Patents Represented by Attorney Sharon K. Severance
  • Patent number: 6051625
    Abstract: The instant invention pertains to a curable composition comprising(a) substance that generates free radicals under the action of ultraviolet radiation and(b) polymer molecule bearing functionality capable of polymerization under the action of said free radicals wherein (a) is a benzoin ether and makes up from 0.001 to 10 wt % of the total composition and (b) has the following formula(R.sub.3 SiO.sub.1/2).sub.a (R'.sub.2 SiO.sub.2/2).sub.b (R"SiO.sub.3/2).sub.c (SiO.sub.4/2).sub.din which R, R', and R" are each H or C.sub.1 to C.sub.10 hydrocarbyl possibly containing a heteroatom and at least 10% is, for example, a vinyl group, and a+b+c+d=1. The composition of the instant invention is a storage-stable UV-curable composition that does not suffer from cure inhibition by air or oxygen, that is very efficiently cured by low doses of UV radiation, and provides a highly heat-resistant cured pattern by heating after pattern formation.
    Type: Grant
    Filed: June 24, 1997
    Date of Patent: April 18, 2000
    Assignee: Dow Corning Asia, LTD.
    Inventors: Brian R. Harkness, Mamoru Tachikawa, Kasumi Takei
  • Patent number: 6045962
    Abstract: A method for forming a low surface energy coating for electrophotographic photosensitive body substrates does not require performing a physical surface reforming treatment such as corona discharge, plasma treatment, and the like. The process comprises: forming on the substrate at least one polysiloxane coating material, (B), that has a water contact angle greater than the water contact angle of the substrate; and thereafter forming an outermost surface coating material, (A), on top of coating material (B). The water contact angle of coating material (B) is smaller than the water contact angle of coating material (A). Coating material (A) comprises finely divided silica and a resin of the formula RSiO.sub.3/2, wherein not less than 1 mol % and not more than 80 mol % of the R groups are fluorohydrocarbon groups of 3 to 12 carbon atoms.
    Type: Grant
    Filed: March 18, 1998
    Date of Patent: April 4, 2000
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Nobuo Kushibiki, Kikuko Takeuchi
  • Patent number: 6022625
    Abstract: This invention pertains to a method for producing crack-free, insoluble, greater than 1.25 .mu.m thick coatings from hydrogen silsesquioxane resin compositions. The method for producing the coating comprises applying a fillerless hydrogen silsesquioxane resin composition onto a substrate and thereafter heating the hydrogen silsesquioxane resin at a temperature of less than 500.degree. C. for a controlled period of time to produce the crack-free coating having a thickness of greater than 1.25 .mu.m. The resins may be cured in an inert or oxygen containing environment.
    Type: Grant
    Filed: August 3, 1998
    Date of Patent: February 8, 2000
    Assignee: Dow Corning Corporation
    Inventors: Jeffrey Nicholas Bremmer, Kyuha Chung, Chandan Kumar Saha, Michael John Spaulding
  • Patent number: 6020409
    Abstract: Polyorganosiloxane gels are prepared using compositions curable by a platinum catalyzed hydrosilation reaction that are characterized by the presence of a non-functional silicone fluid. The gel may contain additional components and may also be formulated into a multi-part system.
    Type: Grant
    Filed: September 19, 1997
    Date of Patent: February 1, 2000
    Assignee: Dow Corning Corporation
    Inventors: Khristopher Edward Alvarez, Roger Allen Frazer, Myron Timothy Maxson, Ann Walstrom Norris, Michael Raymond Strong, Beth Ann Witucki, Shizhong Zhang
  • Patent number: 5994456
    Abstract: A composition comprising (A) at least one mercapto-functional organosilicon compound having an average of a least two mercapto groups per molecule and (B) a cure initiator. The mercapto-functional organosilicon compound may include mercapto-functional organosilanes, mercapto-functional organosiloxanes, and mercapto-functional copolymers. The compositions of the present invention polymerize or cure to form compositions comprising reaction products of components (A) and (B). The cure initiator is a metal salt that produces a uniform cure throughout the composition, regardless of the amount of oxygen present. The cured products range in properties from soft gels to though elastomers to hard resins and are useful as molded articles, electrical encapsulants, and sealants.
    Type: Grant
    Filed: April 9, 1998
    Date of Patent: November 30, 1999
    Assignee: Dow Corning Corporation
    Inventors: Jerome Melvin Klosowski, Sarah Severson Snow
  • Patent number: 5993532
    Abstract: A stabilized solution of hydrogen silsesquioxane resin is disclosed. The solution comprises 100 parts by weight solvent, 0.1 to 100 parts by weight hydrogen silsesquioxane resin, and 0.002 to 4 parts by weight acid. These solutions are useful for forming coatings on substrates.
    Type: Grant
    Filed: November 26, 1997
    Date of Patent: November 30, 1999
    Assignees: Dow Corning Corporation, Dow Corning Toray Silicone Co., Ltd.
    Inventors: Dennis William Broderick, James Anthony Helwick, Takashi Nakamura
  • Patent number: 5962127
    Abstract: A silicone gel product that resists fuel adsorption and has a surface that feels smooth and dry, resists dirt and moisture pick-up, and prevents the product from sticking to itself, comprises a silicone gel with a tacky surface and a fluorocarbon elastomer film adhering to the surface of the silicone gel.
    Type: Grant
    Filed: December 22, 1997
    Date of Patent: October 5, 1999
    Assignee: Dow Corning Corporation
    Inventor: Myron Timothy Maxson
  • Patent number: 5961876
    Abstract: An organopolysiloxane composition for viscous fluid couplings permits little torque variation even when used at a high temperature for an extended period of time. The organopolysiloxane composition comprises an organopolysiloxane liquid with a viscosity of 100 to 1,000,000 sq. mm/s and a platinum compound in an amount such that the amount of platinum metal relative to the liquid is 0.1 to 1,000 ppm. The organopolysiloxane liquid is typically a trimethylsiloxy-endblocked polydimethylsiloxane.
    Type: Grant
    Filed: March 31, 1998
    Date of Patent: October 5, 1999
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Shoji Akamatsu, Mari Tateishi, Toshinori Watanabe
  • Patent number: 5962601
    Abstract: A curable silicone composition cures to form a silicone cured product with improved fire-retarding, properties. The composition comprises a hydrosilylation-reaction curable silicone composition. Fire-retarding properties are imparted to the composition by using an additive comprising tetrafunctional and monofunctional siloxane units and a diamine compound. The silicone cured product is preferably a silicone gel.
    Type: Grant
    Filed: February 12, 1998
    Date of Patent: October 5, 1999
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Enami Hiroji, Yuji Hamada, Akihiro Nakamura
  • Patent number: 5958324
    Abstract: The present invention relates to a method for the formation of amorphous boron silicon oxycarbide fibers and crystalline boron-doped silicon carbide fibers comprising: preparing a blend of a siloxane resin and a boron-containing polymer, forming the blend into green fibers, and then curing and pyrolyzing the fibers.
    Type: Grant
    Filed: February 6, 1998
    Date of Patent: September 28, 1999
    Assignee: Dow Corning Corporation
    Inventors: Duane Ray Bujalski, Kai Su
  • Patent number: 5958515
    Abstract: This invention relates to a primer that improves adherence of a cured resin sealant to a cured silicone coating on an electrical element, wherein said primer is selected from the group consisting of:(i) a mixture of components (a) and (b),(ii) a reaction mixture of components (a) and (b),(iii) component (c),(iv) component (c) and a mixture of components (a) and (b), and(v) component (c) and a reaction mixture of components (a) and (b),where component (a) is silanol-functional organopolysiloxane; component (b) is epoxy-functional organoalkoxysilane; and component (c) is organopolysiloxane with the average unit formula:(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.dwhere R.sup.1 is an epoxy-functional monovalent organic group; each R.sup.2 is independently a monovalent hydrocarbon group, R.sup.
    Type: Grant
    Filed: September 3, 1997
    Date of Patent: September 28, 1999
    Assignee: Dow Corning Toray Silicone Co., LTD.
    Inventors: Minoru Isshiki, Katsutoshi Mine, Kimio Yamakawa
  • Patent number: 5935638
    Abstract: A silicon dioxide containing coating can be used for multi-layer hermetic coatings, interlayer dielectric coatings, and flat panel display coatings. The coating is formed by applying a coating composition comprising polysilastyrene to a substrate and heating the polysilastyrene in an oxidizing atmosphere.
    Type: Grant
    Filed: August 6, 1998
    Date of Patent: August 10, 1999
    Assignee: Dow Corning Corporation
    Inventors: Grish Chandra, Loren Andrew Haluska
  • Patent number: 5932145
    Abstract: An addition reaction-curing conductive silicone composition comprises: an organopolysiloxane with alkenyl groups, an organopolysiloxane with silicon-bonded hydrogen atoms, a conductive microparticulate, a platinum catalyst, and a volatile solvent; and the composition cures to yield a conductive cured silicone product that has low resistance and resistivity values, a resistance value independent of temperature, and little variation in resistance and resistivity values over time.
    Type: Grant
    Filed: October 30, 1997
    Date of Patent: August 3, 1999
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Osamu Mitani, Kazumi Nakayoshi, Rikako Tazawa, Katsutoshi Mine
  • Patent number: 5928978
    Abstract: This invention pertains to a method for production of polycrystalline ceramic fibers from silicon oxycarbide (SiCO) ceramic fibers wherein the method comprises heating an amorphous ceramic fiber containing silicon and carbon in an inert environment comprising a boron oxide and carbon monoxide at a temperature sufficient to convert the amorphous ceramic fiber to a polycrystalline ceramic fiber. By having carbon monoxide present during the heating of the ceramic fiber, it is possible to achieve higher production rates on a continuous process.
    Type: Grant
    Filed: July 10, 1997
    Date of Patent: July 27, 1999
    Assignee: Dow Corning Corporation
    Inventors: Thomas Duncan Barnard, Kimmai Thi Nguyen, James Alan Rabe
  • Patent number: 5916944
    Abstract: Disclosed is a method of forming tamper-proof coatings on electronic devices. The method comprises applying a coating of a silica precursor resin and a filler onto the electronic device, wherein the filler is one which reacts in an oxidizing atmosphere to liberate enough heat to damage the electronic device. The coated electronic device is then heated at a temperature sufficient to convert the silica precursor resin to a silica containing ceramic matrix.
    Type: Grant
    Filed: September 29, 1997
    Date of Patent: June 29, 1999
    Assignee: Dow Corning Corporation
    Inventors: Robert Charles Camilletti, Loren Andrew Haluska, Keith Winton Michael
  • Patent number: 5910272
    Abstract: A process for the preparation of an electrically conductive coating material for use in electrophotography applications comprises subjecting an epoxy-functional silane to hydrolytic condensation in a mixed solvent of alcohol and water in the presence of silica. The hydrolyzed material is then heat cured to form a resin coating comprising (R.sup.1 SiO).sub.3/2 units, where R.sup.1 comprises epoxy-functional groups. The coating has superior optical homogeneity and electrical conductivity without being detrimental to the functionality required of electrophotographic photosensitive bodies.
    Type: Grant
    Filed: March 18, 1998
    Date of Patent: June 8, 1999
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Nobuo Kushibiki, Kikuko Takeuchi
  • Patent number: 5907899
    Abstract: A lithium ion battery electrode formed by the pyrolysis of a polycarbosilane followed by introducing lithium ions. These electrodes can be used to form batteries with large capacities, low irreversible capacity, high density and good safety behavior.
    Type: Grant
    Filed: June 11, 1996
    Date of Patent: June 1, 1999
    Assignee: Dow Corning Corporation
    Inventors: Jeffery Raymond Dahn, Alf M. Wilson, Weibing Xing, Gregg Alan Zank
  • Patent number: 5906859
    Abstract: This invention pertains to a method of producing low dielectric coatings from hydrogen silsesquioxane resin. The method for producing the coatings comprises applying a film of hydrogen silsesquioxane resin onto a substrate and thereafter curing the film by first heating at a temperature of about 325.degree. C. to 350.degree. C. thereafter heating at a temperature of about 400.degree. C. to 450.degree. C. until the normalized SiH bond density is 50 to 80%. This two step curing process produces films having lower dielectric constant and improved mechanical properties.
    Type: Grant
    Filed: July 10, 1998
    Date of Patent: May 25, 1999
    Assignee: Dow Corning Corporation
    Inventors: Jeffrey Nicholas Bremmer, Youfan Liu
  • Patent number: 5907190
    Abstract: A semiconductor device in which the surface of the semiconductor element is coated with a cured silicone in which there is dispersed filler having an average particle diameter of 0.01 to 500 micrometers and a specific gravity of 0.01 to 0.95 characterized in that the concentration of said filler is higher in the layer of said cured material remote from the element than in the layer of said cured material adjoining the element. The method for fabricating such a device comprises coating the surface of a semiconductor element with a curable silicone composition in which there is dispersed a filler having an average particle diameter of 0.01 to 500 micrometers and a specific gravity of 0.01 to 0.95 and thereafter curing said composition after the elapse of sufficient time for the filler in the layer of the composition adjoining the element to migrate into the layer of said composition remote from the element.
    Type: Grant
    Filed: November 21, 1995
    Date of Patent: May 25, 1999
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Takae Ishikawa, Katsutoshi Mine, Hiroyosi Naito, Kimio Yamakawa
  • Patent number: RE36754
    Abstract: Hot-melt silicone pressure sensitive adhesive compositions containing organic waxes, methods of using the compositions and devices made using the compositions are disclosed. The hot-melt silicone pressure sensitive adhesive compositions include a mixture of (i) a silicate resin, (ii) a silicone fluid, and (iii) an organic wax having a melting point of between 30.degree. C. and 150.degree. C. The organic wax decreases dynamic viscosity of the adhesive at temperatures equal to or below about 200.degree. C.
    Type: Grant
    Filed: June 6, 1996
    Date of Patent: June 27, 2000
    Assignee: Dow Corning Corporation
    Inventor: Ross Alan Noel