Abstract: A lithium ion battery electrode formed by the pyrolysis of a siloxane polymer of the structure(R.sup.1 R.sup.2 R.sup.3 SiO.sub.0.5).sub.w (R.sup.4 R.sup.5 SiO).sub.x (R.sup.6 SiO.sub.1.5).sub.y (SiO.sub.4/2).sub.zfollowed by introducing lithium ions. In this structure, each R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5 and R.sup.6 are independently selected from the group consisting of hydrogen and a hydrocarbon, w is in the range of 0 to about 0.8, x is in the range of 0 to about 0.9, y is in the range of 0 to about 0.9, z is in the range of 0 to 1 and w+x+y+z=1.

Abstract: The present invention pertains to a curable composition which comprises a) a N-substituted 4-(o-nitrophenyl)dihydropyridine which constitutes a base-generating substance that is caused to generate a base by the action of ultraviolet light, and (b) a silicone polymer (R.sub.2 SiO.sub.2/2)(RSiO.sub.3/2) containing silicon-hydrogen bonds (Si--H) which are capable of reacting with hydroxy groups to form silicon-oxygen bonds (Si--O) and hydrogen molecules (H.sub.2) under the effect of the base. This composition is cured by irradiation with ultraviolet light. Patterns are formed by placing a mask between a coating film of the composition and the ultraviolet light source during the irradiation with ultraviolet light, and then dissolving and removing the uncured portions of the composition following said irradiation.

Abstract: A novel method for making stable aqueous microemulsions of high molecular weight polydiorganosiloxanes which comprises sequentially adding at an effective rate a standard emulsion comprised of polydiorganosiloxane precursor, surfactant, and water to a polymerization catalyst medium while mixing to form a clear, stable aqueous microemulsion of polydiorganosiloxane.

Abstract: Disclosed is the use of silicon carbide as a barrier layer to prevent the diffusion of metal atoms between adjacent conductors separated by a dielectric material. This advancement allows for the use of low resistivity metals and low dielectric constant dielectric layers in integrated circuits and wiring boards.

Abstract: The present invention relates to a method for preparing a ceramic fiber wherein the method comprises (A) forming a green fiber from an alk-1-enyl ether functional siloxane resin of the general formula (R.sup.1 SiO.sub.3/2).sub.q (R.sup.2 SiO.sub.3/2).sub.r (R.sup.1.sub.w R.sup.2.sub.x RSiO.sub.(3-w-x)/2).sub.s (R.sup.1.sub.w R.sup.2.sub.x R.sup.3 SiO.sub.(3-w-x)/2).sub.t wherein R is an alk-1-enyl ether group; each R.sup.1 is selected from an aryl group having from 6 to 10 carbon atoms; each R.sup.2 is selected from an alkyl group having from 1 to 4 carbon atoms; R.sup.3 is an alkenyl group having from 2 to 10 carbon atoms; w has a value of 0, 1 or 2; x has a value of 0, 1, or 2 with the provisio that w+x.ltoreq.2; q has a value of 0 to 0.98; r has a value of 0 to 0.98; s is greater than zero; t.gtoreq.0; s+t=0.02 to 0.5 and q+r+s+t=1; (B) curing the green fiber to render it non-fusible; and (C) heating the non-fusible fiber in an inert environment to a temperature above 800.degree. C.

Abstract: The use of acrylic functional siloxanes in hair treatment is disclosed. Acrylic functional siloxanes can be used as oxidizing agents in perms or formulated into hair care products such as shampoos or conditioners. They may be cured into/onto the hair using catalysts or radiation.

Abstract: This invention pertains to polycarbosilane hydroxides which contain units of the formula ##STR1## where R is a hydrocarbon having from 1 to 20 carbon atoms and to methods for their manufacture. The polycarbosilane hydroxides may be prepared by the oxidation of a polycarbosilane.

Abstract: The present invention relates to a ceramic coating composition comprising a preceramic material such as silicon oxide precursors, silicon carbonitride precursors, silicon carbide precursors, and silicon nitride precursors and a flux material such as B.sub.2 O.sub.3, PbO.sub.2, P.sub.2 O.sub.5, and Bi.sub.2 O.sub.3. The present invention also relates to a substrate such as an electronic device having said coating applied and ceramified thereon.

Abstract: Curable compositions comprising a substance that produces a base when exposed to radiation and a polymer molecule that contains silicon-hydrogen bonds which react with hydroxyl groups under the action of the base to form silicon-oxygen bonds (Si--O) and hydrogen molecules. These compositions cure when exposed to radiation. A pattern can be formed by placing a mask between a coating of the composition and the radiation source during this exposure episode and thereafter dissolving the uncured composition. The compositions have little weight loss during their cure, they can be cured by low intensity radiation, and they yield heat-resistant cured products.

Abstract: A silica-containing coating is formed on an electronic substrate by applying a polycarbosilane on the substrate and converting it to a silica-containing material by heating in an oxidizing environment. The resultant thick planarizing coatings are useful as protective coatings and dielectric inner layers.

Abstract: A method of forming a protective covering on an electronic or microelectronic device to prevent inspection. A first silica-containing ceramic layer is applied to the surface of the device to planarize its surface. A second silicon carbide coating layer is applied to the surface of the first silica-containing ceramic layer to form a hermetic barrier. A third porous silica-containing ceramic layer is formed on the surface of the second silicon carbide coating layer. The third porous silica-containing ceramic layer is impregnated with an opaque material or filler. A fourth metal layer or metal pattern is applied over the third opaque porous silica-containing ceramic layer. The fourth metal layer or pattern is then coated with a fifth layer similar to the third opaque porous silica-containing ceramic layer.

Abstract: The present invention relates to a method of forming coatings on electronic substrates and the substrates coated thereby. The method comprises applying a coating comprising hydrogen silsesquioxane resin and a polysilazane on a substrate and heating the coated substrate at a temperature sufficient to convert the resins to ceramics.

Abstract: Thick opaque ceramic coatings are used to protect delicate microelectronic devices against excited energy sources, radiation, light, abrasion, and wet etching techniques. The thick opaque ceramic coating are prepared from a mixture containing phosphoric anhydride, i.e., phosphorous pentoxide (P.sub.2 O.sub.5), and a pre-ceramic silicon-containing material. It is preferred to also include tungsten carbide (WC) and tungsten metal (W) in the coating mixture. The coating is pyrolyzed to form a ceramic SiO.sub.2 containing coating. A second coating of plasma enhanced chemical vapor deposited (PECVD) silicon carbide (SiC), diamond, or silicon nitride (Si.sub.3 N.sub.4), can be applied over the thick opaque ceramic coating to provide hermeticity. These coatings are useful on patterned wafers, electronic devices, and electronic substrates. The thick opaque ceramic coating is unique because it is resistant to etching using wet chemicals, i.e., acids such as H.sub.3 PO.sub.4 and H.sub.2 SO.sub.4, or bases.

Abstract: Organosiloxane compositions curable to silicone elastomers having improved weep properties are described. The compositions include an alkenyl-containing polydiorganosiloxane, an organohydrogensiloxane, a platinum-group metal catalyst and a MQ-type resinous organosiloxane copolymer having at least one fluorine atom-containing group per molecule; and a silicone elastomer prepared from such composition. A method of minimizing the leakage of a hydrocarbon fluid from a container using the silicone elastomer is also described.

Abstract: Prior to winding wire in a coil around a foil, the foil is coated on a least one surface side with a tacky silicone composition. A composition on the foil exerts a retaining force on the wires discouraging said wires from sliding away from an original or intended position.

Abstract: Organosiloxane compositions curable to silicone elastomers having improved weep properties are described. The compositions include an alkenyl-containing polydiorganosiloxane, an organohydrogensiloxane, a platinum-group metal catalyst and a MQ-type resinous organosiloxane copolymer; and a silicone elastomer prepared from such composition. A method of a minimizing the leakage of a hydrocarbon fluid from a container using the silicone elastomer is also described.

Abstract: A method for forming a cap on an electronic device to prevent inspection. First, a silica-containing ceramic is applied to the surface the electronic device to planarize the surface. Next, a silicon carbide coating is applied to the surface of the silica containing ceramic to form a hermetic barrier. A layer of porous silica-containing ceramic is then formed on the surface of the silicon carbide coating. Finally, the porous silica-containing ceramic is impregnated with an opaque material.

Abstract: Disclosed is a method of forming tamper-proof coatings on electronic devices. The method comprises applying a coating of a silica precursor resin and an inorganic salt onto the electronic device, wherein the inorganic salt is one which reacts with a wet etch to yield an acid or base that damages the electronic device. The coated electronic device is then heated at a temperature sufficient to convert the silica precursor resin to a silica containing ceramic matrix.

Abstract: A hair treating method for imparting curl retention to hair in which at least one film forming ingredient is applied to the hair. The improvement utilizes as the film forming ingredient an organosilicon compound which is a nonpolar silsesquioxane. Hair fixative compositions including the nonpolar silsesquioxane are also disclosed.

Abstract: The introduction of a novel curable resin composition that is characterized by the ability to cure at temperatures at or above its melting-initiation temperature through the rapid, hydrosilylation-based formation of a crosslinked structure. Said curable resin composition comprising(A) an acrylic resin that has at least 2 silicon-bonded alkenyl groups in each molecule and a melting-initiation temperature of at least 40.degree. C.;(B) an acrylic resin that has at least 2 hydrosilyl groups in each molecule and a melting-initiation temperature of at least 40.degree. C., in a quantity that yields a value from 1:0.3 to 1:30 for the molar ratio of silicon-bonded alkenyl groups in component (A) to silicon-bonded hydrogen atoms in component (B); and(C) a hydrosilylation reaction catalyst in sufficient quantity to cure the composition.