spring has a length smaller than 5 mm inclusive. This successfully reduces the amplitude of vibration to occur during seek. Also, a magnetic head slider has a mass of greater than 2 mg inclusive and is urged against the disk medium by a load of less than 1 g inclusive, so that a mean wear thickness and maximum amount of jump are reduced. For the reduction of the mean wear thickness and maximum amount of jump, the disk medium may include a lubrication layer having a thickness of greater than 5 nm inclusive, or the suspension spring or the load beam spring may have its thickness sequentially reduced from the side adjoining the spring support mechanism toward the slider. The disk drive reduces the wear of the slider and that of a magnetic disk, and achieves durability and reliability as well as high-density recording.
    Type: Grant
    Filed: December 19, 1996
    Date of Patent: July 16, 2002
    Assignee: NEC Corporation
    Inventor: Akinobu Sato
  • Patent number: 6403252
    Abstract: An improved battery pack is disclosed. The improved battery pack is designed in light, thin, safe, and user-friendly card configuration to make interchangeability between appliances easy and possible. In addition, outside the battery card there is an injection mechanism that fits the battery card in electrical apparatus when slot-in and inject-out, and inside the battery card there is a built-in fuel gauge circuit that regulates voltage with a capacity indicator.
    Type: Grant
    Filed: July 14, 1999
    Date of Patent: June 11, 2002
    Inventors: Cyril C. K. Chiang, Min Hon Rei
  • Patent number: 6399449
    Abstract: In order to isolate a plurality of MOS and bipolar devices provided on the same chip, a plurality of first and second trenches are provided on a semiconductor substrate. Each of the first trenches is filled with silicon oxide containing no impurity and is used to isolate the MOS devices. On the other hand, the second trenches are formed within the first trenches. Each second trench is filled silicon oxide containing phosphorous and boron and is used to isolate the bipolar devices. The inner surface of each second trench is coated with a silicon nitride film for preventing boron (or phosphorous) from being diffused into the surrounding region.
    Type: Grant
    Filed: October 22, 1999
    Date of Patent: June 4, 2002
    Assignee: NEC Corporation
    Inventor: Naoya Matsumoto
  • Patent number: 6398598
    Abstract: In an electrical connector having at least one contact (2) held in at least one contact accommodating groove (3a) formed in an insulator (3), the contact (2) comprises a base portion (21) press-fitted in the contact accommodating groove (3a), a contact portion (22) projecting (2a) from the contact accommodating groove (3a) upward, and a U-shape spring portion (2b) connecting the base portion (21) and the contact portion (22). The contact accommodating groove (3a) comprises a relatively large width section (3a-1) adjacent to the end wall (3e) and a relatively small width section (3a-2) adjacent to the open end. Opposite side walls at the relatively small width section (3a-2) are formed with press-fit grooves (3d) adjacent to the bottom wall (3c). The base portion (21) of the contact (2) is formed with lateral projections (2c) laterally projecting from the opposite sides of the base portion (21), and the lateral projections (2c) are press-fit in the press-fit grooves (3d) respectively.
    Type: Grant
    Filed: August 9, 2001
    Date of Patent: June 4, 2002
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Toshio Masumoto
  • Patent number: 6371778
    Abstract: A connector assembly (11) includes a connector element (21) for being connected to an counterpart connector (51) in a first direction and a manipulation mechanism (14) for manipulating the connection between the connector element and the counterpart connector. The manipulation mechanism includes a gear member (41) rotatably supported by the connector element and a lever member (45) engaged with the gear member in a rotating direction. The gear member has a gear section as an engaging arrangement for engaging with the counterpart connector in the first direction.
    Type: Grant
    Filed: May 17, 2001
    Date of Patent: April 16, 2002
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Masashi Watanabe
  • Patent number: 6371789
    Abstract: In a connector provided with a locking member (29) for locking a connection state between a connector (12) and a connection object (11), the locking member is assembled in an assembling portion (31) of a housing member (27) of the connector. The locking member has an engaging portion (29-1) at its one end, an operating portion (29-3) at the other end, and a pivot portion formed at a particular position between the engaging portion and the operating portion. The pivot portion has a first pivot (29-5) protruding on the side of one surface and a second pivot (29-6) protruding on the side of the other surface. The assembling portion has a pivot bearing portion (35) rotatably clamping the first and the second pivots. The engaging portion is engaged the connection object. The an operating portion is for receiving operation force. The housing member holds a contact member (25).
    Type: Grant
    Filed: September 25, 2000
    Date of Patent: April 16, 2002
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Yukiko Sato, Yosuke Saito, Ryusuke Murayama
  • Patent number: 6365963
    Abstract: A stacked-chip semiconductor device includes a rigid insulator board having therein a central opening and thereon a wiring pattern, and a base insulator bonded to the rigid insulator board and having a wiring pattern. Both the wiring patterns are connected together via through-holes formed in the rigid insulator board. A first semiconductor chip is mounted on the base insulator film within the opening of the rigid insulator board, whereas a second semiconductor chip is mounted on the rigid insulator board overlying the opening.
    Type: Grant
    Filed: August 25, 2000
    Date of Patent: April 2, 2002
    Assignee: NEC Corporation
    Inventor: Toshiyasu Shimada
  • Patent number: 6361122
    Abstract: In a pedal assembly for a brake-by-wire vehicle braking system, feedback reaction means (10) is provided so that feedback to the driver through the pedal (3) provides comfortable feel, similar to the pedal feel achieved in a conventional hydraulic braking system fitted to a non-EBS equipped vehicle. The feedback reaction means may comprise a two-rate spring assembly (24, 26) or a variable rate spring assembly, in combination with a damper (40).
    Type: Grant
    Filed: April 23, 1997
    Date of Patent: March 26, 2002
    Assignee: Lucas Industries public limited company
    Inventors: Robert Alan Anderson, Stephen Donald Crisp, Barry John Bridgens, Michael James Ayres
  • Patent number: 6341134
    Abstract: A system and a process arranges equitable-loss data packets in a high-volume asynchronous transfer mode (ATM) system and establishes the output order of the packets. There are a plurality of inflowing data packet streams, a minimum quantity ri of each incoming flow being reserved. At all times, there is a ratio K(t) between two parts of each incoming data packet flow. One part is a quantity of packets &Dgr;xi(t) allocated above the minimum reserve quantity ri. The other part ei(t) is an instantaneous quantity &Dgr;xi(t) above the minimum reserve quantity ri.
    Type: Grant
    Filed: March 4, 1998
    Date of Patent: January 22, 2002
    Assignee: France Telecom SA
    Inventors: Francois Toutain, Maher Hamdi, Pierre Rolin
  • Patent number: D451884
    Type: Grant
    Filed: July 24, 2000
    Date of Patent: December 11, 2001
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Kazukuni Hisatomi, Masayuki Kikuchi, Kazuhito Hisamatsu
  • Patent number: D451948
    Type: Grant
    Filed: January 3, 2001
    Date of Patent: December 11, 2001
    Assignee: Primax Electronics
    Inventors: Chang-Chih Wu, Kris Verstockt
  • Patent number: D452370
    Type: Grant
    Filed: May 15, 2000
    Date of Patent: December 25, 2001
    Assignee: Giochi Preziosi S.p.A.
    Inventor: Gaetano La Greca
  • Patent number: D452680
    Type: Grant
    Filed: May 9, 2001
    Date of Patent: January 1, 2002
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Yoshifumi Kubota
  • Patent number: D455400
    Type: Grant
    Filed: July 24, 2000
    Date of Patent: April 9, 2002
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Kazukuni Hisatomi, Masayuki Kikuchi, Kazuhito Hisamatsu
  • Patent number: D459702
    Type: Grant
    Filed: June 26, 2001
    Date of Patent: July 2, 2002
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Masashi Watanabe