Abstract: A sense margin is improved for a read path in a memory array. Embodiments improve the sense margin by using gates with a lower threshold voltage in a read column multiplexer. A cross coupled keeper can further improve the sense margin by increasing a voltage level on a bit line storing a high value, thereby counteracting leakage on the “high” bit line.

Abstract: A method to reduce electrostatic discharge susceptibility when assembling a stacked IC device. The method includes coupling a ground plane of a first semiconductor device and a ground plane of a second semiconductor device to substantially a same electrical potential. Active circuitry on the first semiconductor device and active circuitry on the second semiconductor device are electrically coupled after the ground planes are coupled. Electrically coupling the ground planes of the first and the second semiconductor device creates a preferred electrostatic discharge path to ground, thus minimizing potential damage to sensitive circuit elements.

Abstract: A first I/O pad has a first type transistor disposed at a first end of the first I/O pad. A second I/O pad has another first type transistor disposed at a first end of the second I/O pad. The first end of the first I/O pad abuts the first end of the second I/O pad, so the first type transistor is adjacent to the other first type transistor.

Abstract: Methods and apparatus for establishing communication links, used to support communications sessions with one or more end nodes, e.g., mobile devices, are described. Various features are directed to a mobile node controlling the establishment of initial links to a first access node and the establishment of new links from a first access node to a second access node during a handoff operation using highly efficient messages and signal.

Abstract: Methods and apparatus for compressing messages used to support mobile communications are described. After transmission of a first mobile IP message which may be a conventional mobile IP message, a compressed mobile IP message is transmitted. The compressed message includes a new “compressed message” indicator and information which is to replace information in the previous message or to be added to the previous message to construct a new message. In some embodiments, the compressed message includes a mask field, e.g., a sequence of bits, each bit corresponding to one field of a standard registration request message or binding update message. If the mask flag bit corresponding to a field is set, it indicates that the compressed message includes information to replace the content in the corresponding field of the previous message or to be added to the previous message as a field corresponding to the asserted bit.

Abstract: A system and method for a time-scalable priority-based scheduler. A flexible scheduling algorithm utilizing variable scheduling durations enables better system capacity utilization. A rate request is transmitted if data arrives in a buffer, data in the buffer exceeds a buffer depth, and sufficient power exists to transmit at the rate requested. A rate assignment responsive to the rate request indicates a scheduled duration and a scheduled rate applicable for the scheduled duration. The scheduled duration is less than or equal to a scheduling period. The scheduling period is an interval of time and after which a scheduler makes a scheduling decision. The scheduling period is variable and the scheduled duration is variable.

Abstract: Systems, circuits and methods for controlling the word line voltage applied to word line transistors in Spin Transfer Torque Magnetoresistive Random Access Memory (STT-MRAM) are disclosed. One embodiment is directed to a STT-MRAM including a bit cell having a magnetic tunnel junction (MTJ) and a word line transistor. The bit cell is coupled to a bit line and a source line. A word line driver is coupled to a gate of the word line transistor. A write-back circuit configured to detect a read value of the bit cell and is configured to write back the read value to the bit cell after a read operation.

Abstract: A three dimensional on-chip inductor, transformer and radio frequency amplifier are disclosed. The radio frequency amplifier includes a pair of transformers and a transistor. The transformers include at least two inductively coupled inductors. The inductors include a plurality of segments of a first metal layer, a plurality of segments of a second metal layer, a first inductor input, a second inductor input, and a plurality of through silicon vias coupling the plurality of segments of the first metal layer and the plurality of segments of the second metal layer to form a continuous, non-intersecting path between the first inductor input and the second inductor input. The inductors can have a symmetric or asymmetric geometry. The first metal layer can be a metal layer in the back-end-of-line section of the chip. The second metal layer can be located in the redistributed design layer of the chip.

Abstract: Systems, circuits and methods for controlling write operations in Spin Transfer Torque Magnetoresistive Random Access Memory (STT-MRAM) are disclosed. A reduced bit cell size is achieved by arranging the source lines (SL) substantially in parallel with the word lines (WL) and substantially perpendicular to the bit lines (BL). Further, in one embodiment during a write operation, a high logic/voltage level is applied to the bit lines of unselected bit cells to prevent an invalid write operation.

Abstract: A Spin Transfer Torque Magnetoresistive Random Access Memory (STT-MRAM) array including a plurality of bit cells, a power-up controller, and a first plurality of precharge transistors is disclosed. The plurality of bit cells are each coupled to one of a plurality of bit lines and word lines. The power-up controller is configured to provide a power-up control signal to control the voltage level of at least one of the bit lines or the word lines during power-up. The first plurality of precharge transistors are respectively coupled to at least one of the plurality of bit lines or the plurality of word lines, each precharge transistor being configured to discharge a corresponding bit line or word line to a desired voltage level based on the power-up control signal.

Abstract: An inductor or transformer for use in integrated circuit devices that includes a high-resistivity substrate. The inductor includes a plurality of conductive traces around the substrate forming a continuous conductive path from a first to a second port. The conductive path can be solenoid-shaped. Some of the conductive traces can be formed during back-end-of-line processing or backside plating of an integrated circuit die. The transformer includes a first inductor with input and output ports, and a first continuous conductive path therebetween; and a second inductor with input and output ports, and a second continuous conductive path therebetween. The second inductor is independent of and electromagnetically coupled to the first inductor. The first and second conductive paths can be solenoid-shaped. The first conductive path can be interleaved with the second conductive path.

Abstract: An electrostatic discharge (ESD) protection device is fabricated in a vertical space between active layers of stacked semiconductor dies thereby utilizing space that would otherwise be used only for communication purposes. The vertical surface area of the through silicon vias (TSVs) is used for absorbing large voltages resulting from ESD events. In one embodiment, an ESD diode is created in a vertical TSV between active layers of the semiconductor dies of a stacked device. This ESD diode can be shared by circuitry on both semiconductor dies of the stack thereby saving space and reducing die area required by ESD protection circuitry.

Abstract: A method of forming a phase-change random access memory (PRAM) cell and PRAM arrangement, and embodiments of phase-change random access memory (PRAM) cells and PRAM arrangements are disclosed. A phase-change random access memory (PRAM) cell includes a bottom electrode, a heater resistor coupled to the bottom electrode, a phase change material (PCM) coupled to the heater resistor, and a top electrode coupled to the phase change material. An active region between the heater resistor and the phase change material is defined by a thickness of the heater resistor.

Abstract: A multi-tiered IC device contains a first die including a substrate with a first and second set of vias. The first set of vias extends from one side of the substrate, and the second set of vias extend from an opposite side of the substrate. Both sets of vias are coupled together. The first set of vias are physically smaller than the second set of vias. A second die having a set of interconnects is stacked relative to the first die in which the interconnects couple to the first set of vias.

Abstract: A packaged semiconductor product includes a packaging substrate coupled to a semiconductor die through an interconnect structure with elements of variable features. The interconnect structure may be bumps or pillars. The variable features of the interconnect structure induce a reverse bend on the semiconductor die that mitigates warpage of the semiconductor die during semiconductor assembly by balancing bending of the packaging substrate during reflow. The variable features can be variable height and/or variable composition.

Abstract: A semiconductor die includes a semiconductive substrate layer with first and second sides, a metal layer adjacent the second side of the semiconductive substrate layer, one or more active devices in an active layer on the first side of the semiconductive substrate layer; and a passive device in the metal layer in electrical communication with the active layer. The passive device can electrically couple to the active layer with through silicon vias (TSVs).

Abstract: A protection system implemented on one die of a multi-die package provides a discharge path for excess voltages incurred on one or more other die of the package. Ground paths are provided for certain circuitry in the package that have high noise-sensitivity, and ground paths are provided for certain circuitry in the package that have low noise-sensitivity relative to the high noise-sensitivity circuitry. The grounds of high noise-sensitivity circuitry of multiple die are shorted together, resulting in a common high noise-sensitivity ground. The grounds of low noise-sensitivity circuitry of multiple die are shorted together, resulting in a common low noise-sensitivity ground. A pre-designated removable path is included on the package external to the die, which shorts the common high noise-sensitivity ground and the common low noise-sensitivity ground. The removable path may be removed during manufacturing, if noise present on the shorted grounds results in unacceptable performance degradation.

Abstract: A Spin Transfer Torque Magnetoresistive Random Access Memory (STT-MRAM) and associated read operations are disclosed. A bit cell includes a magnetic tunnel junction (MTJ) and a word line transistor, the bit cell being coupled to a bit line and a source line. A clamping circuit is coupled to the bit line and is configured to clamp the bit line voltage to a desired voltage level during a read operation of the STT-MRAM to prevent the bit line voltage from exceeding the desired voltage level. The desired voltage level is less than a write voltage threshold associated with a write operation of the STT-MRAM.

Abstract: An integrated circuit bridge interconnect system includes a first die and a second die provided in a side-by-side configuration and electrically interconnected to each other by a bridge die. The bridge die includes through silicon vias (TSVs) to connect conductive interconnect lines on the bridge die to the first die and the second die. Active circuitry, other than interconnect lines, may be provided on the bridge die. At least one or more additional die may be stacked on the bridge die and interconnected to the bridge die.

Abstract: A memory device includes a clock buffer circuit. The clock buffer circuit includes a cross-coupled logic circuit. The cross-coupled logic circuit has at least two logic gates in which an output of at least one of the logic gates is coupled to an input of at least one of the logic gates. The cross-coupled logic circuit is coupled to an input for accepting a clock signal. The memory device also includes a clock driver operable to generate a clock signal from the output of the cross-coupled logic circuit. A feedback loop from the clock signal to the cross-coupled logic circuit controls the cross-coupled logic circuit. A buffer circuit including a tri-state inverter is coupled to the clock signal to maintain the clock signal while avoiding contention with the clock generator. The memory device is enabled by a chip select signal.