Abstract: A waterproof electrical connection includes a wire connector including a housing having a cavity and an insert having a surface adapted for receiving at least two metallic wires disposed within the cavity of the housing; at least two metallic wires having exposed metallic surfaces, wherein a portion of the exposed surface of one wire is in contact with a portion of the exposed surface of the second wire, and further wherein a portion of the exposed surfaces of the at least two wires are in contact with the surface of the insert to define at least one contact point; and an anaerobic sealant disposed within the cavity, wherein only a portion of the anaerobic sealant proximal to the one at least contact point is in a cured state while the remaining sealant is in an uncured state. The connection may further include an air permeable cap disposed over the open end of the housing.
Type:
Grant
Filed:
November 2, 2006
Date of Patent:
May 6, 2008
Assignee:
Henkel Corporation
Inventors:
Edward A. Y. Fisher, Marcus K. Kloepping
Abstract: The invention provides fast moisture and photo/moisture curing silicone compositions and methods for the preparation thereof. More particularly, the compositions provided are prepared from silanol and silane cappers; the cappers have an ?-carbon bonded to the silicon atom allowing for a favorable hypervalent silicon transition state when reacting the silane and silanol. This favorable transition state enables both a fast endcapping reaction and contributes to the fast moisture curing properties of the inventive compositions.
Abstract: The present invention relates to a process for hydroxyalkylating terminal carboxylic acid groups. More specifically, this invention provides a process for preparing hydroxyl-functionalized materials, such as butadiene nitrile polymers, from carboxylic acid-functionalized materials, such as butadiene nitrile polymers, using a carbocyclic carbonate, such as ethylene carbonate, or a carbocyclic sulfite, such as ethylene sulfite.
Type:
Grant
Filed:
January 16, 1998
Date of Patent:
April 8, 2008
Assignee:
Henkel Corporation
Inventors:
John G. Woods, Susanne D. Morrill, Anthony F. Jacobine
Abstract: A flame-retardant molding composition that includes an epoxy resin, melamine cyanurate, and one or more hydrated metal salts capable of liberating water when heated. The hydrated metal salt may include one or more compounds selected from metal borate salts, Group IIB oxides, and polyhydroxides of one or more elements selected from Group IIA elements and Group IIIB elements. The molding composition may be used to coat an electrical or electronic device by heating the molding composition to a temperature sufficient to cure the molding composition and form a polymer on the surface of the device. Electrical and electronic devices formed by the method are also disclosed.
Type:
Grant
Filed:
May 17, 2005
Date of Patent:
March 4, 2008
Assignee:
Henkel Corporation
Inventors:
Tanweer Ahsan, Charles N. Volante, Charles S. Bischof
Abstract: The present invention relates to adhesive and sealant compositions in non-flowable form. More particularly, the present invention relates to non-flowable adhesive and sealant compositions which are particularly useful in the threadlocking and sealing applications and which can be packaged in a convenient pocket-sized applicator dispenser.
Type:
Grant
Filed:
December 5, 2006
Date of Patent:
February 19, 2008
Assignee:
Henkel Corporation
Inventors:
Shabbir Attarwala, Zhu Qinyan, Matthew P. Burdzy
Abstract: The present invention relates to anaerobically curable compositions, methods of preparation and methods of use that provide enhanced physical properties when cured in contact with untreated inactive surfaces. The compositions which include isobornyl acrylate, isobornyl methacrylate or combinations thereof in combination with a multi(meth)acrylate and a free-radical initiator, may be used without the addition of a transition metal catalyst.
Type:
Grant
Filed:
November 18, 2002
Date of Patent:
January 29, 2008
Assignee:
Henkel Corporation
Inventors:
Dzu Dinh Luong, Frederick F. Newberth, III, Canh Minh Tran, Richard D. Rich
Abstract: The present invention relates to interlayer dielectric materials and pre-applied die attach adhesives, more specifically pre-applied die attach adhesives (such as wafer and other substrate-applied die attach adhesives), methods of applying the interlayer dielectric materials onto substrates to prepare low K dielectric semiconductor chips, methods of applying the pre-applied die attach adhesives onto wafer and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.
Type:
Grant
Filed:
June 17, 2003
Date of Patent:
December 25, 2007
Assignee:
Henkel Corporation
Inventors:
Benedicto delos Santos, James T. Huneke, Puwei Liu, Kang Yang, Qing Ji
Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.
Type:
Grant
Filed:
June 10, 2004
Date of Patent:
December 18, 2007
Assignee:
Henkel Corporation
Inventors:
Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna, Jr.
Abstract: The present invention is directed to silicone formulations which are capable of being rapidly cured to tough elastomeric materials through exposure to UV radiation, and optionally through exposure to moisture as well. The cured products demonstrate high resistance to flammability and combustibility.
Abstract: The present invention provides a device and method of non-destructively monitoring reactive material through a substrate for changes in material properties that designate the condition of the reactive material during cure and service life. A transducer is placed on a portion of the substrate generally parallel to an interface of the substrate to the reactive material. The ultrasonic waves generated via the transducer are used to detect reflected sound waves upon encountering the interfaces, where the interfaces consist of changes in material properties across the substrate.
Abstract: This invention relates to silylated polymers having mixed alkoxy groups on the silyl portion thereof, methods of their preparation, and compositions and reaction products formed therefrom. These alkoxysilylated polymers can be crosslinked when exposed to atmospheric moisture to become useful elastomers, sealants or adhesives. The presence of different alkoxy groups on the silicon atoms can control or otherwise moderate the cure speeds of these silylated polymers.
Type:
Grant
Filed:
February 22, 2002
Date of Patent:
December 11, 2007
Assignees:
Henkel Corporation, Henkel KGaA
Inventors:
Thomas F. Lim, Thomas Bachon, Bernd Beuer, Johann Klein
Abstract: Moisture curable compositions that include alkoxysilyl capped polymer compounds and alkylsilyl capped plasticizers adhesively cure to polyolefin substrates, including polyethylene and polyolefin substrates. The compositions are curable at room temperature or at temperatures greater than room temperature. The compositions further include an adhesion promoter, a filler or a moisture curing catalyst.
Abstract: The present invention generally relates to curable compositions free of metallic catalysts. The inventive compositions are capable of curing when applied to a metal substrate. The inventive compositions provide improved thermal performance and enhanced cure strength on oily metal surfaces.
Type:
Grant
Filed:
April 20, 2004
Date of Patent:
September 18, 2007
Assignee:
Henkel Corporation
Inventors:
Shabbir Attarwala, Qinyan Zhu, Susan Lamtruong Levandoski