Abstract: A multi-chip integrated circuit module includes a supporting layer of laminate material over which a high-density interconnect structure is formed. The laminate layer includes a first upper laminate layer (10) having a hole (14) disposed therein for receiving an integrated circuit chip die (56). A lower core laminate layer (16) having a conductive layer (18) and conductive layer (20) disposed on opposite sides thereof is laminated to the lower surface of the layer (10). Plated-through holes (36), (38) and (40) are formed through the two layers (10) and (16) to connect the conductive layer (20) with a conductive layer (12) on the upper surface of the layer (10). A high-density interconnect layer includes two laminate layers (126) and (138), each having vias formed therethrough and via interconnect structures disposed on the surfaces thereof. The via interconnect structures in the layer (126) allow for connections from the die (56) to the conductive layer (12).

Abstract: This invention relates to an improved solid state suppressor and a method for making the same. Due to the fact that at least part of the substrate is substituted during fabrication of the suppressor, it is possible to produce a suppressor having a substrate which has an effective thickness that is less than the physical thickness of the slice. This allows for a good functioning suppressor which is unlikely to break during fabrication.

Abstract: A staring focal plane architecture that utilizes a frame buffer to meet the requirements of multiple applications. The frame buffer can be implemented in the array unit cell or external to the unit cell. The frame buffer allows windowing or outputting subsections of the array. Multiple windows per frame can also be outputs. Other features such as electronic dezoom are also supported. The frame buffer allows a high degree of flexibility and in the case where the frame buffer is external to the cell high dynamic range.

Abstract: Only the areas of the CdTe/HgCdTe interface of a FPA detector circuit which is coupled by an epoxy to a silicon-based integrated circuit that require interdiffusing are heated to a sufficiently high temperature or have photons of light impinging thereon for a sufficient time to cause interdiffusion of the two layers by the travel of tellurium into the HgCdTe and the travel of mercury into the CdTe. The vast majority of the wafer is masked with an aluminum thin film to greatly reduce heat gain or photon transmission. An advantage of the process in accordance with the present invention is that only a very small fraction of the HgCdTe/epoxy/silicon-based integrated circuit wafer receives incoming energy during interdiffusion whereby problems caused by the differences in coefficient of thermal expansion between silicon and HgCdTe at the epoxy interface are minimized.

Abstract: A three dimensional display having a rotating screen, preferably helical in shape, a light source providing a beam of light and a holographic pattern deflecting the beam of light to predetermined points on the screen. The light is modulated, preferably by the holographic pattern. The holographic pattern rotates with the same angular velocity as the screen. The holographic pattern comprises a plurality of concentric circles, each of the circles comprising a plurality of cells, each of the cells representing a point on the screen.

Abstract: This invention describes a maintenance termination unit often used in telephone lines and particularly the triggering circuit for use in such units. The triggering circuit uses two complementary transistors Q1, Q2 and a diode Z1 along with a resistor R and capacitor C2 in specific electrical connection sequence to provide for "turn-on" by either reaching the preset "turn on" voltage or by having a significantly high rate of voltage rise.

Abstract: An accelerometer device comprises a silicon semiconductor member having a mass mounted on a support by integral beams extending between the mass and support to permit movement of the mass in response to acceleration. Piezoresistive sensors are accommodated in the beams for sensing strain in the beams during movement of the mass to provide an output signal from the device corresponding to the acceleration. The beams each have an end secured to the support and an end secured to the mass and taper intermediate the beam ends to provide a high and substantially uniform strain throughout the tapered section of the beam. The piezoresistive sensor is accommodated in the tapered beam section to be responsive to that high, uniform strain.

Abstract: An antenna system and method comprising an antenna having 2+N antenna elements, where N is zero or an odd integer, an algorithm controlled switching circuit having a separate switch associated with each of the elements and a switch control selectively causing the switching circuit to couple an adjacent pair of the antenna elements to their associated switches while maintaining the remaining switches uncoupled from their associated antenna elements. The algorithm controlled switch control includes circuitry for successively coupling each adjacent antenna element pair of the antenna elements to their associated switches, determining a predetermined parameter for each of the antenna element pair and then causing the antenna system to operate with only one of the antenna pairs responsive to determination of the predetermined parameter.

Abstract: A method of making a hybrid semiconductor device and the device comprising providing a semiconductor substrate having electrical devices therein, providing a first resilient layer of electrically insulating material over the substrate which can be disposed directly onto the substrate with a substantially planar exposed surface, providing a second resilient layer of electrically insulating material over the first resilient layer which can be disposed directly onto the first layer with a substantially planar exposed surface, the second layer having a relatively resilient state and a rigid state, providing resilient standoff from the third resilient layer at spaced locations on the second layer by removing predetermined portions of the third layer, securing a semiconductor superstrate to the semiconductor device, forming electrical devices on the superstrate, and then connecting the electrical devices on the superstrate to the electrical devices on the substrate.

Abstract: A system for dissipating heat from semiconductor chips disposed on a substrate which may individually produce differing amounts of heat, the substrate secured to a device uniformly distributing the heat produced by the chips thereover in the form of a metal matrix composite of a thermally conductive material, preferably aluminum or copper, having layers of uniformly spaced fibers, preferably carbon, with a higher thermal conductivity than the metal of the metal matrix and embedded therein. Each layer has a plurality of such fibers in rows, each layer being orthogonal to the layers thereabove and therebelow. Preferably, none of the carbon fibers touch each other. The metal matrix is secured to a heat dissipating structure in the form of a housing having a sponge secured therein. The sponge is preferably of aluminum or copper and has a cellular structure, the cells having interconnecting porosity.

Abstract: A semiconductor component for limiting transient voltages on the signal or other supply lines of a system, includes, in a common semiconductor body, a plurality of multi-junction diodes connected in the same sense between a common terminal and respective input means which are for connection to the respective supply lines of the system, and a respective further diode connected in shunt with each multi-junction diode with the opposite sense to the multi-junction diode.

Abstract: A thermal control system in which a boiling liquid refrigerant is vaporized by heat addition from the system electronics. The pressure on the boiling liquid refrigerant and the vaporized refrigerant thereover is maintained constant so that the temperature of vaporization is maintained constant. For this reason, the boiling liquid refrigerant rapidly vaporizes and concomitantly removes from the system the very large amount of heat required for the refrigerant to pass from the liquid to the gaseous phase. The heat transfer rates under these conditions are extremely high. In addition to heat addition to the liquid before vaporization, the mass of liquid vaporized absorbs heat during vaporization of the liquid. The transition from liquid to vapor occurs at a constant temperature which is controlled by controlling the pressure at which the vaporization takes place.

Abstract: An absorber for a microwave module and method of fabrication thereof wherein an ink is provided from a mixture of powdered iron and a resin. The ink is then screen printed or mask printed onto the interior surface of the lid of the microwave module in a predetermined pattern to lower the Q of the cavities within the module. The lowered Q suppresses the electromagnetic resonance and thereby minimizes the EMI problems. Furthermore, the absorber material reduces EMI between sections of the module at frequencies where no cavity resonances occur.

Abstract: A low voltage terminal board interfaces a fan motor with a field thermostat. The board includes a power supply providing a 24 volt DC power source for driving an electronic air cleaner relay and fan motor control lines and a 5 volt DC power source for providing optical isolation and timing logic. Several heater stage signals are connected to a diode interlock network so that no matter which signal is generated the first electric stage heater is energized. A first optically coupled isolator receives a 240 volt AC input whenever the first stage electric heater is energized with the isolator output controlling energization of a heat or medium speed operation of the fan motor. Second and third optically coupled isolators receive a 24 volt AC input indicative of continuous fan operation and compressor operation respectively with the outputs controlling energization of low (on/off) fan speed operation and high speed fan operation respectively.

Abstract: There is disclosed a method and system for controlling the optics of a coherent light source impacting a three dimensional defined volume. The system uses a scanner to time and spatially position the coherent light. The divergent light beam output of the scanner is then placed through positive and negative lenses to narrow the beam waist while also increasing the divergence angle of the beam. Provision is made to abate the divergence angle so that the light, as it impacts the defined volume, will not continue to diverge, creating a skewed image within the volume.

Abstract: A light absorbing, low reflectance coating and method of fabricating the coating provided by electron beam evaporation of aluminum onto substrates bombarded with nitrogen ions to produce a randomly textured coating which traps light in a labyrinth. The coating is electrically insulating except for the first few tens of atoms which remain metallic. Absorptance exceeds 90% in the 0.4 to 16 .mu.m region. The coating is flexible and can be deposited on a polymer base.

Abstract: A digitally controlled programmable transversal filter (DCPTF) employing a lithium niobate surface acoustic wave (SAW) delay line and two large scale integration (LSI) gallium arsenide integrated circuits to digitally control the magnitude and sign of the 32 tap weights from the delay line. The DCPTF results in a significant reduction in size over the prior art with little sacrifice in performance. The DCPTF is completely programmable and is constrained only by the bandwidth and the number of taps.

Abstract: An electrically insulating body having rows of electrical contact receiving apertures is shown in which solder tail electrical contacts, such as screw machine contacts, either of the pin or receptacle type, are removably received in the apertures. The electrical contacts are free to move in their seats within preselected limits to lower connector mating forces.

Abstract: A capped MMIC and method of making same wherein a polymer layer cast over the surface of a semiconductor wafer and vias are formed in the polymer layer down to the wafer surface. The exposed surface of the polymer layer is then metallized and etched in a predetermined pattern to provide a metal pattern over the upper surface of the polymer layer which extends into the vias and to the surface of the wafer. Pads of the metallization are also provided on the upper surface of the polymer layer which are individually electrically isolated from the remainder of the metallization. The wafer is now ground back and backside metallization and other desired processing then takes place in standard manner to complete fabrication of the individual MMICs on the wafer. The MMICs are then diced in standard manner. The MMICs can be secured in a housing fabricated of ceramic or metal. The housing has a plurality of cavities, each cavity for receipt of a MMIC or MMICs.

Abstract: A package for electrical circuitry and method of making same wherein the package is provided with apertured ceramic side walls. Ceramic layers, which have been previously co-fired together and have an aperture therethrough for receiving a copper-based lead, are positioned in each of the apertures along with a copper-based lead. A Kovar braze washer, which has an aperture therein having approximately the same dimensions as the outside dimensions of the lead is positioned over the lead and against the ceramic layers and brazed to these layers and the lead to provide an hermetic seal. A good electrical conductor is then brazed to the portion of the lead extending external to the package.