Patents Represented by Law Firm Stetina and Brunda
  • Patent number: 8105310
    Abstract: An infiltration cannula and method of using the infiltration cannula during a tumescent infiltration procedure are disclosed herein. The infiltration cannula may have an outwardly flaring hub which may be wedged into an adit of a patient to minimize leakage of fluid being infiltrated into the patient. Also, the infiltration cannula may be utilized to hydrate a dehydrated patient by a medically untrained person. The infiltration cannula may also be used to deliver an antibiotic/vasoconstrictive drug solution to minimize surgical site infections.
    Type: Grant
    Filed: May 4, 2007
    Date of Patent: January 31, 2012
    Inventor: Jeffrey A. Klein
  • Patent number: 8105007
    Abstract: A vehicle transport ramp system having a transport vehicle with a transport vehicle bed, a first side wall and an opposing second side wall; an upper ramp having a first upper ramp end and a second upper ramp end operative to form a door, and a first upper ramp edge and an opposing second upper ramp edge; a lower ramp having a first lower ramp side and a second lower ramp side, a first lower ramp edge and a second lower ramp edge, a first lower ramp end pivotally connected to the second upper ramp end, and a second lower ramp end pivotally mountable to the transport vehicle bed; a first lower ramp enclosure panel and a second side wall enclosure panel mountable to the first lower ramp side, and a first side wall enclosure panel and a second side wall enclosure panel to enclose the transport vehicle as the lower ramp is lowered toward the driving surface.
    Type: Grant
    Filed: May 19, 2008
    Date of Patent: January 31, 2012
    Inventor: Peter L. Dunkel
  • Patent number: 8102037
    Abstract: A semiconductor package including a lead frame comprising a frame including both a ground ring and a chip mounting board located therein. Extending between the ground ring and the chip mounting board are a plurality of elongate slots or apertures. The ground ring is formed to include recesses within the bottom surface thereof which create regions of reduced thickness. A semiconductor chip bonded to the chip mounting board may be electrically connected to leads of the lead frame and to the ground ring via conductive wires. Those conductive wires extending to the ground ring are bonded to the top surface thereof at locations which are not aligned with the recesses within the bottom surface, i.e., those regions of the ground ring of maximum thickness.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: January 24, 2012
    Assignee: Amkor Technology, Inc.
    Inventor: Hyung Ju Lee
  • Patent number: 8097429
    Abstract: It is described a method to detect and phenotype target cells in cell suspensions by using particles coated with antibodies/ligands directed to antigenic determinants/receptors expressed on the target cells, characterized in that several types of particles, each particle coated with different antibody or ligand, are incubated simultaneously or subsequently with cell suspensions containing the target cells, in connection or not with a per se known enrichment procedure, a use of the method and a kit.
    Type: Grant
    Filed: February 1, 2005
    Date of Patent: January 17, 2012
    Inventors: Øystein Fodstad, Hanne Kleppe Høifødt
  • Patent number: 8096340
    Abstract: A child safety blind having a head rail, a bottom rail, at least one ladder tape, a plurality of slats, a tilt wand and a pair of registry clips. At least one ladder tape extends horizontally between the head rail and the bottom rail, and the ladder tape comprising a plurality of steps. The slats extend horizontally between the head rail and the bottom rail, and each of the slats extends through one corresponding step of the ladder tape. The tilt wand is linked with ladder tape and operative to operative to drive the steps of the ladder tape to turn the slats with an angle. The pair of registry clips is operative to lift the bottom rail and the slats at two side portions thereof while holding the bottom rail and the slats therein.
    Type: Grant
    Filed: August 26, 2009
    Date of Patent: January 17, 2012
    Assignee: 3 Day Blinds Corporation
    Inventors: Michael J. McCarty, Frank A. Gutierrez
  • Patent number: 8091740
    Abstract: The invention concerns a dispenser, in particular for semi-solid or liquid systems, with a housing to hold a dispenser unit which is formed by a storage container, a metering unit (3) connected therewith via which the substance can be output in defined doses and an activation mechanism (4) which can activate the metering unit (3) to output a dose of substance, where the dispenser unit is held via a reservoir holder (5) in the housing (1). Known dispensers have the disadvantage that the dispenser unit is not held securely against tipping. The invention avoids this in that the storage container (2) is formed with a lower volume area (2?) and an upper volume area (2?) which to form the reservoir holder between its upper and lower end has a constricted shoulder area (9) with an inwardly angled setting surface, where the housing (1) has a corresponding support surface (10) to support the setting surface.
    Type: Grant
    Filed: July 1, 2010
    Date of Patent: January 10, 2012
    Assignee: Stockhausen GmbH
    Inventor: Anette Zur Muhlen
  • Patent number: 8089159
    Abstract: The present invention is related to a semiconductor package and method for fabricating the same wherein the semiconductor package includes a die pad having a semiconductor die mounted thereto, and two or more sets of leads or I/O pads which extend at least partially about the die pad in spaced relation thereto and to each other. The formation of the die pad and the leads of the leadframe are facilitated by the completion of multiple plating and chemical etching processes in a prescribed sequence. The present invention is further related to a semiconductor package and method for fabricating the same wherein the semiconductor package includes a semiconductor die electrically connected a plurality of leads or I/O pads via a flip chip type connection, each of the leads being formed by the completion of multiple plating and chemical etching processes in a prescribed sequence.
    Type: Grant
    Filed: October 3, 2007
    Date of Patent: January 3, 2012
    Assignee: Amkor Technology, Inc.
    Inventors: Doo Hyun Park, Jae Yoon Kim, Yoon Ha Jung
  • Patent number: 8087220
    Abstract: The film sealing and wrapping machine with a rotary cut and seal jaw is provided. The rotary cut and seal jaw has an internal sliding mechanism which provides for smooth and quiet operation. The rotational speed of the jaw may be varied to increase through put and to provide for a title bag around products. The rotary cut and seal jaw may comprise a seal bar and pressure pad may both be spring loaded to self align the seal bar and pressure pad during the sealing and cutting process. Lastly, a gap defined by a belt disposed upstream and downstream of the seal bar and pressure pad may be mechanically linked to the pressure pad through a control carriage.
    Type: Grant
    Filed: April 21, 2009
    Date of Patent: January 3, 2012
    Inventors: Raymond Uttaro, John Robinson, Michel Laurin
  • Patent number: 8089145
    Abstract: In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly, the semiconductor package of the present invention includes a generally planar die pad or die paddle defining multiple peripheral edge segments. In addition, the semiconductor package includes a plurality of leads. Some of these leads are provided in two concentric rows or rings which at least partially circumvent the die pad, with other leads including portions which protrude from respective side surfaces of a package body of the semiconductor package. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads. At least portions of the die pad, the leads, and the semiconductor die are encapsulated by the package body.
    Type: Grant
    Filed: November 17, 2008
    Date of Patent: January 3, 2012
    Assignee: Amkor Technology, Inc.
    Inventors: Gwang Ho Kim, Jin Seong Kim, Dong Joo Park, Dae Byoung Kang
  • Patent number: 8089141
    Abstract: A semiconductor package including a leadframe which has one or more anchor pads formed on and/or defined by the die pad thereof. Such anchor pad(s) may be provided in any one of a multiplicity of different pad shapes, and are adapted to satisfy the required mechanical anchoring and thermal dissipation thresholds for the package, while still enabling high density circuit routing on the printed circuit board under the package. The leadframe of the semiconductor package further includes a plurality of leads which are segregated into at least two sets, with the leads of each set extending along and in spaced relation to respective ones of the peripheral edge segments defined by the die pad. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads of each set by conductive wires.
    Type: Grant
    Filed: January 25, 2010
    Date of Patent: January 3, 2012
    Assignee: Amkor Technology, Inc.
    Inventor: Lee J. Smith
  • Patent number: 8087310
    Abstract: Provided is a micro electro mechanical systems (MEMS) device for use with an elongate structure. The MEMS device includes a generally planar substrate, a device wall layer formed upon the substrate, a septum cavity formed in the device wall layer, a channel formed in the device wall layer in fluid communication with the septum cavity, and a septum element disposed in the septum cavity. The septum element is formed of a viscoelastic material. The septum element defines a septum entry surface and a septum exit surface with the septum exit surface being exposed to the channel and disposed between the septum entry surface and the channel. The septum element is without any openings formed through the septum element extending between the septum entry and exit surfaces. Methods of manufacturing and interacting with the MEMS device are also provided.
    Type: Grant
    Filed: January 21, 2009
    Date of Patent: January 3, 2012
    Inventors: Ellis Meng, Ronalee Lo
  • Patent number: 8084868
    Abstract: In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including at least two electronic components which are provided in a stacked arrangement, and are each electrically connected to an underlying substrate through the use of conductive wires. In accordance with one embodiment of the present invention, the electronic components are separated from each other by an intervening spacer which is typically fabricated from aluminum, or from silicon coated with aluminum. In this particular embodiment, the uppermost electronic component of the stack is electrically connected to at least one of the conductive wires through the use of a conductive paste layer which is also used to secure the uppermost electronic component to the underlying spacer.
    Type: Grant
    Filed: June 18, 2010
    Date of Patent: December 27, 2011
    Assignee: Amkor Technology, Inc.
    Inventors: Roger D. St. Amand, Vladimir Perelman
  • Patent number: 8085967
    Abstract: A loudspeaker having a speaker basket including a basket rim, a speaker mounting hole, and a coupling hole disposed through the basket rim. The loudspeaker includes a first grill coupling engaged with the coupling hole, as well as a grill removably attached to the basket rim via the first grill coupling. The grill defines a solid surface portion which completely covers the speaker mounting hole and the coupling hole. The first grill coupling is interposed between the basket rim and the grill.
    Type: Grant
    Filed: May 26, 2006
    Date of Patent: December 27, 2011
    Inventors: Yoichiro Sumitani, Lin Chun-Yi
  • Patent number: 8083560
    Abstract: A pivotal surfboard fin assembly for use on a surfboard, the assembly comprising: an insert bracket having a board face mountable to the bottom surface of the surfboard and a bracket face with a lock pin aperture and a flex plug cavity; an elastomeric flex plug having a flex plug hole, a first flex plug surface, and a second flex plug surface, the flex plug disposed in the flex plug cavity; a surfboard fin having a fin blade, a mounting edge, a flex pin channel, a fixed lock pin mountable to the surfboard fin and disposable into the lock pin aperture, a biased flex pin slidably disposable into the flex pin channel and the flex plug hole; and a first compression pin and a second compression pin engaged with the insert bracket and operative to laterally compress the flex plug.
    Type: Grant
    Filed: June 5, 2009
    Date of Patent: December 27, 2011
    Inventor: Robert W. Foulke
  • Patent number: 8079775
    Abstract: A non-slick surface-seeded exposed aggregate concrete product and method of making the same enhances the coefficient of friction of an exposed surface thereof to reduce undesirable slipping and sliding. Implementations of the present invention are characterized by the use of fine sand and aggregate broadcast over the exposed surface, which surface has been prepared to receive the same. After curing, the exposed surface is then ground and acid-etched to define fissures, cracks, and/or sharp edges of the aggregate. Subsequently finishing steps are performed to produce the non-slick concrete product which may be used for high traffic pedestrian areas where foot gripping and traction are important, such as on stairs, ramps, walkways, courtyards, and the like.
    Type: Grant
    Filed: August 4, 2010
    Date of Patent: December 20, 2011
    Assignee: Lithocrete, Inc.
    Inventors: Ronald D. Shaw, Lee A. Shaw
  • Patent number: 8079609
    Abstract: An aerodynamic braking system is disclosed herein. In particular, the brake arms may define an aerodynamic leading portion or edge and may be integrated into the legs of the front fork. Also, the brake arms may be disposed behind the bottom bracket shell to take the rear brake out of the air flow path and reduce aerodynamic drag. The rear brake arms are tapered so that the brake arms remain sufficient stiff to provide sufficient brake response times. The rear brake arms may be matched to recesses formed on an underside of chain stays.
    Type: Grant
    Filed: January 28, 2010
    Date of Patent: December 20, 2011
    Assignee: Felt Racing, LLC
    Inventors: Richard Bell, Timothy Saul Lane, William Duehring, James Michael Felt, Jeffrey A. Soucek, David Tyson Buckenberger
  • Patent number: 8074703
    Abstract: Oscillating table for blooms or billets production plants, comprising pairs of bars, lying on at least one horizontal plane, which constitute the elastic support elements of the mold, thus permitting an optimal guidance of the oscillation thereof exclusively in the casting direction, said pairs of bars constituting a tie rod-strut system working in bending that confers to the table very high torsional and lateral stiffness. It allows a high precision in guiding mold thus consenting it wide oscillations in the axial casting direction only.
    Type: Grant
    Filed: February 23, 2007
    Date of Patent: December 13, 2011
    Assignee: Danieli & C. Officine Meccaniche S.p.A.
    Inventors: Alfredo Poloni, Andrea De Luca, Marco Ansoldi
  • Patent number: 8074422
    Abstract: A support bracket is provided for fastening to a concrete molding form. The bracket has a first and second distal end connected by a middle portion. The distal ends are generally in a first plane and the middle portion extends from a side of each distal end at an obtuse angle relative to that plane. The distal ends are releasably fastened to the form during use of the bracket, with the middle portion extending to be embedded in the concrete. After removal of the form, one or both of the distal ends are bent away from the concrete during use, with pipes being inserted through the openings in the distal ends. The support bracket may incorporate an internally-threaded and generally tubular structure attached to the middle portion of the support bracket, with one end of the tubular structure embedded in the concrete during use and the other end exposed at the plane of the concrete surface for useful access to the internal threads.
    Type: Grant
    Filed: August 25, 2004
    Date of Patent: December 13, 2011
    Assignee: Securus, Inc.
    Inventors: Virgil E. O'Neil, Larry D. Brown, Charles Price
  • Patent number: D651505
    Type: Grant
    Filed: May 11, 2010
    Date of Patent: January 3, 2012
    Assignees: Bohle AG
    Inventors: Eckart Roth, Lutz Strehlow, Heinrich Ostendarp
  • Patent number: D651830
    Type: Grant
    Filed: April 6, 2011
    Date of Patent: January 10, 2012
    Assignee: Pro-Mart Industries, Inc.
    Inventor: Sarine M. Sabounjian