Abstract: The instant invention pertains to a curable composition comprising(a) substance that generates free radicals under the action of ultraviolet radiation and(b) polymer molecule bearing functionality capable of polymerization under the action of said free radicals wherein (a) is a benzoin ether and makes up from 0.001 to 10 wt % of the total composition and (b) has the following formula(R.sub.3 SiO.sub.1/2).sub.a (R'.sub.2 SiO.sub.2/2).sub.b (R"SiO.sub.3/2).sub.c (SiO.sub.4/2).sub.din which R, R', and R" are each H or C.sub.1 to C.sub.10 hydrocarbyl possibly containing a heteroatom and at least 10% is, for example, a vinyl group, and a+b+c+d=1. The composition of the instant invention is a storage-stable UV-curable composition that does not suffer from cure inhibition by air or oxygen, that is very efficiently cured by low doses of UV radiation, and provides a highly heat-resistant cured pattern by heating after pattern formation.

Abstract: A method for forming a low surface energy coating for electrophotographic photosensitive body substrates does not require performing a physical surface reforming treatment such as corona discharge, plasma treatment, and the like. The process comprises: forming on the substrate at least one polysiloxane coating material, (B), that has a water contact angle greater than the water contact angle of the substrate; and thereafter forming an outermost surface coating material, (A), on top of coating material (B). The water contact angle of coating material (B) is smaller than the water contact angle of coating material (A). Coating material (A) comprises finely divided silica and a resin of the formula RSiO.sub.3/2, wherein not less than 1 mol % and not more than 80 mol % of the R groups are fluorohydrocarbon groups of 3 to 12 carbon atoms.

Abstract: This invention pertains to a method for producing crack-free, insoluble, greater than 1.25 .mu.m thick coatings from hydrogen silsesquioxane resin compositions. The method for producing the coating comprises applying a fillerless hydrogen silsesquioxane resin composition onto a substrate and thereafter heating the hydrogen silsesquioxane resin at a temperature of less than 500.degree. C. for a controlled period of time to produce the crack-free coating having a thickness of greater than 1.25 .mu.m. The resins may be cured in an inert or oxygen containing environment.

Abstract: Polyorganosiloxane gels are prepared using compositions curable by a platinum catalyzed hydrosilation reaction that are characterized by the presence of a non-functional silicone fluid. The gel may contain additional components and may also be formulated into a multi-part system.

Abstract: A composition comprising (A) at least one mercapto-functional organosilicon compound having an average of a least two mercapto groups per molecule and (B) a cure initiator. The mercapto-functional organosilicon compound may include mercapto-functional organosilanes, mercapto-functional organosiloxanes, and mercapto-functional copolymers. The compositions of the present invention polymerize or cure to form compositions comprising reaction products of components (A) and (B). The cure initiator is a metal salt that produces a uniform cure throughout the composition, regardless of the amount of oxygen present. The cured products range in properties from soft gels to though elastomers to hard resins and are useful as molded articles, electrical encapsulants, and sealants.

Abstract: A stabilized solution of hydrogen silsesquioxane resin is disclosed. The solution comprises 100 parts by weight solvent, 0.1 to 100 parts by weight hydrogen silsesquioxane resin, and 0.002 to 4 parts by weight acid. These solutions are useful for forming coatings on substrates.

Abstract: An organopolysiloxane composition for viscous fluid couplings permits little torque variation even when used at a high temperature for an extended period of time. The organopolysiloxane composition comprises an organopolysiloxane liquid with a viscosity of 100 to 1,000,000 sq. mm/s and a platinum compound in an amount such that the amount of platinum metal relative to the liquid is 0.1 to 1,000 ppm. The organopolysiloxane liquid is typically a trimethylsiloxy-endblocked polydimethylsiloxane.

Abstract: A silicone gel product that resists fuel adsorption and has a surface that feels smooth and dry, resists dirt and moisture pick-up, and prevents the product from sticking to itself, comprises a silicone gel with a tacky surface and a fluorocarbon elastomer film adhering to the surface of the silicone gel.

Abstract: A curable silicone composition cures to form a silicone cured product with improved fire-retarding, properties. The composition comprises a hydrosilylation-reaction curable silicone composition. Fire-retarding properties are imparted to the composition by using an additive comprising tetrafunctional and monofunctional siloxane units and a diamine compound. The silicone cured product is preferably a silicone gel.

Abstract: This invention relates to a primer that improves adherence of a cured resin sealant to a cured silicone coating on an electrical element, wherein said primer is selected from the group consisting of:(i) a mixture of components (a) and (b),(ii) a reaction mixture of components (a) and (b),(iii) component (c),(iv) component (c) and a mixture of components (a) and (b), and(v) component (c) and a reaction mixture of components (a) and (b),where component (a) is silanol-functional organopolysiloxane; component (b) is epoxy-functional organoalkoxysilane; and component (c) is organopolysiloxane with the average unit formula:(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.dwhere R.sup.1 is an epoxy-functional monovalent organic group; each R.sup.2 is independently a monovalent hydrocarbon group, R.sup.

Abstract: The present invention relates to a method for the formation of amorphous boron silicon oxycarbide fibers and crystalline boron-doped silicon carbide fibers comprising: preparing a blend of a siloxane resin and a boron-containing polymer, forming the blend into green fibers, and then curing and pyrolyzing the fibers.

Abstract: A silicon dioxide containing coating can be used for multi-layer hermetic coatings, interlayer dielectric coatings, and flat panel display coatings. The coating is formed by applying a coating composition comprising polysilastyrene to a substrate and heating the polysilastyrene in an oxidizing atmosphere.

Abstract: An addition reaction-curing conductive silicone composition comprises: an organopolysiloxane with alkenyl groups, an organopolysiloxane with silicon-bonded hydrogen atoms, a conductive microparticulate, a platinum catalyst, and a volatile solvent; and the composition cures to yield a conductive cured silicone product that has low resistance and resistivity values, a resistance value independent of temperature, and little variation in resistance and resistivity values over time.

Abstract: This invention pertains to a method for production of polycrystalline ceramic fibers from silicon oxycarbide (SiCO) ceramic fibers wherein the method comprises heating an amorphous ceramic fiber containing silicon and carbon in an inert environment comprising a boron oxide and carbon monoxide at a temperature sufficient to convert the amorphous ceramic fiber to a polycrystalline ceramic fiber. By having carbon monoxide present during the heating of the ceramic fiber, it is possible to achieve higher production rates on a continuous process.

Abstract: Disclosed is a method of forming tamper-proof coatings on electronic devices. The method comprises applying a coating of a silica precursor resin and a filler onto the electronic device, wherein the filler is one which reacts in an oxidizing atmosphere to liberate enough heat to damage the electronic device. The coated electronic device is then heated at a temperature sufficient to convert the silica precursor resin to a silica containing ceramic matrix.

Abstract: A process for the preparation of an electrically conductive coating material for use in electrophotography applications comprises subjecting an epoxy-functional silane to hydrolytic condensation in a mixed solvent of alcohol and water in the presence of silica. The hydrolyzed material is then heat cured to form a resin coating comprising (R.sup.1 SiO).sub.3/2 units, where R.sup.1 comprises epoxy-functional groups. The coating has superior optical homogeneity and electrical conductivity without being detrimental to the functionality required of electrophotographic photosensitive bodies.

Abstract: A lithium ion battery electrode formed by the pyrolysis of a polycarbosilane followed by introducing lithium ions. These electrodes can be used to form batteries with large capacities, low irreversible capacity, high density and good safety behavior.

Abstract: This invention pertains to a method of producing low dielectric coatings from hydrogen silsesquioxane resin. The method for producing the coatings comprises applying a film of hydrogen silsesquioxane resin onto a substrate and thereafter curing the film by first heating at a temperature of about 325.degree. C. to 350.degree. C. thereafter heating at a temperature of about 400.degree. C. to 450.degree. C. until the normalized SiH bond density is 50 to 80%. This two step curing process produces films having lower dielectric constant and improved mechanical properties.

Abstract: A semiconductor device in which the surface of the semiconductor element is coated with a cured silicone in which there is dispersed filler having an average particle diameter of 0.01 to 500 micrometers and a specific gravity of 0.01 to 0.95 characterized in that the concentration of said filler is higher in the layer of said cured material remote from the element than in the layer of said cured material adjoining the element. The method for fabricating such a device comprises coating the surface of a semiconductor element with a curable silicone composition in which there is dispersed a filler having an average particle diameter of 0.01 to 500 micrometers and a specific gravity of 0.01 to 0.95 and thereafter curing said composition after the elapse of sufficient time for the filler in the layer of the composition adjoining the element to migrate into the layer of said composition remote from the element.

Abstract: Hot-melt silicone pressure sensitive adhesive compositions containing organic waxes, methods of using the compositions and devices made using the compositions are disclosed. The hot-melt silicone pressure sensitive adhesive compositions include a mixture of (i) a silicate resin, (ii) a silicone fluid, and (iii) an organic wax having a melting point of between 30.degree. C. and 150.degree. C. The organic wax decreases dynamic viscosity of the adhesive at temperatures equal to or below about 200.degree. C.