Abstract: An elastic-cup support for keyboard is in the form of a flat locating sheet located on a membrane-type switch circuit board of the keyboard, and provided at positions corresponding to membrane-type switches on the circuit board with receiving holes for separately receiving an elastic cup therein. Each of the receiving holes is provided with an upward projected wall portion to confine the elastic cup to the receiving hole. The wall portion is optionally provided with at least one notch having a lug radially inward extended therefrom, such that the elastic cup confined by the wall portion is also pressed against the at least one lug to fixedly located in the receiving hole on the flat locating sheet. Alternatively, the wall portion may be provided at an upper edge with at least one radially inward projected lug to prevent the elastic cup from separating from the receiving hole.

Abstract: An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a -shaped structure. The molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The first boards are partially encapsulated by the first molded body. The second and third boards are exposed from bottom and side surfaces of the first molded body. The chip is mounted within the cavity. The pads are formed on the chip. The wires electrically connect the pads to input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the chip.

Abstract: A lens apparatus for detecting inaccuracy of machining of a finished workpiece is disclosed. After finishing the workpiece on a machine table in a machining process, remove a tool from a shaft, mount the lens apparatus under the shaft, couple a display to the machine, machine a left side of the workpiece by moving the table to align the left side of the workpiece with a reference point of a lens for determining alignment of the workpiece, initialize data shown on the display if the workpiece has been aligned, adjust the table to align a right side of the workpiece with the reference point for determining the alignment of the workpiece, determine whether there is an inaccuracy of machining of the workpiece by watching updated data on the display, remove the lens apparatus, and replace the tool with a second tool for correcting the machining process if an inaccuracy occurs.

Abstract: A printing module mounted inside the top cover of a barcode printer and adapted to print a barcode on a sheet member is constructed to include an output unit having a relatively higher first mounting face and a relatively lower second mounting face and a USB connector, a bottom panel affixed to the second mounting face of the output unit and hooked on the bottom side of the output unit, a locating plate affixed to the first mounting face of the output unit, a holder frame coupled to the locating plate and adapted to detachably secure the printing module to the inside of the top cover of the barcode printer by a hook joint.

Abstract: A method for packaging an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form a chamber together with the substrate; mounting a photosensitive chip to the upper surface of the substrate and within the chamber, and electrically connecting the photosensitive chip to the substrate; mounting a transparent layer to the frame layer with a B-stage adhesive applied therebetween; pre-baking the B-stage adhesive to slightly adhere the transparent layer to the frame layer; testing the image sensor to determine whether the image sensor is passed or failed; and post-baking the passed image sensor to completely cure the B-stage adhesive so that the transparent layer is firmly adhered to the frame layer.

Abstract: An image sensor module and a method for manufacturing the same. The image sensor module includes a substrate, a photosensitive chip mounted to the substrate, a plurality of wires for electrically connecting the photosensitive chip to the substrate, a frame layer mounted to the substrate to surround the photosensitive chip, and a lens barrel formed with a chamber at a center thereof and an external thread at an outer edge thereof. An inner edge of the frame layer is formed with an internal thread, and a transparent layer is fixed by the frame layer such that the photosensitive chip may receive optical signals passing through the transparent layer. The external thread is screwed to the internal thread of the frame layer. The lens barrel has a through hole and an aspheric lens from top to bottom.

Abstract: A method for removal of hemispherical grained silicon (HSG) in a deep trench is described. A buried silicon germanium (SiGe) layer serving as an etch stop layer is formed in the collar region of the trench, followed by depositing a HSG layer. The HSG layer is then successfully striped by wet etching with a potassium hydroxide/propanone/water etchant, that is, without damage to the trench sidewalls, since a good etch rate selectivity between the HSG layer and the SiGe layer is obtained by the wet etchant. In addition, no etch stop layer exists between the HSG layer and the bottom of the trench when manufacturing trench capacitors in accordance with the method; capacitance degradation is therefore not of concern.

Abstract: A workpiece feeder adapted to feed workpieces to the processing main shaft of a cutting metal-working machine individually is disclosed to include a frame base adapted to carry individual workpieces, a conveyer, two striking blocks fixedly fastened to the conveyer, a power drive controlled by a control box to move workpieces to the feeding position one after another and to rotate the conveyer, causing the striking blocks to force individual workpieces to the processing main shaft of the cutting metal-working machine one after another through a workpiece guide.

Abstract: The present invention relates to a ceiling loudspeaker, primarily including adjustable fixing pieces at sides of speaker housing for installing the loudspeaker on the ceiling in position. Besides, a plurality of hooks are fitted to the speaker set, and tension springs are connected to the hooks while the speaker seat is hooked by the tension springs on the spring seats of the housing. Accordingly, the ceiling loudspeaker is convenient in assembly and stable in connection.

Abstract: An image sensor module includes a substrate, a frame layer, a photosensitive chip, a transparent layer and a lens barrel. The substrate has a plurality of lead frame arranged in a matrix to form an upper surface, which is formed with a opening, and a lower surface, which is formed with a cavity penetrated from the opening. The frame layer is integrally formed with the substrate, and arranged at the periphery of the upper surface of the substrate to define a chamber together with the substrate, an internal thread being formed on the inner wall of the chamber. The photosensitive chip is mounted within the cavity of the substrate, and electrically coupled each of the lead frames in a flip chip manner. The transparent layer is covered onto the upper surface of the substrate to cover the opening.

Abstract: A multi-chip light emitting diode (LED) package includes red, green, and blue LED chips directly bonded on a silicon substrate for a controlling integrated circuit (IC), and a carrier to which the controlling IC is attached. The multi-chip LED package has reduced volume and enhanced heat-radiating power. The chips are directly driven and controlled by the controlling IC, so that the carrier is not necessarily a printed circuit board but may be made of any solid material.