Abstract: Disclosed is a technique for providing solder bumps to electronic components, such as silicon chips, chip carriers, and circuit boards, so as to achieve large stand-off heights. The component is covered with a mask, such as a photoresist, leaving exposed the solder pads on the component. Solder is applied to the surface along with ultrasonic energy so that the solder wets the exposed pads. The mask acts as a mold for the solder, thereby producing large solder bump heights.

Abstract: Disclosed is an optical package including at least one electro-optical component aligned with at least one optical fiber. The electro-optical component is mounted on a surface which is essentially parallel to, but not coplanar with, the longitudinal axis of the fiber and light is coupled between the fiber and component by bending the light path. Electrical connection to the component is provided by conductors mounted over the same surface, thus producing a compact package. The invention is used preferably with arrays of components and fibers to eliminate the need for a vertical fanout to contact the components.

Abstract: Disclosed is a device including a surface coating for passivation or anti-reflection, and a method of manufacture. The coating comprises ZrO.sub.2 doped with yttrium, magnesium or calcium. The doped ZrO.sub.2 is preferably deposited on the device surface by electron-beam evaporation from a single crystal source of ZrO.sub.2 and Y.sub.2 O.sub.3, MgO or CaO.

Abstract: Disclosed is a method for laminating multilayer structures with nonplanar surfaces such as structures which include cavity (20) formed therein. A conformal material (32), a release material (31), and an optional template (36) are provided over the structure prior to the lamination bonding operation. The conformal and release materials then fill the cavity during the bonding operation to prevent flow of adhesive (25 and 26) from between the layers into the cavity, and the template redistributes cavity edge stresses to minimize wire bonding pad deflections. The materials can then be removed for further processing of the multilayer structure.

Abstract: An AC plasma display with enhanced resolution is disclosed. The display includes at least three electrodes per pel with at least one electrode electrically connected in common with other electrodes for the purpose of providing common sustain signals to the pels. The common electrodes are divided into at least two interleaved sets so that adjacent vertical pels can be separately biased during the sustain phase. In accordance with one embodiment of the invention, sustain signals are applied in two phases alternatively to the sets of common electrodes. In accordance with another embodiment of the invention, the sustain signals are applied to both sets simultaneously, but with an opposite polarity.

Abstract: Disclosed is a method of forming strong bonds between gold spheres and contact pads on semiconductor devices and the resulting product. The spheres are formed by establishing ball bonds with wire bonding techniques and then severing the wire. The wire material is a gold alloy including palladium which forms a weakened portion above the ball bond so that the wire can be easily broken off.

Abstract: A bidirectional fiber optic system is described in which at one terminal the output radiation of a light source (LED or semiconductor laser) is coupled through a small diameter hole in the active area of a photodiode into the core of a larger diameter transmission fiber. On the other hand, radiation propagating through the fiber in the opposite direction exits from the fiber with a large numerical aperture so that most of it is incident on the active area of the photodiode and little is lost through the hole. Also described are a number of photodiode configurations for use in such a system, as well as dual photodiodes to perform both signal detection and output monitoring functions. Further described are fiber optic sensing systems for monitoring such variables as blood pressure.

Abstract: Disclosed is an assembly for hermetically sealing lightwave component packages and aligning optical fibers. The fiber is fed through a tube and soldered at one end. The tube is inserted through a flange which is attached to the component package housing and which includes a threaded outside surface. A ring comprising a suitable material, such as gold, is provided between the end of the flange and a stop portion around the outside of the tube. A cap with a threaded portion is inserted over the stop and screwed onto the flange so that the pressure from the cap and restraint from the flange on the gold ring form an hermetic seal.

Abstract: Disclosed is a device which in one aspect effects a continuous realignment of the optical fiber in transmitters, receivers, or transceivers after the lightwave package is assembled and in use, and in another aspect provides movement of optical fibers or other small elements for general applications. In one embodiment, the fiber is mechanically coupled to a piezoelectric crystal which expands and contracts in response to electrical pulses supplied to electrodes on the crystal. Clamping and releasing the ends of the crystal by magnetic or electrostatic forces result in movement of the fiber in incremental steps to its aligned position.

Abstract: A CMOS structure and method of manufacture are disclosed for achieving a high packing density in integrated circuits. Each device includes at least one high concentration surface region, (18 and 20) and at least one lower concentration background region (15 and 17) which permit the devices to be made close together. The devices can be fabricated with a single mask by using a lift-off technique in accordance with the method of the invention.

Abstract: A nondestructive method is proposed for measuring stripe dimensions in order to grade light-emitting structures such as lasers. The width of the near-field emission parallel to the stripe is measured while the laser is operating below threshold. This measurement is correlated with the actual stripe width and with the possibility of kinks developing in the light output. The width of the far-field emission perpendicular to the junction plane can also be measured, and the product of the two widths can be correlated with the stripe area and the possibility of kinks in the laser output.

Abstract: Disclosed is a method and resulting package which provide an optical fiber seal. One or more fibers are fed through a housing utilizing an apertured insert with a fiber located in each aperture. The housing preferably includes adjacent openings having unequal diameters. A sealing material, such as epoxy is deposited in the larger opening, and/or in the apertures, and the insert is pushed into that opening. The sealing material is thereby forced through the small opening and also into the apertures of the insert to seal the fibers.

Abstract: Proposed is a method of fabricating III-V and II-VI compound semiconductors and a resulting product where there is formed on the surface a coating which can function as a diffusion mask and/or a passivation layer. The coating is a silicon layer deposited by a method which does not damage the semiconductor surface.

Abstract: An optical coupling device for diverting light among different transmission elements. The device includes at least one graded-index-of-refraction lens with transmission elements coupled to one surface. At the opposite surface of the lens is a reflecting element which is adapted for movement so as to vary the angle of reflection of the incoming light from one of the transmission elements.

Abstract: A method and apparatus are disclosed for tracking the position of surfaces during certain processing such as optical projection printing. Light from a line or point source is made incident on the surface at a small angle to produce interference fringes between the reflected light and a reference beam. Any movement of the surface causes a shifting of the fringe pattern which can be detected by appropriate means such as a slit or grating and photodiode combination.

Abstract: A variable gap device which comprises a suitable material with a cavity formed therein mounted over a body. Elements are formed on the surface of the body and on the top surface of the cavity. In one embodiment, the elements are electrodes of a variable capacitance device, and in another embodiment the elements are partial or total reflectors of incident light from an optical fiber. The surface of the cavity opposite the body is preferably flat and of the order of microns from the body.The device is fabricated by forming a removable layer over a temporary substrate. An appropriate element pattern is formed over the removable layer and the layer is etched in a configuration which will define the cavity. The deformable material is encapsulated over this structure and then removed from the substrate with the element remaining in the cavity. Any removable material remaining in the cavity can then be etched away.

Abstract: The specification describes an integrated circuit package with a lead frame that incorporates crossunder members for power distribution. It uses a paddle member for chip support and back plane contact, with crossunders extending alongside the paddle. Insulating means is interposed between the chip and the lead frame with an opening to allow contact from the chip to the paddle.

Abstract: A packaging scheme for apparatus including integrated optical components, such as transmitters, receivers and transceivers. The components are provided in the form of semiconductor chips bonded to a substrate such as ceramic. A glass cover which includes a light transmission path is mounted over the chips. Connectors to optical fibers are formed by molding a material over the substrate and cover. Alignment is effected by use of etched grooves in the cover which are matched to ridges in the mold.

Abstract: A column of flat articles such as chip carrier lids (10) are assembled in a tube (35). A base (18) supports a typical row of such lids (10), each with a back surface (14) on the base (18) and a mating surface (15) facing upward. The base (18) also has an aperture (30) for passing serially downward therethrough, each lid (10) with its back surface (14) facing downward. A bracket (32) having a spring biased pin (34) and a block (38) is provided to support under the base (18) a tube (35) with an open end facing upward at the aperture (30). Plates (22, 23 and 24) are provided to guide to and introduce a lid (10) into the aperture (30) and onto any contents within the tube (35). A frictional plug (45) has fins (46) biased between opposing walls of the tube (35) to yieldably resist downward movement within the tube (35).

Abstract: A contact structure and method of bonding III-V semiconductors which prevents shorting of the edges of the semiconductor chip and also allows the chip to be bonded with either major surface facing upward. Both surfaces include a gold pad surrounded by a material which is immiscible with the preform metal used to bond the chip to an outside surface. During fluxless bonding between the gold pad on one surface of the chip and the preform, the preform metal is prevented from wetting the edges of the chip. The opposite surface of the chip can be electrically contacted by wire bonding to the gold pad on that surface.