Patents Represented by Attorney, Agent or Law Firm Peter F. Corless
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Patent number: 6749983Abstract: The present invention provides novel polymers and chemically-amplified positive-acting photoresist compositions that contain such polymers as a resin binder component. Preferred polymers of the invention include one or more structural groups that are capable of reducing the temperature required for effective deprotection of acid-labile moieties of the polymer.Type: GrantFiled: June 11, 1999Date of Patent: June 15, 2004Assignee: Shipley Company, L.L.C.Inventors: Gary N. Taylor, Charles R. Szmanda
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Patent number: 6747050Abstract: The present invention provides to an isoxazoline derivative of formula (I), the pharmaceutically acceptable salts, esters and stereochemically isomeric forms thereof, and the use of the derivative in inhibiting the activity of caspases. The present invention also provides a pharmaceutical composition for preventing inflammation and apoptosis which comprise the isoxazoline derivative, pharmaceutically acceptable salts, esters and stereochemically isomeric forms thereof and the process for preparing the same. The derivative according to the present invention can be effectively used in treating diseases due to caspases, such as, for example the disease in which cells are abnormally died, dementia, cerebral stroke, AIDS, diabetes, gastric ulcer, hepatic injury by hepatitis, sepsis, organ transplantation rejection reaction and anti-inflammation.Type: GrantFiled: March 15, 2002Date of Patent: June 8, 2004Assignee: LG Chem Investment Ltd.Inventors: Eunice Eun-Kyeong Kim, Mi-Jeong Park, Tae-Hee Lee, Hye-Kyung Chang, Tae-Kyo Park, Chang-Yuil Kang, Young-Myeong Kim, Kwang-Yul Moon, Young-Leem Oh, Chang-Hee Min, Hyun-Ho Chung
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Patent number: 6743706Abstract: An integrated circuit package having an encapsulating body with a flanged portion and an encapsulating mold for molding the encapsulating body are proposed. It is a characteristic feature of the proposed encapsulating mold that the encapsulating-body cavity formed in the upper mold further includes a constricted cutaway portion in the rim thereof The constricted cutaway portion can be either uniform in thickness or formed in a multi-step staircase-like shape. During the molding process, the resin used to form the encapsulating body would flow into this constricted cutaway portion; and within the constricted cutaway portion, the resin would more quickly absorb the heat of the upper mold, thus increasing its viscosity and retarding its flowing speed. As a result, the resin would less likely to flash onto those surface parts of the substrate beyond the encapsulating body.Type: GrantFiled: June 5, 2002Date of Patent: June 1, 2004Assignee: Siliconware Precision Industries Co., Ltd.Inventor: Chien Ping Huang
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Patent number: 6743563Abstract: Resists of the invention contain an added acid component which has been found can significantly enhance stability during storage between manufacture and use. Preferred resists of the invention contain an ester-based solvent such as ethyl lactate or propylene glycol methyl ether acetate in addition to the acid component.Type: GrantFiled: August 15, 2001Date of Patent: June 1, 2004Assignee: Shipley Company, L.L.C.Inventors: James F. Cameron, Sheri L. Ablaza
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Patent number: 6740467Abstract: The invention provides new photoresist compositions that contain a resin binder and a blend of non-ionic and ionic PAGS. Preferred resists of the invention preferably are imaged with 248 nm and/or 193 nm exposure wavelengths to provide highly resolved small dimension features.Type: GrantFiled: May 18, 2001Date of Patent: May 25, 2004Assignee: Shipley Company, L.L.C.Inventor: Peter Trefonas, III
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Patent number: 6740540Abstract: A fabrication method for a circuit board is proposed, wherein a core layer is formed with a plurality of conductive traces, and photo resist is applied on terminals of the conductive traces. A non-solderable material is peelably applied over a support member, and attached to the core layer to cover the conductive traces, wherein adhesion between the support member and the non-solderable material is smaller than adhesion between the non-solderable material and the core layer. Then, the support member is peeled to expose the non-solderable material; further, the non-solderable material is partly removed to expose the photo resist. Finally, the photo resist is etched away to expose the terminals of the conductive traces. The exposed terminals serve as bond pads or fingers where solder balls, bumps or wires are bonded for electrical connection purpose.Type: GrantFiled: June 12, 2002Date of Patent: May 25, 2004Assignee: Ultra Tera CorporationInventors: Chung-Che Tsai, Jin-Chuan Bai
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Patent number: 6737737Abstract: A semiconductor package with a chip supporting member is provided, including a lead frame having a die pad and a plurality of leads, and a chip supporting member mounted on a central portion of the die pad. The chip supporting member has a first surface and an opposing second surface attached to the die pad. At least a chip is mounted on the first surface of the chip supporting member to space the chip apart from the die pad via the chip supporting member, so as to prevent the chip from being damaged by thermal stress induced by CTE (coefficient of thermal expansion) mismatch between the chip and lead frame, thereby eliminating delamination, warpage and chip cracks. Moreover, the chip supporting member interposed between the chip and die pad provides greater flexibility for mounting variously sized or shaped chips on the die pad without having to use chips corresponding to profile of the die pad.Type: GrantFiled: January 31, 2003Date of Patent: May 18, 2004Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chin-Huang Chang, Chin-Tien Chiu, Jung-Pin Huang
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Patent number: 6736478Abstract: The invention relates to a process for automatically determining the image quality of inkjet photo printers or color inkjet photo printers, whereby a digital reference test chart is produced which is made available to the printer. The printer or photo printer prints out the reference test chart so that a photo printer specific printout of the reference test chart is generated, which is digitized for comparison of the digitized image data with an optimum digital reference test chart, for determination of the image quality of the printed image on the basis of deviations or concurrences between the photo printer specific test chart printout and the reference test chart.Type: GrantFiled: July 24, 2002Date of Patent: May 18, 2004Assignee: Gretag Imaging Trading AGInventors: Dieter Franzke, Adrian Kohlbrenner, Armin Kündig
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Patent number: 6737376Abstract: Porous ceramics are described, which are produced by a) mixing an aqueous solution of a suitable ionotropically orientable polyanion, either with oxides, hydroxides or hydrated oxides, which are present in the form of a sol, of the metals Al, Zr, Ti and Nb, or with finely crystalline oxides, hydroxides or hydrated oxides, which are present in suspension, of these metals, or with finely crystalline tricalcium phosphate or apatite which are present in suspension, b) bringing the mixed sol obtained as in a) or the suspension obtained as in a) into contact with a solution of a salt of a di- or trivalent metal cation in order to produce an ionotropic gel body, c) compacting the gel body by introducing it into electrolyte solutions which further enhance the syneresis of the polyelectrolyte which was originally formed, d) washing the gel body with water and subsequently impregnating it with a readily volatile, water-miscible solvent, e) freeing the anhydrous gel body or gel bodies obtained as in d) from theType: GrantFiled: June 8, 2001Date of Patent: May 18, 2004Inventors: Klaus Heckmann, Thomas Wenger
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Patent number: 6736836Abstract: A device and method are provided for maintaining donor organs at reduced temperatures ex vivo, in particular while the organ is being implanted in the recipient, and until reperfusion of the organ. By maintaining the organs at reduced temperatures, the potential for external warming of the organ and ischemic injury is reduced and graft performance and survival is improved.Type: GrantFiled: February 16, 2001Date of Patent: May 18, 2004Assignee: The Johns Hopkins UniversityInventor: Robert A Montgomery
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Patent number: 6734291Abstract: A synthesis of [2.2.1]bicyclo nucleosides which is shorter and provides higher overall yields proceeds via the key intermediate of the general formula III, wherein R4 and R5 are, for instance, sulfonates and R7 is, for instance, a halogen or an acetate. From compounds of the general formula II, such as 3-O-aryl-4-C-hydroxymethyl-1,2-O-isopropylidene-&agr;-D-ribofuranose, intermediates of the general formula III are suitable for coupling with silylated nucleobases. Upon one-pot base-induced ring-closure and desulfonation of the formed [2.2.1]bicyclo nucleoside, a short route to each the LNA (Locked Nucleic Acid) derivatives of adenosine, cytosine, uridine, thymidine and guanidine is demonstrated.Type: GrantFiled: December 16, 2002Date of Patent: May 11, 2004Assignee: Exiqon A/SInventors: Alexei Kochkine, Jef Fensholdt, Henrik M. Pfundheller
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Patent number: 6726666Abstract: In preferred aspects the invention provides an in-line humidifier, a system using such a humidifier and methods related thereto, a method for infusing a gas into an eye during retinal detachment surgical procedure and a method for treating a retinal tear. The method for infusing gas includes providing an in-line humidifier, humidifying the gas in the in-line humidifier by flowing the gas there through and infusing the humidified gas into the eye. The in-line humidifier includes a housing and a humidifier section disposed within the housing, the humidifier section including a hydroscopic material that releasably retains liquid therein. The housing includes an inlet and outlet connection in fluid communication with the housing interior.Type: GrantFiled: October 21, 1999Date of Patent: April 27, 2004Assignee: The Johns Hopkins UniversityInventor: Eugene de Juan, Jr.
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Patent number: 6727049Abstract: The present invention provides radiation sensitive compositions and methods that comprise novel means for providing relief images of enhanced resolution. In one aspect the invention provides a method for controlling diffusion of photogenerated acid comprising adding a polar compound to a radiation sensitive composition and applying a layer of the composition to a substrate; exposing the composition layer to activating radiation whereby a latent image is generated comprising a distribution of acid moieties complexed with the polar compound; and treating the exposed composition layer to provide an activating amount of acid.Type: GrantFiled: June 9, 2003Date of Patent: April 27, 2004Assignee: Shipley Company, L.L.C.Inventors: James W. Thackeray, Angelo A. Lamola
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Patent number: 6723838Abstract: The present invention features molecules that relate to SYNGAP (Synaptic GTPase Activating Protein), an excitatory synapse protein that has been found to bind synaptic proteins and modulate signal transduction. In one aspect, the invention provides isolated polynucleotides that encode SYNGAP or fragments or derivatives thereof. Further provided are SYNGAP or SYNGAP-related polypeptides encoded by the polynucleotides. In another aspect, the invention provides immunological molocules that are capable of binding the polypetides. Additionally provided are methods for using the molocules of this invention, e.g., to treat or prevent a disorder mediated by SYNGAP. The invention also provides screening assays for detecting compounds useful in the diagnosis or treatment of disorders impacted by SYNGAP.Type: GrantFiled: April 19, 1999Date of Patent: April 20, 2004Assignee: Johns Hopkins UniversityInventors: Richard L. Huganir, Jee Hae Kim
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Patent number: 6720649Abstract: A semiconductor package with a heat dissipating structure is provided. The heat dissipating structure includes a flat portion, and a plurality of support portions formed at edge corners of the flat portion for supporting the flat portion above a chip mounted on a substrate. The support portions are mounted at predetermined area on the substrate without interfering with arrangement of the chip and bonding wires that electrically connect the chip to the substrate. The support portions are arranged to form a space embraced by adjacent supports and the flat portion, so as to allow the bonding wires to pass through the space to reach area on the substrate outside coverage of the heat dissipating structure; besides, passive components or other electronic components can be mounted on the substrate at area within or outside the coverage of the heat dissipating structure, thereby improving flexibility in component arrangement in the semiconductor package.Type: GrantFiled: August 2, 2002Date of Patent: April 13, 2004Assignee: Siliconware Precision Industries Co., Ltd.Inventor: Chien-Ping Huang
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Patent number: 6720009Abstract: Active enamel substances may be used for the preparation of a pharmaceutical or cosmetic composition for healing of a wound, improving healing of a wound, soft tissue regeneration or repair, or for preventing or treating infection or inflammation.Type: GrantFiled: May 28, 2002Date of Patent: April 13, 2004Assignee: Biora BioEx ABInventors: Stina Gestrelius, Lars Hammarström, Petter Lyngstadaas, Christer Andersson, Ivan Slaby, Tomas Hammargren
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Patent number: 6721053Abstract: An MEOMS sensing chip for optically detecting and measuring substances in fluid samples is disclosed. The MEOMS sensing chip includes a system for optically sensing substances in the fluid samples and a system for delivering the fluid samples to the sensing system. The sensing system includes a two-branch channel waveguide and a plurality of ring waveguides, each branch in the two-branch waveguide being used for evanescently coupling light energy into one of the ring waveguides. The delivering system includes a plurality of micro-channels and a plurality of micro-wells, the micro-channels being used for transporting the fluid samples to the micro-wells. Each micro-well is aligned with a respective ring waveguide and is used for exposing the fluid sample contained therein to the respective ring waveguide. Characteristics related to the evanescent coupling of the light energy into the ring waveguides, e.g., resonant frequencies of the ring waveguides, are used for detecting substances in the fluid samples.Type: GrantFiled: May 19, 1999Date of Patent: April 13, 2004Assignee: Corning Intellisense CorporationInventor: Fariborz Maseeh
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Patent number: 6721026Abstract: A process for forming an in-plane switching mode liquid crystal display (IPS-LCD), which defines pixel portions of the common and data electrodes by the same photo-masking and lithography procedure, is disclosed. Accordingly, the misalignment can be avoid. An in-plane switching mode liquid crystal display (IPS-LCD) is also disclosed. The IPS-LCD includes a storage capacitor consisting of storage-capacitor portions of the common and data electrode structures, which is disposed outside the pixel region so as to enhance the aperture ratio of the pixel region.Type: GrantFiled: May 1, 2001Date of Patent: April 13, 2004Assignee: Hannstar Display CorporationInventors: Jia-Shyong Cheng, Tean-Sen Jen
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Patent number: 6719750Abstract: An therapeutic agent delivery device that can allows is particularly suitable for delivery of a therapeutic agent to limited access regions, such as the posterior chamber of the eye and inner ear. Preferred devices of the invention are minimally invasive, refillable and may be easily fixed to the treatment area. Preferred delivery devices of the invention also include those that comprise a non-linear shaped body member body housing one or more substances and a delivery mechanism for the sustained delivery of the one or more substances from the non-linear shaped body member to the patient.Type: GrantFiled: June 22, 2001Date of Patent: April 13, 2004Assignee: The Johns Hopkins UniversityInventors: Signe Erickson Varner, Eugene DeJuan, Jr., Terry Shelley, Aaron Christopher Barnes, Mark Humayun
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Patent number: 6716676Abstract: A new semiconductor packaging technology is proposed for the fabrication of a thermally-enhanced stacked-die BGA (Ball Grid Array) semiconductor package. By the proposed semiconductor packaging technology, a substrate is used as a chip carrier for the mounting of two semiconductor chips in conjunction with a heat spreader thereon, wherein the first semiconductor chip is mounted over the substrate through flip-chip (FC) technology; the heat spreader is mounted over the first semiconductor chip and supported on the substrate; and the second semiconductor chip is mounted on the heat spreader and electrically coupled to the substrate through wire-bonding (WB) technology. To facilitate the wire-bonding process, the heat spreader is formed with a plurality of wire-routing openings to allow the bonding wires to be routed therethrough. Since chip-produced heat during operation can be dissipated through the heat spreader, it allows an enhanced heat-dissipation efficiency.Type: GrantFiled: September 19, 2002Date of Patent: April 6, 2004Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Eing-Chieh Chen, Cheng-Yuan Lai, Tzu-Yi Tien