Patents Represented by Attorney Ronald M. Goldman
  • Patent number: 7319039
    Abstract: The presence of an aerosol or cloud (3) of a toxic substance is detected by producing an aerosol (17, 5) of ligands (13) to the target substance in a region of sky that contains the target substance, permitting molecules the target substance to bind to the ligand, directing light (7, 21) of a first frequency into the revised aerosol; and then inspecting (9, 25) the revised aerosol for emissions of light of a second frequency. When light of the second frequency exists an alarm (15, 31) is initiated.
    Type: Grant
    Filed: November 9, 2004
    Date of Patent: January 15, 2008
    Assignee: Northrop Grumman Corporation
    Inventor: Brian M. Sullivan
  • Patent number: 7243757
    Abstract: An exhaust muffler (1) invention includes an entry chamber (9), a resonator chamber (15), and a baffle chamber (23) positioned in serial order between an exhaust gas inlet (3) that lets exhaust gas into the entry chamber and an exhaust gas outlet (5) from the baffle chamber that lets the exhaust gas exit to the exterior. A pass-through tube (21) provides an exhaust gas passage extending from the first entry chamber, through the resonator chamber and into the baffle chamber; and a baffle system (2,4,6, 8, 10, 12 & 14) located in the baffle chamber, contains a plurality of baffles positioned between the resonator chamber at one end and said exhaust gas outlet at the other end for reflecting sound admitted into said baffle chamber via said pass-through tube, whereby interference patterns of reflected sound are produced that lessen the intensity of the sound that exits along with exhaust gas from said outlet tube.
    Type: Grant
    Filed: October 28, 2004
    Date of Patent: July 17, 2007
    Assignee: Edelbrock Corporation
    Inventor: Karl Bernard Stuber
  • Patent number: 7213703
    Abstract: A reusable package and storage album (1) displays and stores a multi-component product, combining the appearance of a blister pak with the security of a vacuformed clamshell package. Two sections (17 & 19) joined by hinges (43 & 45) to a spine (21), formed principally of plastic (11) and paperboard (9) materials, fold into a book or album-like structure to house the product components. Ample advertising space (9) is available on the exterior (3, 2, 21) and interior (23) surfaces for a layer of printed matter (13). The album type storage (17, 37, 19, 23) is helpful, discourages disposal of the packaging, which aids the environment, and allows manufacturer advertising and other printed information to persist beyond the sale. Hinges (43, 45) comprise an inverted rectangular U-shape in section in geometry. Windows (5, 7, 12) may be included to allow a view of the components.
    Type: Grant
    Filed: July 13, 2005
    Date of Patent: May 8, 2007
    Assignee: AVC Corporation
    Inventor: Moshe Yair Begim
  • Patent number: 7162793
    Abstract: Reflow soldering of a variety of circuit boards (9, 11, 15) in a variety of sizes and shapes to assigned locations on the base or carrier (13) of the electronic module housing (3) is simplified by eliminating custom made metal blocks previously used to clamp the circuit boards against the carrier metal. Instead, the solder-backed circuit boards are placed in assigned positions in the module housing and the inside volume of that housing is filled (22) with particulate, such as small beads (17), covering the circuit boards, but leaving the edges of the upstanding metal shields (5 and 7) visible. A plate (21) backed foam sheet (19) is placed over the module housing (24) and clamped down (26), pressing against the beads. The clamped assembly is then heated (28) to reflow the solder, soldering the circuit boards in place.
    Type: Grant
    Filed: November 7, 2003
    Date of Patent: January 16, 2007
    Assignee: Northrop Grumman Corporation
    Inventors: Mark Kintis, Charles G. Turner
  • Patent number: 7157706
    Abstract: A continuously variable diaphragm or swappable fixed aperture for use in thermal infrared cameras, which aperture or diaphragm can be cooled to cryogenic temperatures. The invention contemplates mounting aperture control means, if necessary, in a vacuum or extending the control mechanism through a vacuum in a thermally isolated manner to avoid radiation load on the photocell. The inventive method implements such a diaphragm and control system. The invention makes possible the object of using a single thermal infrared camera under a wide variety of target-scene radiation conditions that may be rapidly changing, with interchangeable or zoom camera lenses requiring matching or different size cold stops, and under other such dynamic situations.
    Type: Grant
    Filed: May 28, 2003
    Date of Patent: January 2, 2007
    Assignee: Opto-Knowledge Systems, Inc.
    Inventors: Nahum Gat, John Dwight Garman
  • Patent number: 7081366
    Abstract: A primary antibody bead suspension for an enzyme-linked immunoassay (“ELISA”) procedure is formed of a quantity of primary antibody coated magnetic beads (3) uniformly dispersed and held in suspension (9) by a thixotropic non-Newtonian fluid (1). To remove the thixotropic non-Newtonian fluid prior to application in the ELISA procedure, a magnet (12) is placed against the side of the non-magnetic vessel (9) holding the suspension to draw the magnetic beads against the side while the thixotropic fluid is washed away by pumping (14,16,15& 17) and replaced by a saline buffer solution.
    Type: Grant
    Filed: June 2, 2003
    Date of Patent: July 25, 2006
    Assignee: Northrop Grumman Corporation
    Inventors: Brian M. Sullivan, Denes L. Zsolnay
  • Patent number: 7044266
    Abstract: Performance sound is produced with a muffler that includes a casing with front (5, 37), rear (7, 41) and side (3, 35) walls, first (9, 45) and second (11, 47) compartment walls each with a central passage (25, 28, 46, 48) and side circular passages (26, 27, 26?, 27?). The first compartment wall is spaced behind the exhaust gas inlet (6, 39). The second compartment wall is spaced in front of the rear wall. A first divider baffle (21, 21?) divides one side passage in the first compartment wall into a plurality of passages, and a second divider baffle (23, 23?) divides the second side passage in the first compartment wall into a plurality of passages. An elongate louvered tubular member (13, 13?) between the first and second compartment walls receives exhaust gas from the first compartment and permits exhaust gas to exit into the second compartment.
    Type: Grant
    Filed: November 13, 2003
    Date of Patent: May 16, 2006
    Inventor: Ronald James Petracek
  • Patent number: 7041579
    Abstract: Die of high aspect ratio formed in a hard wafer substrate are sawed out without requiring tape, obtaining high die yields. Preliminary to sawing the semiconductor die (3) from a sapphire wafer (2), the wafer is joined (20) to a silicon carrier substrate (6) by a thermoplastic layer (4) forming a unitary sandwich-like assembly. Sawing the die from the wafer follows. The thermoplastic is removed, and the die may be removed individually (50) from the silicon carrier substrate. Thermoplastic produces a bond that holds the die in place against the shear force exerted by the saw and by the stream of coolant (30).
    Type: Grant
    Filed: October 22, 2003
    Date of Patent: May 9, 2006
    Assignee: Northrop Grumman Corporation
    Inventors: Michael Edward Barsky, Michael Wojtowicz, Rajinder Randy Sandhu
  • Patent number: 6959809
    Abstract: A reusable package and storage album (1) displays and stores a multi-component product, combining the appearance of a blister pak with the security of a vacuformed clamshell package. Two sections (17 & 19) joined by hinges (43 & 45) to a spine (21), formed principally of plastic (11) and paperboard (9) materials, fold into a book or album-like structure to house the product components. Ample advertising space (9) is available on the exterior (3, 2, 21) and interior (23) surfaces for a layer of printed matter (13). The album type storage (17, 37, 19, 23) is helpful, discourages disposal of the packaging, which aids the environment, and allows manufacturer advertising and other printed information to persist beyond the sale. Hinges (43, 45) comprise an inverted rectangular U-shape in section in geometry. Windows (5, 7, 12) may be included to allow a view of the components.
    Type: Grant
    Filed: February 24, 2003
    Date of Patent: November 1, 2005
    Assignee: AVC Corporation
    Inventor: Moshe Yair Begim
  • Patent number: 6933143
    Abstract: An electronic controller, such as a programmed microcontroller, controls a series of pumps to automatically sequence the pumping of the individual fluids required by the ELISA procedure into a cell (or cells) necessary to produce a reporter, including the addition of o-nitrophenyl beta-D galactopyranoside substrate of the enzyme (“ONP-GP”), control the positioning of the carrier of the reporter adjacent the reporter sensor, analyze the data obtained from the reporter sensor and display the concentration of the bioagent determined from the analysis of the foregoing data. Once started, the apparatus, governed by the program, conducts the test automatically in the shortest time known to date, without the necessity for human intervention.
    Type: Grant
    Filed: February 25, 2003
    Date of Patent: August 23, 2005
    Assignee: Northrop Grumman Corporation
    Inventors: Brian M. Sullivan, Denes L. Zsolnay
  • Patent number: 6919125
    Abstract: Ceramic substrates (1) for microelectronic modules are formed in multiple layers (7 & 9) fused into a unitary one-piece assembly. The layers contain the same ceramic material but in different purity so that one outer layer (9) is optimal in composition for bonding to a thick film conductor (11) and the other outer layer (7) is optimal in composition for bonding to a thin film conductor (13). In a dual composition substrate embodiment one layer is formed of a 96% alumina composition and the second layer is formed of a 99.6% alumina composition.
    Type: Grant
    Filed: August 1, 2003
    Date of Patent: July 19, 2005
    Assignee: Northrop Grumman Corporation
    Inventors: Kriss Allen Bennett, Roy Tom Coyle
  • Patent number: 6919863
    Abstract: An integral reflector-boom assembly (1) for a deployable antenna includes a facesheet (9) of stiff reflective material and a stiff lattice or grid structure bonded to the facesheet to form a reflector (3) portion of the assembly and a boom (5). Interlocked ribs (13, 15, 17 & 19) are arranged in a pattern that defines an isogrid structure in the reflector portion and at least a part of the boom assembly. Some of the ribs (13) extend in one piece from the reflector portion through the boom portion.
    Type: Grant
    Filed: October 6, 2003
    Date of Patent: July 19, 2005
    Assignee: Northrop Grumman Corporation
    Inventors: Kenneth W. Kawahara, Kenneth A. Kaufman, Garrett R. Wittkopp
  • Patent number: 6917537
    Abstract: Superconductor technology and Batcher banyan switching technology are combined and implemented as a practical component in a single cryo-MCM substrate (10) containing a plurality of superconductor chips (37, 38, 39, 41, 42, 43, 44, 46, 48, 49, 51, 53 and 55) arranged in a plurality of rows and columns. Wiring (52) on the substrate connects the chips in each row of a number of the columns (41, 43, 45, 47, 49, 51 & 53) serially to collectively define a Batcher sorter. Other wiring (52) connects the chips in each row of a number of other columns (40, 42, 44 & 48) in reverse banyan and banyan networks. The foregoing includes a novel superconductor Batcher two-bit serial sorter (FIG. 8) and trap (FIG. k9).
    Type: Grant
    Filed: August 11, 2003
    Date of Patent: July 12, 2005
    Assignee: Northrop Grumman Corporation
    Inventor: Paul I Bunyk
  • Patent number: 6888253
    Abstract: An inexpensive package for a semiconductor chip (1) that incorporates a stress relief buffer (13) between a side of the chip and the metal carrier layer (2) to absorb thermally induced stress produced by significantly different rates of thermal expansion of the wafer and the metal carrier. The buffer (13) is formed by a polymer that is flexible and can be etched, contains a coefficient of thermal expansion that does not significantly differ from that of the chip and/or a combination of CET and elasticity that retains a physical connection with the side of the chip and the metal carrier over the temperature range of operation anticipated for the chip. Polyimide or paraylene are preferred examples. Vias (15) extend through the buffer to place the metal carrier electrically in common with the metal layer (5) found on the back surface of the wafer so that an electrical ground applied to the metal carrier layer (2) may extend through to that surface.
    Type: Grant
    Filed: March 11, 2004
    Date of Patent: May 3, 2005
    Assignee: Northrop Grumman Corporation
    Inventors: Harvey Newell Rogers, Mark Kintis
  • Patent number: 6865690
    Abstract: A power module for a CNI avionics system includes a rechargeable back-up battery (17) and a battery charger (9) in a back-up battery channel, a power conversion unit (11, 25, 27 and 29) in a power conditioning channel, and a semiconductor switch (23) for selectively coupling either the output of the power conditioning channel unit or the back-up battery channel through to the module output (24) and the electronics of external LRM's of the cryptographic section of the CNI avionics system, and a microcontroller (14) for controlling voltages and spurious signal emanations. Sensors (51, 52, 54 & 55) provide information to the microcontroller. The microcontroller senses the state of prime power, current draw on the cryptographic devices and adjusts power output between the battery and power supply in real time.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: March 8, 2005
    Assignee: Northrop Grumman Corporation
    Inventor: Michael J. Kocin
  • Patent number: 6815828
    Abstract: An integrated circuit device includes a thin semiconductor layer disposed on a surface of a wafer, a plurality of wafer-scale integrated (WSI) circuits formed on the semiconductor layer, and a node formed on the semiconductor layer that provides an optoelectronic interface to an axial optical data bus for high-speed optical interconnectivity between the WSI circuits and other external devices interconnected to the optical data bus.
    Type: Grant
    Filed: July 18, 2000
    Date of Patent: November 9, 2004
    Assignee: Northrop Grumman Corporation
    Inventors: Ramon Coronel, Karen A. Fucik, Peter S. Yoon, Donald G. Heflinger
  • Patent number: 6806718
    Abstract: For qualification testing in product development, a test assembly contains a surrogate circuit board (7) and surrogate electronic modules (5) supported thereon. The terminals (5a-5j) of the modules are joined to respective bonding pads (2a-2j) on the circuit board to form bonded joints. The modules terminals and the wiring of the associated bonding pads is configured to produce at least one test series circuit (21) associated with each module that includes the bonded joints. A tester (9) supported on the circuit board monitors the test series circuit and produces a persistent indication (10) should a break or interruption occur in a bonded joint or any other portion of the test series circuit. This allows indications of transient breaks that occurred when the test assembly was being subjected to stresses, such as those induced by temperature excursions, mechanical vibration, and/or mechanical shock to be preserved and recorded at a later time.
    Type: Grant
    Filed: August 21, 2003
    Date of Patent: October 19, 2004
    Assignee: Northrop Grumman Corporation
    Inventor: Ryan S. Berkely
  • Patent number: 6803202
    Abstract: The existence of any one of a plurality of 2N−1 bioagents in a sample (1) may be determined by dividing the sample into N parts and performing separate ELISA processes (TEST 1 & TEST 2) on each of the N parts concurrently, where N is an integer greater than 1, each of the separate ELISA processes possessing the capability to identify a bioagent from a combination of possible bioagents (3), and in which the combination of possible bioagents of any one of the separate ELISA processes is different (7) from the combination of possible bioagents of any other of the separate ELISA processes.
    Type: Grant
    Filed: October 23, 2001
    Date of Patent: October 12, 2004
    Assignee: Northrop Grumman Corporation
    Inventors: Brian M. Sullivan, Denes L. Zsolnay
  • Patent number: D529441
    Type: Grant
    Filed: November 8, 2004
    Date of Patent: October 3, 2006
    Inventor: Roland Eugene LaPere
  • Patent number: D529865
    Type: Grant
    Filed: November 8, 2004
    Date of Patent: October 10, 2006
    Inventor: Roland Eugene LaPere