Abstract: An accelerometer device particularly adapted for use in automotive safety air bag applications comprises an electrically insulating substrate having electrically conducting circuit paths, signal conditioning circuit components, and an accelerometer unit mounted thereon, the substrate being fixed in position on three pins within a housing. The accelerometer comprises a silicon mass movable in a silicon body relative to an integral silicon support to provide strain in the silicon body in response to acceleration and has piezoresistive sensors formed in the silicon body to be responsive to that strain to provide an electrical signal corresponding to the acceleration.

Abstract: A scene is observed with an object plane scanning FLIR (forward looking infrared) FLIR system with the detector array placed at one edge of the field of regard. A FLIR processor immediately commences analysis of the received FLIR signal for potential targets. Upon determination that a potential target exists, the FLIR processor causes the LADAR system to commence operation and directs the laser beam therefrom to the localized region where the potential target has been located. The system continues to receive the FLIR signals and causes these signal from the field of view to bypass the path of the reflected laser signals and pass directly to the FLIR detectors. The reflected laser signal returns through the optical system and is mixed with the beam from a local oscillator. The combined beam is then passed to the laser or LADAR detectors which operate in conjunction with a target classifier to classify the potential target being observed.

Abstract: A light absorbing, low reflectance coating and method of fabricating the coating provided by electron beam evaporation of aluminum onto substrates bombarded with nitrogen ions to produce a randomly textured coating which traps light in a labyrinth. The coating is electrically insulating except for the first few tens of atoms which remain metallic. Absorptance exceeds 90% in the 0.4 to 16 .mu.m region. The coating is flexible and can be deposited on a polymer base.

Abstract: A semiconductor device structure (10) includes similar devices (30), (32), and (34) having different operating characteristics. Each similar device is formed on a semiconductor substrate layer (14) through openings (16), (18), and (20) in a mask layer (12). Each opening (16), (18), and (20) has a different feature size and spacing that allows for various thickness levels of layers within the similar devices (30), (32), and (34) due to desorption from the mask layer (12). The growth rate within each opening (16), (18), and (20) is inversely proportional to the feature size of the respective opening.

Abstract: A fuel supply control device for an internal combustion engine in which fuel is injected from a fuel injection device (6) in an intake port (2.1) and air that flows into the intake port is mixed with the injected fuel to be supplied to combustion chamber (1) is shown, in which there are provided an intake control valve (20, 30) having a heater (7.3, 7.4) in the intake port and being capable of opening and closing the mixed gas flow passage. Control circuits (12, 13) carry out opening and closing position control of the intake control valve (20, 30) so that, at least during the time when the heater (7.3, 7.4) generates heat, the portion of the heat-generating region of the intake control valve (20, 30) may be located in the fuel injection range, with the valve (20, 30) functioning as a variable heater, variable intake valve and an AD port.

Abstract: A vehicular transmission sensor having an electrical output responsive to gear selection is shown having a plurality of sealed electrical switches mounted within the transmission housing. In a first embodiment a cam plate is disposed on a face of the detent lever and is movable therewith relative to the switches. The switches are each provided with a follower which moves between switch contacts engaged and switch contacts disengaged positions in dependence on the angular position of the cam plate. In a second embodiment a switch arm mounting a plurality of first switch contacts is movable with the detent lever into and out of engagement with respective second switch contacts mounted in a sealed stationary housing.

Abstract: A bracket 14 for mounting a lead frame 12 having pressure responsive electrical switches 20 is provided with a pair of bores 88 through the bracket at each switch station in alignment with recessed portions 78 and 86 in the bottom surface of the switch housing. A layer 92 of filter material is disposed between the bores and the recessed portions so that fluid flowing through the bores into the recessed portions will be forced to flow through the filter material to exclude particles of contamination larger than a selected size.

Abstract: A surge protection device to protect telecommunication equipment coupled to telephone lines is shown having in a first embodiment three cells with each cell having a semiconductor element with a reverse breakdown PN junction mounted on a heat sink. The device includes a lead frame having a first pair of leads formed with a platform raised out of the plane of the remainder of the lead frame to provide suitable clearance relative to the semiconducting elements and each platform has a finger extending downwardly into engagement with a top electrode of a respective semiconducting element and is soldered thereto. A second lead lies in the plane of the lead frame and is soldered to a first heat sink plate mounting two semiconducting elements and another finger extending from one of the platforms is soldered to a second heat sink plate mounting the third semiconducting element. The heat sinks, semiconducting elements and portions of the leads are encapsulated in thermally conductive, electrically insulative epoxy.

Abstract: A multi-level lead frame configuration (114) for an integrated circuit chip (116) comprises a main lead frame (115) having a plurality of lead frame bond fingers (122 and 124) that directly connect to a plurality of bond pads (126) on the integrated circuit chip (116). Associated with the main lead frame (115) is a bus bar lead frame (128 and 130) having a plurality of bus bar lead fingers (118 and 120) that directly connect to a second plurality of inner bond pads (126) on the integrated circuit chip (116). The bus bar bond fingers (118 and 120) associate with the main lead frame (115) and main lead frame bond fingers (122 and 124) to permit a lead-on-chip configuration of the main lead frame and the bus bar lead frame.

Abstract: A low pressure monitor for hybrid air bag systems for vehicles includes a pressure responsive disc 34.6 exposed on one side to a reference pressure chamber 34.11 and on the other side to the pressure in an air bag bottle 40 and positioned adjacent a movable arm 28.10 of an electric switch, The switch includes an electrically conductive sheet having a first portion partially encased in a base 26 of electrically insulative material and being connected to a first terminal 14 and a second portion forming the movable contact arm 28.10 extending from the insulative material and culminating with a portion formed with contact rib 28.14 adapted to be received beneath a laterally extending stationary contact portion 22 of a second terminal 16. Tabs 28.4, 28.6 extend from the sheet out of the insulative material for connection to a resistor 30 mounted on the electrically insulative base and a frangible portion 28.

Abstract: A surge protection device to protect telecommunication equipment coupled to telephone lines is shown having in a first embodiment three cells with each cell having a semiconductor element with a reverse breakdown PN junction mounted on a heat sink. The device includes a lead frame having a first pair of leads formed with a platform raised out of the plane of the remainder of the lead frame to provide suitable clearance relative to the semiconducting elements and each platform has a finger extending downwardly into engagement with a top electrode of a respective semiconducting element and is soldered thereto. A second lead lies in the plane of the lead frame and is soldered to a first heat sink plate mounting two semiconducting elements and another finger extending from one of the platforms is soldered to a second heat sink plate mounting the third semiconducting element. The heat sinks, semiconducting elements and portions of the leads are encapsulated in thermally conductive, electrically insulative epoxy.

Abstract: System and method to achieve high resolution and sensitivity from scanned focal plane array detectors without generating objectionable articfacts by scanning a scene in alternate odd and even channels at a predetermined scanning rate to provide a plurality of equally time spaced samples in each channel, offsetting the samples in the even channels relative to the odd channels to be time spaced intermediate adjacent samples of the odd channels, forming a plurality of odd TV lines, each of the odd lines composed of the samples from a different one of the odd channels and the interstices between the samples in each of the odd lines being composed of a sample which is a function of the samples abutting each of the interstices in the odd lines, forming a plurality of even TV lines, each of the even lines composed of the samples from a different one of the even channels and the interstices between the samples in each of the even lines being composed of a sample which is a function of the samples abutting each of the

Abstract: An absorber for a microwave module and method of fabrication thereof wherein an ink is provided from a mixture of powdered iron and a resin. The ink is then screen printed or mask printed onto the interior surface of the lid of the microwave module in a predetermined pattern to lower the Q of the cavities within the module. The lowered Q suppresses the electromagnetic resonance and thereby minimizes the EMI problems. Furthermore, the absorber material reduces EMI between sections of the module at frequencies where no cavity resonances occur.

Abstract: A pupil/image reversal prism (FIG. 2) forms a pupil at an image location. Such a prism has specific applicability in a DCR scheme for a thermal imaging system (FIG. 3a, 31 and 32) in which a passive DCR source is implemented by a pupil imager that forms a pupil onto the image of a thermal scene, thereby providing scene-average radiation to a thermal detector array. The pupil/image reversal prism including an input reflective surface (A), an output reflective surface (B) , a positive reflective surface (C) and an intermediate folding reflective surface (D). The reflective surfaces A and B use total internal reflection to provide both transmissive and reflective operation.

Abstract: Thermoplastic printed wiring board spacers are fabricated by providing a water soluble partially hydrolyzed polyvinyl alcohol resin or fully hydrolyzed polyvinyl alcohol resin or a blend of partially hydrolyzed polyvinyl alcohol resin and fully hydrolyzed polyvinyl alcohol resin, the ration thereof depending upon (1) the degree of hydrolyzation of the polyvinyl alcohol resins, (2) crystallinity associated with particular polyvinyl alcohol resins, (3) the fabrication temperatures of the printed wiring board to avoid spacer melting and (4) the degree of solubility in water of the spacer. The spacers are fabricated by injection molding the polyvinyl alcohol resins or desired polyvinyl alcohol resin mixture to provide a molded configuration having a runner system with spacers attached to a sub runner system by a very thin gate.

Abstract: A protectively coated optical device which includes an infrared transmissive optical surface and an infrared transmissive polymer coating on the surface having low hardness, high strength and low elastic (Young's) modulus and is transmissive in the 8 to 12 micrometer wavelength range. The hardness is less than 50 kg/mm.sup.2, the strength is from about 10,000 to about 100,000 psi and the elastic (Young's) modulus is from about 0.2.times.10.sup.6 to about 3.times.10.sup.6 psi.

Abstract: There are provided low profile inductor and transformer windings, and methods for fabricating the same. An elongate conductive ribbon is wound in one continuous direction on a generally hourglass shaped mandrel to form the ribbon into a double conical helix having a plurality of spaced apart coils. A sheet of dielectric material having an orifice therethrough is threaded to the midpoint of the double conical helix. The two sides of the helix are then compressed into planes such that the coils in each side lie flat and engage the adjacent side of the sheet of dielectric material. A compound inductor winding can be fabricated from a continuous conductive ribbon wound into a plurality of double conical helixes joined end-to-end. After compression, the compound winding consists of a low profile stack of spiraled windings connected in series, but constituting only one continuous ribbon having no internal connections.

Abstract: A socket with a base and a reciprocating cover for use in the burn-in test of an electrical part which is characterized in that during the time from immediately before mounting of the electrical part to the completion of mounting thereof, the electrical part is moved in such a manner that a terminal lead of the electrical part will come in contact and wipe a contact element of the socket so that any oxide film on the surface of the contact element of socket is removed. Also, a latch can be provided for holding the socket in desired mounting position during the above described wiping and contacting procedure.

Abstract: A socket for use in the burn-in test, which is characterized in that a contact element and a fixed member are displaced from their original positions in connection with the forward motion of the cover member for charging an IC package into the main socket body. Upon the return of the fixed member and the contact element to their respective initial positions, the leads of the IC package are held between them, thereby carrying out the reliable fixing of the IC package. Additionally, the fixed member is integrally constructed with a compressive part of molded resin and a metal part that supports the compressive part.

Abstract: A PNPN semiconductor device has an inner P-type region which includes at least one ridge which extends into its outer N-type region and terminates short of the outer boundary of the outer N-type region, the inner P-type region includes a formation which is substantially level with the outer boundary of the outer N-type region, and the device includes a terminal which contacts the outer N-type region and the formation of the inner P-type region.An alternative structure of the PNPN semiconductor device has an inner P-type region having at least one elongate sub-region, of higher conductivity than the remainder of the inner P-type region, lying along the junction between the inner P-type region and the outer N-type region, the formation which is substantially level with the outer boundary of the outer N-type region, and the terminal which contacts the formation and the outer N-type region.