Abstract: A method for depositing metal on a semiconductor device having a substrate, an exposed first surface, and an exposed second surface is provided. Metal ions are deposited on the exposed first surface and on the exposed second layer by applying a first voltage between the substrate and an anode in the presence of an electrolytic bath, and metal ions are removed from the exposed first surface by applying a second voltage between the substrate and the anode in the presence of the electrolytic bath. Other aspects and embodiments are provided herein.

Abstract: Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.

Abstract: A conductive system and a method of forming an insulator for use in the conductive system is disclosed. The conductive system comprises a foamed polymer layer on a substrate. The foamed polymer layer has a surface that is hydrophobic, and a plurality of conductive structures are embedded in the foamed polymer layer. An insulator is formed by forming a polymer layer having a thickness on a substrate. The polymer layer is foamed to form a foamed polymer layer having a surface and a foamed polymer layer thickness, which is greater than the polymer layer thickness. The surface of the foamed polymer layer is treated to make the surface hydrophobic.

Abstract: Structures and methods for memory devices are provided which operate with lower control gate voltages than conventional floating gate transistors, and which do not increase the costs or complexity of the device fabrication process. The novel memory cell includes a source region and a drain region separated by a channel region in a horizontal substrate. A first vertical gate is separated from a first portion of the channel region by a first oxide thickness. A second vertical gate is separated from a second portion of the channel region by a second oxide thickness. The total capacitance of these memory devices is about the same as that for comparable source and drain spacings. However, the floating gate capacitance (CFG) is much smaller than the control gate capacitance (CCG) such that the majority of any voltage applied to the control gate will appear across the floating gate thin tunnel oxide.

Abstract: A method, apparatus, system, and signal-bearing medium that in an embodiment determine a degree of correlation between a speaker output signal and a microphone input signal and modulate an adaptive gain of an acoustic echo canceller based on the degree of correlation.

Abstract: Structures are provided for multiple oxide thicknesses on a single silicon wafer. In particular, structures are provided for multiple gate oxide thicknesses on a single chip. The chip can include circuitry including but not limited to the memory and logic technologies. These structures for multiple oxide thickness on a single silicon wafer can be used in conjunction with existing fabrication and processing techniques with minimal or no added complexity. One structure includes a top layer of SiO2 on a top surface of a silicon wafer and a trench layer of SiO2 on a trench wall of the silicon wafer. The trench wall of the silicon wafer has a different order plane-orientation than the top surface. The thickness of the top layer is different from a thickness of the trench layer.

Abstract: A method of enhancing the quality of data stored in a system includes receiving data from a first data enterer, accepting data received from the first data enterer into the system if the data are entered in a format compliant with a first set of rules, receiving first additional data from a second data enterer, the first additional data being related to the data received from the first data enterer, and accepting first additional data received from the second data enterer into the system if the data are entered in a format compliant with a second set of rules.

Abstract: A method for forming a semiconductor on insulator structure includes providing a glass substrate, providing a semiconductor wafer, and performing a bonding cut process on the semiconductor wafer and the glass substrate to provide a thin semiconductor layer bonded to the glass substrate. The thin semiconductor layer is formed to a thickness such that it does not yield due to temperature-induced strain at device processing temperatures. An ultra-thin silicon layer bonded to a glass substrate, selected from a group consisting of a fused silica substrate, a fused quartz substrate, and a borosilicate glass substrate, provides a silicon on insulator wafer in which circuitry for electronic devices is fabricated.

Abstract: Integrated modeling and symbolic manipulation is leveraged for the derivation, construction, maintenance, and reuse of application-independent models. Related models created for different applications share a common ancestry and maintain model consistency while enabling the models to share information about the process. Environment independent proper ancestor models (PAMs) are created for generic components of a process, such as a distillation or flash column. Models underlying an application may be comprised of various representations of multiple such processes corresponding to many different physical components. PAMs contain symbolic representations of different sub processes that occur within a process or component. A user makes assumptions about the component, by indicating how sub processes are to be considered or not considered. PAMs are then modified in accordance with the assumptions to derive a specific environment model (SEM).

Abstract: According to the present invention, there is provided a wastewater processing apparatus and method comprising a rotating filter thickener (20) receiving and filtering a wastewater mixture and producing a first filtrate output and a first sludge output, a screw press thickener (24) receiving the first sludge output and forming a final sludge output and a second filtrate output, a dissolved air floatator (46) receiving the first filtrate output from the rotating filter thickener (20) and producing a first solid output and a third filtrate output.

Abstract: A process of making a stud capacitor structure is disclosed. The process includes embedding the stud in a dielectric stack. In one embodiment, the process includes forming an electrically conductive seed film in a contact corridor of the dielectric stack. A storage cell stud is also disclosed. The storage cell stud can be employed in a dynamic random-access memory device. An electrical system is also disclosed that includes the storage cell stud.

Abstract: A system and method for displaying text are described. According to embodiments of the invention, the system and methods describe operations for displaying text, where the text does not include hints.

Abstract: A method and apparatus for improving output skew across the data bus of a synchronous integrated circuit device. The device includes a clock input buffer that receives a system clock signal and generates a buffered clock signal, a delay line that receives the buffered clock signal and generates a delayed clock signal, and an output circuit including output signal paths for outputting the output signals synchronously with the system clock signal by using the delayed clock signal. At least one of the output signal paths includes a delay circuit and an output buffer. Each delay circuit provides a programmable delay to the delayed clock signal to generate a unique delayed clock signal used to clock an output signal into the respective output buffer. By programming the delays based upon output skew, the output skew can be improved.

Abstract: A medical device programmer automatically adjusts parameters to be programmed to a medical device in response to a user modifying related parameters. Slide controllers on the programmer display screen can adjust parameters. In response to slide controller movement, the programmer automatically adjusts related parameters by moving their slide controllers. This graphically illustrates to the user the automatic adjustments being made to the related parameters. and the relationship between parameters being adjusted by the user and automatically. In response to on screen parameter changes, the system graphically illustrates the parameter values that are changed and those that are programmed to the medical device and those that would cause unsafe condition in the medical device if programmed. The method also prevents the programming to the medical device the parameters that would cause an unsafe condition.

Abstract: Method, apparatus and computer software provide for the loading of configuration data from a remote source to set the initial configuration of a computing system during a boot process. One or more software components are operable on the computing system to determine if configuration data is to be retrieved from a remote source, configure a network interface and determining if the network is active, establish a route to a server storing the configuration data, download the configuration data from the server to the computing system, verify that the configuration data was received correctly, and use the downloaded configuration data to at least in part set the initial configuration of the computing system. When remote data is unavailable, configuration data from a local source is used to set the initial configuration of the computing system.

Abstract: One aspect of the present subject matter relates to a partially depleted silicon-on-insulator structure. The structure includes a well region formed above an oxide insulation layer. In various embodiments, the well region is a multilayer epitaxy that includes a silicon germanium (Si—Ge) layer. In various embodiments, the well region includes a number of recombination centers between the Si—Ge layer and the insulation layer. A source region, a drain region, a gate oxide layer, and a gate are formed. In various embodiments, the Si—Ge layer includes a number of recombination centers in the source/drain regions. In various embodiments, a metal silicide layer and a lateral metal Schottky layer are formed above the well region to contact the source region and the well region. Other aspects are provided herein.

Abstract: A method and apparatus for making a package having improved heat conduction characteristics and high frequency response. A relatively thick package substrate, such as copper, has a wiring layer bonded to one face, leaving the opposite face exposed, for example, to be a surface for connection to a heat sink. One ore more chips are bonded to the wiring layer, and an array of connectors, such as solder balls are provided around the periphery of the chip(s) for connection to a printed circuit board. In some embodiments, the printed circuit board has a hole that the chip(s) extend into to allow smaller external-connection solder balls. In some embodiments, a second heat sink is connected to the back of the chip through the PCB hole.

Abstract: Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.

Abstract: A system and method for detecting changes in the refractive index of a fluid in a small test volume. A change in the refractive index can indicate a change in the chemical composition of the fluid. The test volume has a depth comparable to or less than the wavelength of incident light. In one embodiment, an internal surface of the volume is coated with a binding partner selected to bind with a targeted molecule. When the targeted molecule binds to the binding partner, the optical properties of the system change. The refractive index is determined by illuminating the test volume with laser light and measuring transmitted or reflected light.

Abstract: The present invention provides for substituted metal chelating compounds in which at least two of the chelating atoms are nitrogen which are directly attached to aromatic rings and one or more of those nitrogen atoms has attached thereto a substituent other than hydrogen, and methods for making and using these compounds.