Abstract: Automatic transmission of information is generated when the content of a posted electronic form matches a predefined criteria. An interface allows the user to create a criterion template to specify the match criterion without requiring the user to have the skills of a professional programmer. The person to be notified and the form and content of the notification can also be defined by the user and can be dependent on the content of the posted form. In one application, individuals associated with an institution of higher learning are automatically notified when a student submits an electronic profile form showing that the student meets a pre-specified criteria.

Abstract: A system including co-axial focused ion beam and an electron beam allows for accurate processing with the FIB using images formed by the electron beam. In one embodiment, a deflector deflects the electron beam onto the axis of the ion beam and deflects secondary particles collected through the final lens toward a detector. In one embodiment, a positively biased final electrostatic lens focuses both beams using the same voltage to allow simultaneous or alternating FIB and SEM operation. In one embodiment, the landing energy of the electrons can be varied without changing the working distance.

Abstract: A graphical programming system allows a user to place geometric shapes onto a scaled image, the shape having associated behavior that operates on the image or on the object of which the image is formed. In a preferred embodiment, the shapes are objects in the Visio program by Microsoft Corporation. The shapes are dragged from a stencil onto an image provided by ion beam or electron microscope image. The shape invokes software or hardware to locate and measure features on the image or to perform operations, such as ion beam milling, on the object that is imaged.

Abstract: A method of improving focused ion beam milling particularly suitable for uniformly removing multiple layers of conductor and dielectric, such as the removal of multiple layers consisting of dummy copper pads and SiO2 on a semiconductor device. Variable Pixel Milling is first used to more uniformly remove most of a layer of conductor and dielectric. The use of Variable Pixel Milling may also be used in conjunction with a technique whereby incoming ions pass through a sacrificial layer formed on the surface of the layer being removed in order to further increase uniformity of material removal. Focused ion beam sputtering in conjunction with an oxygen containing gas, such as H2O vapor or oxygen, is then used to smooth out the trench floor before the next layer is removed.

Abstract: In one embodiment of the present invention, a magnetic lens is provided that can generate a substantially constant amount of average heat power over a pre-selected range of resultant magnetic field strengths. The lens is configured to do this with multiple, asymmetric (different turns) coil sections that can produce a desired range of field strengths, and at the same time, maintain a sufficiently constant temperature signature when the average total power is maintained constant thereby eliminating unreasonable delays in lens operation when the resultant field strength is changed. The asymmetric lens structure allows for the smaller coil to be made with less relative inductance thereby making it more responsive and amenable for an AC drive signal and thus dynamic focusing applications if desired.

Abstract: A fluid flow monitoring, evaluation, and control system providing accurate dispensing of fluids in low volume, high pressure systems. The system includes one or more fluid flow sensors mounted on positive displacement dispensing valves and a processor that receives cycle signals from the fluid flow sensors to determine fluid flow information. If the fluid flow is not within specified limits, a signal is sent to a pump control device to adjust the pump to return the fluid flow to desired level. A dispensing valve can include a display to show cycle time or other fluid flow measurement. The system can include dispensing valves having single inputs and single outputs for measuring fluid dispensed at a point of use, which measurement can be compared to measurements taken at a divider block earlier in the hydraulic path to verify that fluid sent into the path was actually dispensed.

Abstract: A system for obtaining an image of a cross-sectional surface of a workpiece includes a shaped beam ion projection column oriented along a first axis. The ion projection column projects an image of an aperture on the workpiece surface, thereby excavating a portion of the surface and exposing a cross-sectional surface. Because the ion beam is not focused on the surface, a low brightness ion source can be used. A focused particle beam column, typically a scanning electron microscope, is oriented along a second axis that intersects the first axis at a selected angle. This focused particle beam column generates a particle beam that is used to image the cross-sectional surface exposed by the ion projection column.

Abstract: The present invention provides a method for creating microscopic high resistivity structures on a target by directing a focused ion beam toward an impact point on the target and directing a precursor gas toward the impact point, the ion beam causing the precursor gas to decompose and thereby deposit a structure exhibiting high resistivity onto the target. The precursor gas preferably contains a first compound that would form a conductive layer and a second compound that would form an insulating layer if each of the first and second compounds were applied alone in the presence of the ion beam.

Abstract: A focused particle beam system, according to one embodiment of the invention, precisely shapes a pole-tip assembly formed by a multi-layer device having a first layer with a first structural element, a second layer with a second structural element, and a shielding layer with a shielding element, the shielding element being located between the first layer and the second layer. The system images a selected portion of the multi-layer device to locate the shielding element and thereby avoids irradiating the first structural element. Based on the location of the shielding element, the system images and mills the second structural element without irradiating the first structural element. In this manner, the focused particle beam system mills the second structural element to produce a desired pole-Up configuration. By producing a desired pole-tip configuration, these methods and apparatus produce a recording transducer capable of high storage density.

Abstract: A fluid flow monitoring and evaluation system providing high accuracy for fluid flow systems having low volumes and high pressure includes fluid flow sensors mounted on positive displacement dispensing valves and a fluid flow monitor that received cycle signals from the fluid flow sensors and processes the cycle signals to determine fluid flow information. Information can be downloaded in from the monitor, even in an explosion rated environment, using infra-red link or data can be transmitted, for example via satellite, for posting on the Internet. The system can include dispensing valves having single inputs and single outputs for measuring fluid dispensed at a point of use, which measurement can be compared to measurements taken at a divider block earlier in the hydraulic path to verify that fluid sent into the path was actually dispensed. A novel fluid flow sensor prevents loss of internal components, yet allows internal components to be removed for repair.

Abstract: A multi-gun FIB system for nanofabrication provides increased throughput at reduced cost while maintaining resolution. Multiple guns are maintained in modular gun chambers that can be vacuum isolated from the primary vacuum chamber containing the targets. A system can include multiple gun chambers, each of which van include multiple guns, with each gun chamber being capable of being vacuum isolated, so that each gun chamber can be removed and replaced without disturbing the vacuum in other gun chambers or in the main chamber. An optical column is associated with each gun. Optical elements for multiple columns can be formed in a bar that extends into several columns. Some of the optical elements are positioned in the gun chambers and others are positioned in the primary vacuum chamber. A through-the-lens secondary particle collection can be used in connection with each of the individual columns.

Abstract: The present invention comprises a method and apparatus for classifying edges for implementing mask corrections. In one embodiment, classifications are based upon proximity ranges bounded on one side only. Before classifying an edge in a first class based on a first proximity range, it is verified that the classification will produce a correction satisfying a minimum manufacturable length. If the prescribed correction for the first class does produce a correction satisfying the minimum manufacturable length, the edge is classified in a second class corresponding to a second proximity range to produce, in combination with an adjacent edge also in the second class, manufacturable correction. The number of mask corrections implemented in a mask design is thus increased while ensuring that all mask corrections meet guidelines for manufacturability and reducing required clean-up of nonmanufacturable corrections in the design.

Abstract: A charged particle beam system uses multiple electron columns to increase throughput. One or more multiple electron emitters are in one or more vacuum sealable gun chambers to allow the gun chamber to be replaced with electrons guns having emitters that have been previously conditioned so that the system does not need to be out of service to condition the newly installed emitters.

Abstract: An electron emitter is produced by applying a work function lowering material that does not require an extensive heating step before the material will function to lower the work function. By eliminating the extensive heating step, a small radius, highly tapered emitter tip will retain its shape to consistently produce a high angular intensity at a reasonable output power level.

Abstract: A low input power consumption, compact thermal field emitter is suitable for use in electron beam systems, particularly those systems that use an array of electron beams or a miniature electron beam system. The thermal field emitter design reduces heat loss by reducing heat transfer to the base. To achieve reduced loses the design incorporates the use of high electrical resistivity, low thermal conductivity materials for construction of the filament posts and the filaments. Such materials further reduce heat loss and reduce input current requirements. In one embodiment, the base includes counterbores that reduce the heat conduction path between the filament posts and the base, and moves the contact area further from the filament.

Abstract: Methods and apparatus for calibration of a scanned beam system are provided by sampling a calibration specimen containing an array of targets with a spacing between samples that is greater than the spacing between targets in the array and forming an image from the samples to reduce calibration specimen degradation and to magnify calibration errors to enable very fine calibration of the scanned beam system.

Abstract: A method and apparatus for electron beam processing using an electron beam activated gas to etch or deposit material. The invention is particularly suitable for repairing defects in lithography masks. By using an electron beam in place of an ion beam, the many problems associated with ion beam mask repair, such as staining and riverbedding, are eliminated. Endpoint detection is not critical because the electron beam and gas will not etch the substrate. In one embodiment, xenon difluoride gas is activated by the electron beam to etch a tungsten, tantalum nitride, or molybdenum silicide film on a transmission or reflection mask. To prevent spontaneous etching by the etchant gas in processed sites at which the passivation layer was removed, processed sites can be re-passivated before processing additional sites.

Abstract: A system for obtaining an image of a cross-sectional surface of a workpiece includes a shaped beam ion projection column oriented along a first axis. The ion projection column projects an image of an aperture on the workpiece surface, thereby excavating a portion of the surface and exposing a cross-sectional surface. Because the ion beam is not focused on the surface, a low brightness ion source can be used. A focused particle beam column, typically a scanning electron microscope, is oriented along a second axis that intersects the first axis at a selected angle. This focused particle beam column generates a particle beam that is used to image the cross-sectional surface exposed by the ion projection column.

Abstract: A method of repairing opaque defects in lithography masks entails focused ion beam milling in at least two steps. The first step uses a large pixel spacing to form multiple holes in the defect material, with the milled area extending short of the defect material edge. The final step uses a pixel spacing sufficiently close to produce a smooth floor on the milled area, and extends to the edge of the defect. During the second step, an etch enhancing gas such as bromine is preferably used.

Abstract: A portion of an ion optical column is formed using a dielectric bushing to support metallic optical elements, electrically isolate them, and form a vacuum chamber around those elements. In particular, the dielectric bushing is suitable for forming an ion gun vacuum chamber in which are contained an emitter assembly and other optical elements, the gun vacuum chamber preferably being vacuum sealable separately from the system vacuum chamber. A compact ion column includes, within the system vacuum chamber, an automated variable aperture drive mechanism and a gun chamber vacuum isolation valve activation mechanism. Including these mechanisms within the vacuum chamber facilitates the design of multi-beam systems by eliminating mechanical feedthroughs that would interfere with the placement of other components in the vacuum chamber.