Abstract: Disclosed is a method of protecting an input/output packet of a USB device. The method includes: a) registering a filter driver to a USB host controller within a system, and loading the filter driver; b) generating a first filter driver object (filter device object; FiDO), monitoring input/output packets of all USB devices by attaching the first filter driver object (FiDO) to a device object (functional device object; FDO) for the USB host controller; c) determining if there is an identifier in the input/output packet; d) when it is determined that there is the identifier in the input/output packet, registering a data protection routine in the input/output packet; e) copying the input/output packet from the data protection routine to a predetermined region, and exchanging the input/output packet with a predetermined value.

Abstract: An apparatus for support a handbag from the edge of a table or other structure is presented. The apparatus includes a segmented arm that can be collapsed to allow for compact storage of the apparatus.

Abstract: A tennis ball delivery device for use in practicing one's tennis stroke. The device includes an adjustable frame, at least one declining ball delivery conduit carried by the frame in an upper portion thereof, a declining ball discharge shoot carried by and communicating with the delivery conduit and a ball release mechanism carried by the discharge conduit. The release mechanism allows a single ball to fall from the shoot in response to the activation thereof. A depending handle that can be easily struck by the player's racket in initiating their tennis stroke is operatively connected to the release mechanism so as to effect the release of the ball.

Abstract: A sacrificial coating material includes: at least one inorganic compound, and at least one material modification agent, wherein the sacrificial coating material is dissolvable in an alkaline-based chemistry or a fluorine-based chemistry. A method of producing a sacrificial coating material includes: providing at least one inorganic compound, providing at least one material modification agent, combining the at least one inorganic compound with the at least one material modification agent to form the sacrificial coating material, wherein the sacrificial coating material is dissolvable in an alkaline-based chemistry or a fluorine-based chemistry, but not organic casting solvents commonly used in organic BARC materials.

Abstract: The present invention is directed to a multi-modal wearable baby and small child carrier that is readily adjustable and which, when worn in use, leaves the wearer's arms and hands free. The carrier comprises an elongated strap attached to a flexible sheet-like body wherein the elongated strap can be worn as a neck strap or can be converted to form at least two shoulder straps, and the flexible sheet body is folded to form a positioning portion, so that the user may position the baby or small child directly in front of, or to the left or right side of the torso of an adult who is using and wearing the carrier, such that the baby can be positioned facing toward the adult or facing away from the adult.

Abstract: Layered interface materials described herein comprise at least one crosslinkable thermal interface component and at least one compliant fibrous interface component coupled to the thermal interface component. A method of forming layered interface materials comprises: a) providing a crosslinkable thermal interface component; b) providing a compliant fibrous interface component; and c) physically coupling the thermal interface component and the compliant fibrous interface component. At least one additional layer, including a substrate layer, can be coupled to the layered interface material.

Abstract: A tennis ball delivery device for use in practicing one's tennis stroke. The device includes an adjustable, moveable frame, a tennis ball carrier assembly comprising an array of ball delivery conduits carried between an upper carrier section and a lower carrier section, a ball discharge chute carried by the lower carrier section, and a rotating ball release mechanism that incrementally rotates and aligns with the next successive ball delivery conduit each time it is activated by an actuating mechanism. The actuating mechanism is positioned and configured to be struck by the player's tennis racket to activate the ball release mechanism.

Abstract: A plurality of micron-size solid particles is described herein that includes at least one polyamide compound, wherein the particles comprise a diameter in the range of about 1 micron to about 1000 microns, and wherein at least some of the plurality of particles are substantially transparent. In addition, a plurality of micron-size solid particles is described herein that includes at least one polyamide compound, wherein the particles comprise a diameter of less than about 4 microns.

Abstract: The present invention is directed to a combination yo-yo and top device comprising first and second yo-yo body halves, a hollow dowel element detachably connecting one of the yo-yo body halves to the other, a ball bearing element mounted on the hollow dowel element between the yo-yo body halves, a first flywheel assembly having an elongated flywheel axle, wherein the first flywheel assembly is adapted for attachment to the yo-yo body, a second flywheel assembly adapted for attachment to the yo-yo body, a string element having a first end coupled to the hollow dowel element, a power element adapted for attachment to either the first flywheel assembly or the second flywheel assembly to activate both flywheel assemblies, and, at least one removable top component adapted to be secured to the yo-yo body to convert the device from a yo-yo to a top.

Abstract: Remote enclosure systems have now been designed that meet the following goals: a) consolidate electrical terminations in one system; b) pre-terminate AC and DC equipment loads before site installation; c) provide multiple access points for facilitating equipment repair and installation; d) are easily configurable and expanded through the use of a modular frame design that accommodates a variety of customized side panels or the attachment of a variety of expansion cabinets; e) are aesthetically functional given the cable entry and routing structure; f) provide exceptional thermal management and g) reduce problems inherent in conventional electronic setups. Remote enclosure systems contemplated generally include: a) a frame system further comprising at least two side panels; b) at least one door coupled to the frame system; c) a cable management top assembly coupled to the frame system; d) at least one removable radio frequency (RF) management system.

Abstract: An interface material comprising a resin mixture and at least one solder material is herein described. The resin material may comprise any suitable resin material, but it is preferred that the resin material be silicone-based comprising one or more compounds such as vinyl silicone, vinyl Q resin, hydride functional siloxane and platinum-vinylsiloxane. The solder material may comprise any suitable solder material, such as indium, silver, copper, aluminum and alloys thereof, silver coated copper, and silver coated aluminum, but it is preferred that the solder material comprise indium or indium-based compounds and/or alloys. The interface material, or polymer solder, has the capability of enhancing heat dissipation in high power semiconductor devices and maintains stable thermal performance. The interface material may be formulated by mixing the components together to produce a paste which may be applied by dispensing methods to any particular surface and cured at room temperature or elevated temperature.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: Anti-reflective coating materials for ultraviolet photolithography include at least one organic light-absorbing compound incorporated into spin-on-glass materials. Suitable absorbing compounds are strongly absorbing over wavelength ranges around wavelengths such as 365 nm, 248 nm, 193 nm and 157 nm that may be used in photolithography. A method of making absorbing spin-on-glass materials includes combining at least one organic absorbing compound with alkoxysilane or halosilane reactants during synthesis of the spin-on-glass materials.

Abstract: Methods are provided for removing edge beads from spin-on films. A spin-on film is removed from a region of a surface of a spin-coated substrate adjacent to an edge of the surface by spinning the spin-coated substrate, expanding a fluid through a nozzle to form a cryogenic aerosol stream, and directing the cryogenic aerosol stream against the spin-on film in the region as the substrate spins. In another aspect of the invention, a film is formed on a surface of a substrate by dispensing a liquid composition onto the surface, spinning the substrate to distribute the liquid composition to form a substantially uniform film on the surface, expanding a fluid through a nozzle to form a cryogenic aerosol stream, and directing the cryogenic aerosol stream against the film in a region of the surface adjacent to an edge of the surface as the substrate spins. The film may include an alkoxysilane and a low volatility solvent. The fluid may consists essentially of liquid carbon dioxide.

Abstract: Dual damascene methods of fabricating conducting lines and vias in organic intermetal dielectric layers utilize sacrificial inorganic dielectrics. In one embodiment, a via opening formed in organic intermetal dielectric layers is filled with sacrificial inorganic dielectric. A line opening is formed aligned with the via opening. The sacrificial inorganic dielectric is selectively removed. The via and line openings are filled with conducting material. In a second embodiment, a line opening formed in organic intermetal dielectric layers is filled with sacrificial inorganic dielectric. A via opening is formed aligned with the line opening. The sacrificial inorganic dielectric is selectively removed. The via and line openings are filled with conducting material. The sacrificial inorganic dielectrics protect the organic intermetal dielectric layers, preserving critical dimensions and facilitating photoresist rework.

Abstract: A method of producing a highly stable packaging substrate in which are provided a first precursor having a first backbone and a first ethynyl group, and a second precursor having a second backbone and a second ethynyl group. Furthermore provided is a crosslinker having a first and a second reactive group. The first precursor, the second precursor, the crosslinker, and a solvent are applied onto a surface to form an electrically insulating layer. The first ethynyl group is reacted with the first reactive group in a first carbon-carbon bond formation reaction and the second ethynyl group is reacted with the second reactive group in a second carbon-carbon bond formation reaction to crosslink the first backbone with the second backbone, thereby forming the packaging substrate. The solvent is removed in a further step.

Abstract: In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.

Abstract: A low dielectric constant material has a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbones are crosslinked via the first and second reactive groups in a crosslinking reaction without an additional crosslinker, and wherein a cage structure having at least 10 atoms is covalently bound to at least one of the first and second backbone.