Abstract: A redundancy circuit for a semiconductor storage apparatus controls replacement of a normal system memory cell by a redundant system memory cell. Each of first and second fuse circuits include fuses provided in correspondence to individual bits of an address signal constituted by a plurality of bits for designating an address of the normal system memory cell, and outputs an output signal of high level or low level in dependence on whether or not the fuse is broken or not. A non-redundancy decision unit decides whether the normal system memory cell is to be used or not on the basis of the output signals of the first and second fuse circuits to thereby output a non-redundancy flag indicating result of the decision. A MOS transistor has a gate terminal applied with the non-redundancy flag and is changed over between a conducting state and a non-conducting state in dependence on the non-redundancy flag.

Abstract: A ring binder is disclosed as comprising a substantially rigid curved upper plate supporting a pair of pivotable lower plates mounted with a plurality of pairs of half rings, and a lever at each end of the ring binder, wherein the curved upper plate comprises a W-shaped ridge member or trough member between each of its longitudinal ends and the pair of half rings nearest thereto.

Abstract: An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using an adhesive of silicone or flexible-epoxy adhesive. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel or gold on chromium. Such structures are especially useful for flip chip attachment to flexible or rigid organic circuit boards or modules such as CQFP, CBGA, CCGA, CPGA, TBGA, PBGA, DCAM, MCM-L, and other chip carrier packages in which the back side of chips are connected directly to heat sinks. These adhesive materials withstand wet or dry thermal cycle tests of -65.degree. to 150.degree. C. for 1,000 cycles and 85.degree. C. and 85% relative humidity for 1000 hours while maintaining a tensile strenth of at least 500 psi. The adhesive contains materials having high thermal conductivity and a low coefficient of thermal expansion (CTE) in order to provide increased thermal performance.

Abstract: A method and apparatus for adjusting a quench head for glass tempering is provided. The quench head comprises at two nozzle blocks, each one of the nozzle blocks comprising at least one nozzle for directing the flow of a substance in gaseous phase to impinge onto the surface of the glass at certain areas. The nozzle blocks are supported on a frame to form at least one row of nozzle blocks. The frame comprises means for adjusting the tempering conditions effected to the surface of the glass to follow the shape of the surface of the glass. The directions of the flows of the substance in gaseous phase is adjusted such that the distance between the areas where a substance impinges the surface of a glass, between at least one pair of adjacent nozzle blocks and at least one row is kept substantially constant, regardless of the shape of the glass.

Abstract: The invention relates to computer systems containing at least one microprocessor associated with at least one memory in which are recorded instructions of a program and/or data to be processed according to the instructions.The memory is divided up into N=2 modules, one of which has a greater capacity than the other and the access time of which increases in proportion to its capacity. The module of smallest capacity is reserved for the instructions and/or data of the programs which are the most often used and the module of larger capacity is reserved for the instructions and/or data of the programs which are the least often used. The instruction contains a code identifying the module to be used.

Abstract: In a circuit-protector-built-in power plug, the plug body has in its front a curved concavity, in which plug terminals are planted, a circuit protector which interrupts the circuit when supplied with excess current, and a reset knob for resetting the circuit to its closed state through manipulation from the outside the plug body. The reset knob is so disposed in the concavity that it does not protrude beyond the surface of the plug body. A slidable lid covering the concavity prevents access to the reset knob when the plug terminals are inserted into receptacles.

Abstract: All of a transparent electrode layer 2, a light-emitting layer 3, a dielectric layer 4, a back-surface electrode 5, collecting electrodes 5a, 5b, and an insulating coat layer 6 are laminated with predetermined patterns by screen printing on an insulating transparent film 1. Conductive paste used for forming transparent electrode layer 2 comprises conductive powder of indium oxide which contains needle-like powder (A) and fine-gain powder (B) at a blending ratio of (A):(B)=100:0 to 20:80. A binder resin (D), being a photo-hardening or thermal-hardening resin, is mixed with the conductive powder (C) at a blending ratio of (C):(D)=45:55 to 95:5, thereby obtaining an excellent EL lighting element.

Abstract: The fuel assembly includes an arrangement for quickly fixing the guide thimble into an opening passing through the adaptor plate of a dismountable nozzle of the assembly. This arrangement includes at least two bearing stops inside the opening of the nozzle, a bearing sleeve integral with the end of the guide thimble and a locking ring which includes stops for bearing on bearing surfaces of the stops inside the opening of the nozzle and deformable elastic parts capable of being accommodated in cavities of the opening of the adaptor plate or of the bearing sleeve, in order to place the ring in a position in which the guide thimble is locked or unlocked. The sleeve includes a rim for bearing on a bearing surface of the adaptor plate at the periphery of the opening.

Abstract: A double-layer optical disk comprises first and second substrates which include information pits and are bonded at their confronting faces. Each substrate has at least one information pit formed on a surface thereof for recording the information, and receives reproduction light irradiated from a predetermined reading direction. And, the information pit formed on the first substrate is different in size from the information pit formed on the second substrate.

Abstract: A method and an indicating device for determining a location of a hole to be used as an attachment point for a fixture or fixture part on an area of the human body are disclosed. The indicating device comprises a bearing part which is adapted to be received in an existing hole and a protruding part interconnected with the bearing part and extending above the existing hole when the bearing part is inserted into the existing hole. At least one indicating part is interconnected with the protruding part and has a free end extending away from the existing hole, where a location of the new hole to be used as an attachment point is established at a position substantially adjacent to an exterior surface of the free end of the indicating part.

Abstract: 3-Bromo- and 3,3-dibromo-4-oxo-1-azetidines of the formula I ##STR1## wherein R.sub.1 is hydrogen or bromo,R.sub.2 is hydrogen or bromo,R.sub.3 is hydrogen, ##STR2## wherein R.sub.4 is hydrogen, methyl, benzyl or some other protective group,R.sub.5 is hydrogen, alkyl, alkylaryl, a heterocyclic ring,Y is a halo atom,X is a halo atom, alkoxy group, nitroxy group are provided along with processes for the preparation thereof and the use thereof.

Abstract: A ring binder adapted to be secured to an article by at least one integral rivet, the ring binder comprising a substantially rigid integral upper plate supporting a pair of pivotable lower plates to which a plurality of ring members are mounted, the rivet comprising (1) a barrel that is in direct engagement with the upper plate and (2) a plurality of claws for securing the article, wherein at least 75% of said claws extend away from a longitudinal axis of the barrel. Also disclosed is a rivet adapted to secure a ring binder to an article, the rivet comprising (1) a barrel for engaging the ring binder and (2) a plurality of claws for securing the article, wherein at least a majority of the claws generally extend away from a longitudinal axis of the barrel.

Abstract: The present invention relates to a method and device for the preparation of propellant charges for automatic loading into artillery guns of the type which are loaded with propellant in the form of propellant modules usually designed charge modules, which have uniform section and combustible mainly stiff casings. The invention is based on the utilization of a special type of magazine in which sets of charge modules which correspond to the maximum charge for the artillery gun are successively fed to a module feeding device opening where the quantity of charge modules required for the next projectile is fed from the magazine to a loading pendulum which is swung into position at the module feeding device opening. Loading pendulum is fitted with devices for arranging the charge modules in a straight column above or following each other and for compressing the charge modules longitudinally into a unified propellant charge which can subsequently be rammed automatically by a conventional flick rammer.

Abstract: A semiconductor device comprises a semiconductor substrate having N- and P-channel regions formed therein; a plurality of first transistors formed in the N-channel region; a first field shield element-isolation structure having a first shield plate electrode and formed in the N-channel region for isolating the first transistors from each other; a plurality of second transistors formed in the P-channel region; and a second field shield element-isolation structure having a second shield plate electrode electrically connected to the first shield plate electrode and formed in the P-channel region for isolating the second transistors from each other; wherein respective values of a threshold voltage V.sub.tN of a parasitic transistor formed in a field region of the N-channel region, a threshold voltage V.sub.tP of a parasitic transistor formed in a field region of the P-channel region and a potential V.sub.sP of the first or second shield plate electrode are determined so as to meet V.sub.tN -V.sub.tP >V.sub.