Patents Represented by Attorney, Agent or Law Firm Peter F. Corless
  • Patent number: 8063114
    Abstract: A chiral inorganic mesoporous material characterized by having a chiral twisted structure and being mesoporous; a process for producing the material; and a method of using the material. The process for inorganic mesoporous material production is a method in which one or more polymerizable inorganic monomers selected from the group consisting of polymerizable inorganic monomers and polymerizable inorganic monomers having a functional group capable of having a charge are polymerized in the presence of a solvent using as a template a self-assembly of a chiral surfactant such as an N-(higher alkanoyl)amino acid salt. Examples of the use of the inorganic mesoporous material include the separation of racemates and reaction fields for asymmetric syntheses.
    Type: Grant
    Filed: April 28, 2005
    Date of Patent: November 22, 2011
    Assignee: Japan Science and Technology Agency
    Inventors: Takashi Tatsumi, Shunai Che, Kazutami Sakamoto
  • Patent number: 7468096
    Abstract: The present invention concerns the apparatus for producing oxygen, comprising: a first zeolite bed connected to an external air pressurizing device and a depressurizing device for increasing or decreasing an internal pressure thereof; a second zeolite bed connected to the first zeolite bed in parallel and connected to the external air pressurizing device and the depressurizing device for decreasing or increasing an internal pressure thereof, the first and second zeolite beds being arranged such that the internal pressure of the second zeolite bed is decreased when the internal pressure of the first zeolite bed is increased, and the internal pressure of the second zeolite bed is increased when the internal pressure of the first zeolite bed is decreased; and a carbon molecular sieve bed communicated in fluid with the first and second zeolite beds for receiving and adsorbing oxygen produced in the first and second zeolite beds and discharging the produced oxygen to the outside and discharging selectively some of
    Type: Grant
    Filed: May 20, 2004
    Date of Patent: December 23, 2008
    Assignees: Yonsei University, Daesung Industrial Gases Co., Ltd.
    Inventor: Chang-Ha Lee
  • Patent number: 6894068
    Abstract: The present invention provides compositions and methods for the treatment of HIV infection. In particular, the present invention provides non-nucleoside inhibitors of reverse transcriptase (RT), as well as methods to treat HIV infection using these non-nucleoside inhibitors of RT. In preferred embodiments, the present invention provides a novel class of substituted benzimidazoles, effective in the inhibition of human immunodeficiency virus (HIV) RT.
    Type: Grant
    Filed: April 9, 2002
    Date of Patent: May 17, 2005
    Assignee: The United States of America as represented by the Secretary of the Department of Health and Human Services
    Inventors: Christopher J. Michejda, Marshall Morningstar, Thomas Roth
  • Patent number: 6835897
    Abstract: A warpage preventing substrate is provided. A plurality of first and second conductive traces are respectively formed on a first surface and a second surface of a core layer of the substrate, each conductive trace having a terminal, and a plurality of first and second non-functional traces are respectively formed on the first and second surfaces of the core layer at area free of the conductive traces. The first non-functional traces are arranged in different density from the second non-functional traces in a manner that, stress generated from the first conductive traces and first non-functional traces counteracts stress generated from the second conductive traces and second non-functional traces, to thereby prevent warpage of the substrate and maintain flatness of the substrate.
    Type: Grant
    Filed: December 4, 2002
    Date of Patent: December 28, 2004
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chin-Huang Chang, Chin-Tien Chiu, Cheng-Lun Liu
  • Patent number: 6830889
    Abstract: A practically usable DNA detection method by a DNA hybridization method with the use of fluorescent resonance energy transfer wherein the background luminescence based on the luminescence of a donor and the direct excitation of an acceptor) affecting the sensitized luminescence of the acceptor is minimized so that a target DNA strand can be conveniently and very easily detected in a homogeneous solution. In this DNA detection method, a DNA is detected by the DNA hybridization method by using, as detection reagents, streptoavidin labeled with a fluorescent rare earth metal complex, a nucleic acid probe modified with biotin and a nucleic acid probe labeled with an organic cyanine pigment and taking advantage of florescent resonance energy transfer.
    Type: Grant
    Filed: July 22, 2002
    Date of Patent: December 14, 2004
    Assignee: Japan Science and Technology Agency
    Inventors: Kazuko Matsumoto, Shinji Sueda
  • Patent number: 6831581
    Abstract: A digital-to-analog converter arrangement able to process input signals with different signal bandwidth is provided. The arrangement comprises a first input terminal for receiving a first digital input signal, a second input terminal for receiving a second digital input signal and switching means being coupled to the first and second input terminals and being adapted to select between the first and second digital input signals so as to output an intermediate digital signal corresponding to the selected one of the first and second digital input signals. The intermediate digital signal is received by an array of unary digital-to-analog converting elements, each unary digital-to-analog converting element being adapted so that, as an analog output signal, a sum signal of output signals of the unary digital-to-analog converting elements is output.
    Type: Grant
    Filed: May 23, 2003
    Date of Patent: December 14, 2004
    Assignee: Infineon Technologies, AG
    Inventors: Martin Clara, Jörg Hauptmann
  • Patent number: 6831686
    Abstract: Method and device for the exposure-dependent noise correction in images sensor which can be addressed in lines and columns are converted into digital values and an offset voltage correction is carried out by a summer, a gain correction is carried out by a multiplier, and an exposure-dependent dark current correction is carried out by a further summer. Further, the coefficients that depend on the line number, the column number and the integration time, are determined by linear approximations. As a result, the fixed pattern noise (PFN) in CMOS image sensor can be efficiently suppressed with a relatively low outlay.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: December 14, 2004
    Assignee: Infineon Technologies, AG
    Inventors: Ivo Koren, Heribert Geib, Ulrich Ramacher
  • Patent number: 6831190
    Abstract: The invention relates to novel and valuable intermediate compounds of the general formula (VIII) which can be used for the preparation of novel compounds comprising an antibacterial action, especially with a strong antibacterial action against helicobacter pylori, and pharmaceutically acceptable salts thereof. In the general formula (VIII) X is hydrogen or halogen, Y is hydrogen or a substituted or unsubstituted aralkyloxycarbonyl group having 8-19 carbon atoms, Z is hydrogen, a substituted aralkyloxycarbonyl group having 8-19 carbon atoms or a substituted alkoxycarbonyyl group having 2-19 carbon atoms, except that X, Y and Z are all hydrogen.
    Type: Grant
    Filed: November 22, 2000
    Date of Patent: December 14, 2004
    Assignee: Teikoku Chemical Industries Co., Ltd.
    Inventors: Osamu Kamoda, Hiromichi Fujiwara, Toshiharu Yanagi
  • Patent number: 6828893
    Abstract: A transformer circuit arrangement has a first transformer (201) with a first lower limit frequency (fu1) and a first upper limit frequency (fo1), and a second transformer (202) with a second lower limit frequency (fu2) and a second upper limit frequency (fo2), whereby the first lower limit frequency (fu1) is smaller than the second upper limit frequency (fu2), and the second upper limit frequency (fo2) is greater than the first upper limit frequency (fo1), the second lower limit frequency (fu2) is preferably not greater or smaller than the first upper limit frequency (fo1) by a factor of 10, at least one input (103, 104) of the first transformer is electrically connected to an input (209, 210) of the second transformer, and at least one output (205, 206) of the first transformer is connected to an output (107, 108) of the second transformer, and the transformer circuit arrangement has a band pass behaviour with a lower overall limit frequency (fuges) and an upper overall limit frequency (foges), whereby the l
    Type: Grant
    Filed: October 15, 2003
    Date of Patent: December 7, 2004
    Assignee: Infineon Technologies, AG
    Inventor: Reinhard Stolle
  • Patent number: 6828665
    Abstract: A module device of stacked semiconductor packages and a method for fabricating the module device are proposed, wherein a first semiconductor package provided, and at least a second semiconductor package is stacked on and electrically connected to the first semiconductor package. The first semiconductor package includes a chip carrier for mounting at least a chip thereon; a circuit board positioned above and electrically connected to the chip carrier by a plurality of conductive elements; and an encapsulant for encapsulating the chip, conductive elements and encapsulant with a top surface of the circuit board being exposed, allowing the second semiconductor package to be electrically connected to the exposed top surface of the circuit board. As the circuit board is incorporated in the first semiconductor package by means of the encapsulant, it provides preferably reliability and workability for electrically connecting the second semiconductor package to the first semiconductor package.
    Type: Grant
    Filed: December 13, 2002
    Date of Patent: December 7, 2004
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Han-Ping Pu, Chih-Ming Huang, Chien-Ping Huang
  • Patent number: 6828083
    Abstract: Compositions and methods of the invention provide for a controlled flow of resist into device contact (via) holes during a post-exposure, post-development hard-bake step. Resists of the invention are positive-acting and contain one or more components that are preferably substantially stable (i.e. no substantial crosslinking) during: 1) soft-bake, pre-exposure thermal treatment to remove solvent carrier of the applied resist, and 2) post-exposure, pre-development thermal treatment to promote or enhance the acid-promoted reaction in exposed regions (typically a de-blocking reaction). However, resists of the invention will crosslink during a post-development more stringent thermal treatment (thermal flow hard-bake step).
    Type: Grant
    Filed: April 3, 2001
    Date of Patent: December 7, 2004
    Assignee: Shipley Company, L.L.C.
    Inventor: Timothy G. Adams
  • Patent number: 6826395
    Abstract: A system and a method for a secure trading mechanism combining wireless communication and wired communication are proposed, which, in the condition of two-way trading constructed based on network connection of a wireless communication device functioning in two-way transmission to a trading server and a trading host of a wired communication devices, allow the trading to be performed in real time and the correctness to be determined for data transmitted between different levels of the network according to a secure communication protocol defined in each communication device, so as to assure the security of trading data in transmission, and prevent the trading data from being acquired or changed without authorization.
    Type: Grant
    Filed: August 1, 2001
    Date of Patent: November 30, 2004
    Assignee: Telepaq Technology, Inc.
    Inventors: Jun-Yih Lee, Sung-Yao Chang, Ching-Feng Wang
  • Patent number: 6825223
    Abstract: The invention provides novel anilide compounds and pharmaceutical compositions comprising them. The invention relates to compounds of a formula: wherein Ar is an optionally-substituted aryl group; R4 and R5 are the same or different, and each is a hydrogen atom, a lower alkyl group, or a lower alkoxy group; and R4 and R5 may together form a lower alkylene group of which one or more methylene moieties may optionally be substituted by oxygen and/or sulfur atoms; X is —NH—, or an oxygen or sulfur atom; Y is —NH—, an oxygen or sulfur atom, or a sulfoxide or sulfone group; Z is a single bond, or —NR6—; R4 represents a hydrogen atom or a lower alkylene group; and n is an integer of from 0 to 15; and their salts and solvates. The compounds of the invention are useful as pharmaceutical compositions, especially as acyl coenzyme A cholesterol acyltransferase (ACAT) inhibitors.
    Type: Grant
    Filed: February 21, 2001
    Date of Patent: November 30, 2004
    Assignee: Kowa Company, Ltd.
    Inventors: Kimiyuki Shibuya, Katsumi Kawamine, Yukihiro Sato, Toshiyuki Edano, Souhei Tanabe, Masami Shiratsuchi
  • Patent number: 6825379
    Abstract: The present invention relates to a method for recovering and producing C4-C6 dicarboxylates from an alkaline waste solution generated in a caprolactam preparation process, in which the alkaline waste solution is treated with sulfuric acid to separate into an aqueous phase and an organic phase, allowing valuable substances contained in the organic phase to be firstly oxidized and converted into dicarboxylic acids. The dicarboxylic acids then undergo concentration, esterification and distillation processes, so as to obtain desirable C4-C6 dicarboxylates with high purity. This therefore provides an efficient and improved method for effectively recovering most valuable substances from the alkaline waste solution, so that economic benefits in recovery are greatly raised.
    Type: Grant
    Filed: January 14, 2002
    Date of Patent: November 30, 2004
    Assignee: Chemaxz International Corporation
    Inventors: Sien-Chun Chou, Edward K. S. Wang, Chung Ho Wu, Yaw Jong Liu, Ping Chiang
  • Patent number: 6821876
    Abstract: A fabrication method for strengthening flip-chip solder bumps is provided to form a solder bump on a UBM (under bump metallurgy) structure formed over a semiconductor chip, which can prevent the UBM structure against oxidation and contamination and also enhance bondability between the solder bump and UBM structure, thereby improving reliability for packaging the semiconductor chip. This fabrication method is characterized in that before forming the solder bump, a dielectric layer made of BCB (benzo-cyclo-butene) or polyimide is deposited on the UBM structure, and used to protect the UBM structure against oxidation and contamination. Further, before forming the solder bump, a plasma-etching process is performed to remove the dielectric layer; the plasma-etching process is environmental-friendly without having to use a chemical solvent.
    Type: Grant
    Filed: March 26, 2003
    Date of Patent: November 23, 2004
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventor: Ke-Chuan Yang
  • Patent number: 6819565
    Abstract: A cavity-down ball grid array (CDBGA) semiconductor package with a heat spreader is provided, in which a substrate is formed with at least a ground ring, a plurality of ground vias, a ground layer, and at least an opening for receiving at least a chip. The substrate is mounted in a cavity of the heat spreader, and an electrically conductive adhesive is disposed between an inner wall of the cavity and edges of the substrate, so as to allow the ground layer and the ground ring exposed to the edges of the substrate to be electrically connected to the heat spreader by means of the electrically conductive adhesive. By the above arrangement with the heat spreader being included in a grounding circuit path of the chip, ground floatation and excess ground inductance and resistance can be prevented for the semiconductor package, thereby solving heat-dissipation, electromagnetic interference and crosstalk problems.
    Type: Grant
    Filed: January 14, 2003
    Date of Patent: November 16, 2004
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Nai-Hao Kao, Yu-Po Wang, Wen-Jung Chiang
  • Patent number: 6818307
    Abstract: The present invention relates to a flame retarded epoxy resin composition, which is characterized by that said flame retarded epoxy resin composition comprising: (A) at least one type of epoxy resin; (B) a phosphorus-and-nitrogen-containing heterocyclic compound, said compound having a moiety which can react with the epoxy group of the epoxy resin, usedful as a hardening agent, and having a structure as shown by formula (I): wherein m is an integer of from 0 to 2, n is an integer of from 3 to 7, but at least one m is not 2. The epoxy resin composition consisting of the above components (A) and (B) has improved flame retarded property and thus is suitably used as the flame retarded material required for the parts of composite material, laminated plates, printed circuit boards, electronic products, electrical products, and the like.
    Type: Grant
    Filed: July 10, 2003
    Date of Patent: November 16, 2004
    Assignee: Chang Chun Plastics Co., Ltd.
    Inventors: Kuen-Yuan Hwang, Hong-Hsing Chen, Tsung-Yu Chen, Ching Fu Kao
  • Patent number: 6818538
    Abstract: A ball grid array semiconductor packaging technology is provided, which is characterized in that openings of a solder mask are formed on a given edge of a die attachment area, and entire or partial width of each opening is disposed outside the die attachment area. Accordingly, air within the opening of the solder mask is sufficiently eliminated during die bonding process, so as to prevent void formation as adhesive is filled into the opening. Therefore, in the follow-up steps, high temperature in reflowing process will not cause popcorn as in the prior-art, so as to remain good quality of the semiconductor package.
    Type: Grant
    Filed: April 18, 2003
    Date of Patent: November 16, 2004
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Kuo-Chu Chiang, Yu-Ting Lai, Chin Te Chen
  • Patent number: 6818470
    Abstract: Method for fabricating a thermoelectric converter having a plurality of series-connected thermoelement cells, which are connected in series with one another by means of a plurality of first electrical conductor tracks (3) and each of which has a first body (4) made of thermoelectric material of a first conduction type and a second body (5) made of thermoelectric material of a second conduction type. The thermoelement cells are fabricated by means of method steps appertaining to semiconductor technology.
    Type: Grant
    Filed: July 24, 2001
    Date of Patent: November 16, 2004
    Assignee: Infineon Technologies AG
    Inventors: Bruno Acklin, Karl-Heinz Schlereth, Harald Boettner, Axel Schubert
  • Patent number: 6811961
    Abstract: New photoacid generator systems that comprise a sensitizer compound and one or more photoacid generator compounds are provided and photoresist compositions that comprise such systems. Photoacid generator systems of the invention are particularly useful as photoactive components of photoresists imaged at short wavelengths such as 248 nm, 193 nm and 157 nm.
    Type: Grant
    Filed: February 25, 2002
    Date of Patent: November 2, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: James F. Cameron, Gerhard Pohlers