Abstract: Methods and apparatus for detecting the presence of electronic communications devices, such as cellular phones, are disclosed. In an exemplary method, a complex radio frequency stimulus is transmitted into a target area, and nonlinear reflection signals received from the target area are processed to obtain a response measurement. The response measurement is compared to a pre-determined filter response profile to detect the presence of a radio device having a corresponding filter response characteristic. In some embodiments, the pre-determined filter response profile comprises a pre-determined band-edge profile, so that comparing the response measurement to a pre-determined filter response profile comprises comparing the response measurement to the pre-determined band-edge profile to detect the presence of a radio device having a corresponding band-edge characteristic.

Abstract: In one embodiment, a memory device comprises a semiconductor substrate, a first set of memory banks disposed on the semiconductor substrate and a second set of memory banks disposed on the semiconductor substrate. Each memory bank of the second set is split into a plurality of memory bank segments physically separated from each other and from the first set of memory banks. Each memory bank segment is arranged adjacent to, and occupies less area than, one of the memory banks of the first set.

Abstract: Methods and apparatus for current sensing according to various aspects of the present invention sense the current in a circuit, such as an inductor circuit. The current sensing systems may comprise an RC element connected such that the RC time constant matches the L/R time constant of the inductor. The current sensor may be configured to generate voltages that are proportional to the instantaneous current in the inductor with scaled gain for a wide range of inductor self resistance (DCR) values.

Abstract: An RF semiconductor package includes a substrate having generally planar top and bottom surfaces. The substrate includes a metallic base region and one or more metallic signal terminal regions extending from the top surface to the bottom surface, and an insulative material separating the metallic regions from one another. The bottom surface of an RF semiconductor die is surface-mounted to the base region at the top substrate surface. The RF semiconductor die has a terminal pad disposed at a top surface of the RF semiconductor die. The terminal pad is electrically connected to one of the signal terminal regions at the top substrate surface. A lid is attached to the top substrate surface so that the RF semiconductor die is enclosed by the lid to form an open-cavity around the RF semiconductor die. The base and signal terminal regions are configured for surface-mounting at the bottom substrate surface.

Abstract: A control device for controlling a supply voltage which can be switched between a constant line current operation and a constant line voltage operation, wherein a line current, which consists of a direct current for supplying the terminal and of an alternating current for transmitting information, flows via a subscriber line of a terminal, comprising a sensing circuit for sensing an analogue input voltage dependent on the line current, a subtractor which, in the constant line current operation, subtracts an analogue feedback voltage dependent on an adjustable nominal direct-current value from the sensed input voltage for generating an analogue difference voltage, an analogue/digital converter for converting the generated analogue difference voltage into a digital difference voltage value, a digital low-pass filter for filtering a sequence of control error values out of the generated sequence of difference voltage values, a controller for generating a control value in dependence on the filtered-out sequence of

Abstract: According to an embodiment of a high power package, the package includes a copper heat sink, a ceramic lead frame and a semiconductor chip. The copper heat sink has a thermal conductivity of at least 350 W/mK. The ceramic lead frame is attached to the copper heat sink with an epoxy. The semiconductor chip is attached to the copper heat sink on the same side as the lead frame with an electrically conductive material having a melting point of about 280° C. or greater.

Abstract: Methods and apparatus for calibrating received signal measurements in a digital subscriber line (DSL) device are disclosed. In an exemplary method, a received signal level is measured for each of one or more subcarriers of a digital subscriber line signal and converted into a corresponding measured power level. A corrected received power level is calculated as a function of the measured power level, a reference input impedance value, a nominal loop impedance value, and a pre-determined input impedance value for the DSL device.

Abstract: Data is processed in an embedded system by writing data read from a peripheral device in response to an event to memory external to the embedded system. The data or a portion of the data is copied to memory internal to the embedded system. Which portion of the data is stored in both the external memory and the internal memory is tracked. The copied data is retrieved from the internal memory by a processor included in the embedded system. The processor has one or more caches logically and physically separated from the internal memory. The processor uses the copied data it retrieved to begin servicing the event.

Abstract: According to methods, apparatuses, and computer program products described by way of non-limiting examples presented herein, a computer system operates as an intelligent node in a distributed network. In one or more embodiments, the installation and execution of a node operating computer program product (“node software”) on a computer system configures that computer system to operate as an intelligent node in a distributed network. The computer system may reside at the edge of the network and thus may include a number of physical world sensors and/or actuators that represent valuable but hard-to-reach data sources/sinks from the perspective of the network at large. The node software operates the computer system as an edge application server and enterprise service bus, intelligently processing data from sensors, actuators, and other edge systems and devices. Other applications, such as server-based data processing and storing, are also easily implemented via the node software.

Abstract: A method for producing an electrode in a semiconductor layer includes providing a substrate with a first surface and a second surface, forming a first trench having sidewalls and extending into the substrate from the first surface and forming a plug in the first trench. The method further includes reducing a thickness of the semiconductor substrate by removing semiconductor material beginning at the first surface so as to at least partially uncover sidewalls of the plug and forming a semiconductor layer on the semiconductor substrate, the semiconductor layer at least partially covering the uncovered sidewalls of the plug, and having an upper surface.