Abstract: An integrated system generates a model of a three-dimensional object. A scanning laser device scans the three-dimensional object and generates a point cloud. The points of the point cloud each indicate a location of a corresponding point on a surface of the object. A first model is generated, responsive to the point cloud, that generates a first model representing constituent geometric shapes of the object. A data file is generated, responsive to the first model, that can be inputted to a computer-aided design system.

Abstract: Fluid immersion technology can be utilized to increase the resolution and angular range of existing metrology systems. An immersion fluid placed between the metrology optics and the sample can reduce the refraction at the sample interface, thereby decreasing the spot size of the beam on a feature of the sample while simultaneously increasing the angular range of the system. The decreased spot size, in combination with an increased angular spread, allows an existing metrology system to measure parameters of a sample, such as a semiconductor or microelectronic device, with improved resolution and without expensive and/or complex changes to the mechanics of the metrology system.

Abstract: A fiber laser including doped-core fiber having inner and outer cladding is optically pumped by plurality of diode-lasers. Light emitted by the diode-lasers is coupled into a single multimode optical fiber. Light from the multimode optical fiber is directed to a wavelength selective reflecting device that is partially reflective in a narrow reflection band about a peak reflection wavelength. A portion of the light having the peak reflection wavelength is reflected from the wavelength selective reflecting device back along the multimode optical fiber and back into the plurality of diode-lasers. This locks the emitting wavelength of the light emitted from each of the diode-lasers to the peak reflection wavelength. Light at the emitting wavelength that is not reflected from the wavelength selective reflective device is coupled into the inner cladding of the doped-core fiber for optically pumping the fiber laser.

Abstract: A system for evaluating semiconductor wafers includes illumination sources for generating probe and pump beams. The pump beam is focused on the surface of a sample and a beam steering mechanism is used to modulate the point of focus in a predetermined pattern. The moving pump beam introduces thermal and plasma waves in the sample causing changes in the reflectivity of the surface of the sample. The probe beam is focused within or adjacent to the area illuminated by the pump beam. The reflected probe beam is gathered and used to measure the changes in reflectivity induced by the pump beam. By analyzing changes in reflectivity, a processor is able to deduce structure and chemical details of the sample.

Abstract: A fluorescence concentrator system that provides for high brightness light source. The system can include a host doped with fluorescent material, which is optically pumped by an adjacent illumination source. The fluorescence concentrator captures a portion of the isotropically emitted fluorescent light and guides it to an output surface. The fluorescent energy emerging the output surface provides a high brightness light source suitable for a number of applications. For example, the fluorescence concentrator system can be used as the light source in a medical apparatus suitable for various aesthetic procedures. Further aspects of the fluorescent concentrator system can include providing for controlling the illumination source to output pumping energy suitable for high energy applications.

Abstract: A wafer scale semiconductor integrated circuit packaging technique provides a hermetic seal for the individual integrated circuit die formed as part of the wafer scale structure. A semiconductor wafer is manufactured to include a number of individual semiconductor die. Each individual die formed on the wafer includes a number of bond pads that are exposed on the die surface in various locations to provide electrical connections to the circuitry created on the die. The wafer further includes a planar glass sheet that is substantially the same size as the wafer, the glass sheet being adhered to the wafer using a suitable adhesive. The glass sheet has a number of pre-formed holes in it, the arrangement of the pre-formed holes corresponding to the location of the bond pads at each of the individual semiconductor die formed as part of the wafer structure.

Abstract: An optical inspection device includes a light source for generating a probe beam. The probe beam is focused onto a sample to create a spread of angles of incidence. After reflecting from the sample, the light is imaged onto a two dimensional array of photodetectors. Prior to reaching the detector array, the beam is passed through a rotating compensator. A processor functions to evaluate the sample by analyzing the output of the photodetectors lying along one or more azimuthal angles and at different compensator positions.

Abstract: An apparatus is disclosed for obtaining ellipsometric measurements from a sample. A probe beam is focused onto the sample to create a spread of angles of incidence. The beam is passed through a quarter waveplate retarder and a polarizer. The reflected beam is measured by a detector. In one preferred embodiment, the detector includes eight radially arranged segments, each segment generating an output which represents an integration of multiple angle of incidence. A processor manipulates the output from the various segments to derive ellipsometric information.

Abstract: A wafer scale semiconductor integrated circuit packaging technique provides a hermetic seal for the individual integrated circuit die formed as part of the wafer scale structure. A semiconductor wafer is manufactured to include a number of individual semiconductor die. Each individual die formed on the wafer includes a number of bond pads that are exposed on the die surface in various locations to provide electrical connections to the circuitry created on the die. The wafer further includes a planar glass sheet that is substantially the same size as the wafer, the glass sheet being adhered to the wafer using a suitable adhesive. The glass sheet has a number of pre-formed holes in it, the arrangement of the pre-formed holes corresponding to the location of the bond pads at each of the individual semiconductor die formed as part of the wafer structure.

Abstract: An infrared filter for an optical metrology tool includes a substrate having film stacks on opposing surfaces thereof. A first film stack can be used to reflect ultra-violet radiation and transmit radiation at non-ultraviolet wavelengths. The second film stack can be used to reflect visible to near-infrared radiation and transmit infrared radiation. The combination of film stacks can therefore extract infrared radiation from a broadband beam, with the remaining ultra-violet radiation and visible to near-infrared radiation forming the product of the filter. The filter can be used as part of the illumination or collection side optics in a broadband optical metrology tool.

Abstract: A laser includes an Nd:YVO4 crystal end-pumped with diode-laser light having a wavelength at which the absorption coefficient for Nd:YVO4 is less than about 0.35 (35%) of the absorption coefficient at 808 nm.

Abstract: A MOSFET transistor structure is formed in a substrate of semiconductor material having a first conductivity type. The MOSFET transistor structure includes an active region that is surrounded by a perimeter isolation dielectric material formed in the substrate to define a continuous sidewall interface between the sidewall dielectric material and the active region. Spaced-apart source and drain regions are formed in the active region and are also spaced-apart from the sidewall interface. A conductive gate electrode that is separated from the substrate channel region by intervening gate dielectric material includes a first portion that extends over the substrate channel region and a second portion that extends continuously over the entire sidewall interface between the isolation dielectric material and the active region.

Abstract: Multiple laser beams, each having a shape such as a Gaussian profile, can be incoherently combined to obtain a shaped, flat top laser beam. The combined laser beams can provide power levels necessary for material processing applications such as annealing, drilling, and cutting, while minimizing the amount of unused power. The lasers can be positioned in an array in order to shape the flat top beam, and can be staggered in position where necessary to give each output beam an equal beam path length. The relative frequencies and/or powers of the lasers can be adjusted to control the flatness and stability of the incoherently combined beam.

Abstract: A method for measuring overlay in semiconductor wafers includes obtaining diffraction based and imaging based measurements of the same target. The two separate measurements are then combined in a way that is consistent to both measurements to obtain an overlay measurement that has high precision and large range.

Abstract: A method is provided for forming a graded junction in a semiconductor material having a first conductivity type. Dopant having a second conductivity type opposite the first conductivity type is introduced into a selected region of the semiconductor material to define a primary dopant region therein. The perimeter of the primary dopant region defines a primary pn junction. While introducing dopant into the selected region of the semiconductor material, dopant is simultaneously introduced into the semiconductor material around the perimeter of the primary dopant region and spaced-apart from the primary pn junction. The dopant in the both the primary dopant region and in the dopant around the perimeter of the primary dopant region is then diffused to provide a graded dopant region.

Abstract: A system for focusing broadband light within a reflectometer includes a concave spherical mirror for gathering light from the surface of a sample under inspection. The concave spherical mirror projects the received light to a convex spherical mirror. The combination of the two mirrors captures the light diverging from the sample and collimates the light into parallel rays. The light can then be passed through an aperture prior to entering a detector. Each of the two mirrors is fabricated as an off-axis section of a spherical mirror and positioned to form a partial Schwarzschild design without the associated problem of a central obscuration.

Abstract: An integrated circuit test method is provided that utilizes shared tester resources physically located at different geographical sites throughout the world to test specific integrated circuits, thereby maximizing utilization of all tester resources and, thereby, dramatically reducing the overall cost to test.

Abstract: A contact free rotary transformer assembly can be used to transfer power and information between a stationary portion and a rotatable portion of a laser scanning device. The rotary transformer can consist of a pair of substantially parallel ferrite rings, each having disposed therein a coil for passing AC current. The assembly can use an optical fiber positioned near a rotational axis of the transformer to transfer optical information between the stationary and rotary portions. The optical fiber can include two portions connected by a rotational connection in order to allow the portions to rotate with respect to one another while maintaining the light path.

Abstract: An optical pulse extender includes a delay loop formed by a plurality of mirrors and a graded reflectivity beamsplitter. The mirrors and the beamsplitter are configured and aligned such that a pulse to be broadened makes a predetermined number of round trips in the delay loop and is incident on a different zone of the beamsplitter after each round trip. The different zones of the beamsplitter have different reflection values and different transmission values. These values are selected such that the pulse extender delivers a plurality of temporally and spatially separated replica pulses each thereof having about the same energy. The delivered replica pulses together provide an extended pulse having a longer duration than the input pulse. The replica pulses may be passed through a beam homogenizer to spatially homogenize the temporal characteristics of the extended pulse.

Abstract: The lifetime of optical components used in deep-UV (DUV) excimer laser systems, including systems in a MOPA configuration, can be increased by reducing the intensity of pulses incident upon these components. In one approach, an output pulse can be “stretched” in order to reduce the peak power of the pulse. A pulse stretching component can be used, which can be mounted outside the laser enclosure with a horizontal beam path in order to provide a delay line with a minimum impact on the laser system footprint. The horizontal beam path also can minimize the number of optical components in the arm containing the high power beam. A beamsplitting prism can be used with the delay line to avoid the rapid degradation of coatings otherwise exposed to intense UV beams. The prism can expand the beam in the delay line in order to minimize beam intensity and losses due to reflection.