Abstract: Antihalation compositions and methods for reducing the reflection of exposure radiation of a photoresist overcoated said compositions. The antihalation compositions of the invention comprise a resin binder and material capable of causing a thermally induced crosslinking reaction of the resin binder.

Abstract: Featured is a device for detecting electromagnetic signals, more specifically, the magnetic resonance signals from excited nuclei as well as related apparatuses, systems and methods. The detection device includes a planar strip array antenna including a plurality, and in more particular embodiments a multiplicity of parallel conductors (e.g., 4, 16, 32 or more of conductors). The length of the conductors is adjusted to substantially reduce the coupling of a signal in one conductor to an adjacent conductor(s). In a more specific embodiment the length is set so as to be equal to be about n&lgr;/4, where n is an integer≧1 and &lgr; is the wavelength of the signal to be detected (e.g., the wavelength corresponding to the NMR resonance frequency for the nuclei). The device also is configured so that the electromagnetic wave on each conductor is one of a standing wave or a traveling wave.

Abstract: Highly efficient cationic liposomes have been developed as an improved delivery system for biologically-active reagents. A novel structure, the sandwich liposome, is formed and comprises one or more biologically active agents internalized between two bilomellar liposomes. This structure protects the incoming agent and accounts for the high efficiency of in vivo delivery and for the broad tissue distribution of the sandwich liposome complexes. These novel liposomes are also highly efficient carriers of nucleic acids. By using extruded DOTAP:cholesterol liposomes to form complexes with DNA encoding specific proteins, expression has been improved dramatically. Highest expression was achieved in the lung, while increased expression was detected in several organs and tissues.

Abstract: Lung surfactant compositions are provided which can form a swelling phase when dispersed in a medium containing electrolytes. Hereby, a more active spreading of the lung surfactant into the alveoli can be obtained after administration to the lungs. Further provided are a pharmaceutical composition and a pharmaceutical kit comprising a lung surfactant composition as well as to a method for the treatment, prevention and/or diagnosis of respiratory distress syndrome or other pulmonary diseases that are associated with a deficiency of a lung surfactant.

Abstract: Methods of the invention include fluorescence microscopy inspection of an imaged resist layer prior to any type of development processing. Preferred resists for use in the methods of the invention contain a component that facilitates monitoring of a resist coating layer, particularly a component that can function as a proton acceptor and have a change in fluorescence upon exposure to radiation reemployed to pattern an image in the resist coating layer.

Abstract: The present invention relates to new copolymers and use of such copolymer as a resin binder component for photoresist compositions, particularly chemically-amplified positive-acting resists. Polymers of the invention include repeat units of 1) meta-hydroxystyrene groups, 2) para-hydroxystyrene groups, and 3) photoacid-labile groups.

Abstract: Antireflective compositions are provided that contain an ionic thermal acid generator material. Use of such a thermal acid generator material can significantly increase the shelf life of solutions of antireflective compositions in protic media. Antireflective compositions of the invention can be effectively used at a variety of wavelengths used to expose an overcoated photoresist layer, including 248 nm and 193 nm.

Abstract: New photoresist compositions are provided that contain a halogenated salt, particularly a halogenated counter ion of an ammonium or alkyl ammonium salt. Preferred photoresists of the invention are chemically-amplified positive resists and contain an ammonium or alkyl ammonium salt that has a halogenated anion component such as a halogenated alkyl sulfonate or carboxylate anion component. Inclusion of the halogenated organic salt in a photoresist composition can provide enhanced lithographic performance.

Abstract: A QFN semiconductor package and a fabrication method thereof are proposed, wherein a lead frame having a plurality of leads is adopted, and each lead is formed at its inner end with a protruding portion. A wire bonding region and a bump attach region are respectively defined on opposite surfaces of the protruding portion, and staggered in position. This allows a force applied from a wire bonder to the wire bonding regions not to adversely affect solder bumps implanted on the bump attach regions, so that the solder bumps can be structurally assured without cracking. Moreover, the wire bonding regions spaced apart from the bump attach regions can be prevented from being contaminated by an etching solution used in solder bump implantation, so that wire bonding quality can be well maintained.

Abstract: The present invention relates to a controlled drug release system in which a certain ratio or retinoic acid is incorporated into a microsphere comprising biodegradable polymer and amphoteric block copolymer having both hydrophilic and hydrophobic groups.

Abstract: The present invention relates to pyridine sulfonyl urea derivatives, salts or stereochemical isomers thereof showing an effective herbicidal activity in pre- and/or post-emergence treatment in rice farming, or to a method to use thereof, a method for the preparation thereof, an intemediate used for the preparation thereof, and a herbicidal composition comprising same.

Abstract: The invention provides a novel pharmaceutical kit comprising a controlled release pharmaceutical compositions for oral use containing midodrine and/or its active metabolite desglymidodrine. The controlled release composition is designed to release midodrine and/or desglymidodrine after oral intake in a manner which enables absorption to take place in the gastrointestinal tract so that a relatively fast peak plasma concentration of the active metabolite desglymidodrine is obtained, followed by a prolonged and relatively constant plasma concentration of desglymidodrine. The invention also provides a method for treating orthostatic hypotension and/or urinary incontinence, the method comprising administration to a patient in need thereof of an effective amount of midodrine and/or desglymidodrine in a kit.

Abstract: The invention provides multilayer circuit boards and methods for formation of a sequential build circuit board. Among other things, glass fiber reinforced copper clad epoxy substrates, required to provide strength or rigidity to prior boards, are not required for preferred circuit boards of the invention.

Abstract: A FCBGA (flip-chip ball grid array) semiconductor package with a heat-dissipating device and a method for fabricating the same are provided. At least a chip is mounted on a substrate in a flip-chip manner, and connected to a heat-dissipating device that is composed of a heat sink and a plurality of thermally conductive bumps implanted on the beat sink. Heat produced from the chip is dissipated via the heat-dissipating device. The thermally conductive bumps are bonded to a circuit board, and thereby reduce contact area between the heat-dissipating device and the circuit board, without forming of voids or popcorn effect during a solder-reflow process. The heat sink in contact with the chip is similar in coefficient of thermal expansion (CTE) to the chip, so as to prevent delamination between the heat sink and the chip, thereby assuring quality and yield of fabricated package products.

Abstract: A dual-chip integrated circuit package with unaligned chip arrangement and a method of manufacturing such a dual-chip integrated circuit package are provided. The dual-chip integrated circuit package includes a leadframe having a first set of leads and a second set of leads. The dual-chip integrated circuit package is used to pack two integrated circuit chips in an unaligned chip arrangement, in which the first integrated circuit chip is mounted to one side of the inner part of the first set of leads, and the second integrated circuit chip is mounted to the other side of the same in such a manner as to allow the bonding pads on the second integrated circuit chip to be positioned in the spacing formed between the two sets of leads. This unaligned chip arrangement can help facilitate the wire-bonding process for the bonding pads on the second integrated circuit chip.

Abstract: A semiconductor package with a heat-dissipating structure and a method for making the same are proposed. The heat-dissipating structure includes a heat sink and a plurality of solder columns, wherein the solder columns are attached at ends thereof to the heat sink and to a substrate, so as to support the heat sink to be positioned above a semiconductor chip mounted on the substrate. A reflow process performed after the attachment of the heat-dissipating structure to the substrate allows the self-alignment of the solder columns with respect to predetermined positions on the substrate, which helps precisely control the positioning of the heat-dissipating structure fixed on the substrate. Moreover, the solder columns can protect the substrate from being damaged or deformed during a molding process. In addition, the heat-dissipating structure is simple in structure, which simplifies the manufacturing process and reduces the cost.

Abstract: A method is proposed for forming circuit probing (CP) contact points on fine pitch peripheral bond pads (PBP) on a flip chip for the purpose of facilitating peripheral circuit probing of the internal circuitry of the flip chip. The proposed method is characterized in the forming of a dual-layer NiV/Cu metallization structure, rather than a triple-layer Al/NiV/Cu metallization structure, over each aluminum-based PBP, which includes a bottom layer of nickel-vanadium (NiV) deposited over the aluminum-based PBP and an upper layer of copper (Cu) deposited over the nickel-vanadium layer. When low-resolution photolithographic and etching equipment is used for photoresist mask definition for selective removal of the NiV/Cu metallization structure, the resulted photoresist masking can be misaligned to the PBP.

Abstract: The present invention includes new polymers and use of such polymers as a resin component for photoresist compositions, particularly chemically-amplified positive-acting photoresist compositions. Polymers and resists of the invention are particularly useful for imaging with short wavelength radiation, such as sub-200 nm and preferably about 157 nm. Polymers of the invention contain one or more groups alpha to an acidic site that are substituted by one or more electron-withdrawing groups.

Abstract: A chip carrier with a dam bar structure is proposed. The chip carrier is defined with at least a chip attach area and a wire bonding area surrounding the chip attach area, allowing a chip to be mounted on the chip attach area and electrically connected to the wire bonding area by bonding wires bonded to the wire bonding area. A molding gate and a dam bar are formed on the substrate outside the chip attach area and wire bonding area. An molding compound is injected through the molding gate for encapsulating the chip and bonding wires. The dam bar is provided with a first gate directed toward the molding gate, a second gate and a third gate opposed to the second gate, wherein the second and third gates are each vertically arranged with respect to the molding gate, allowing the molding compound to divert its flow direction by the dam bar.