Patents Represented by Attorney Steven C. Bauman

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  • UV curing system
    Patent number: 6972413
    Abstract: The present invention relates generally to systems for directing light-based radiation onto a light curable material. More particularly, the present invention is directed to a device for uniformly exposing a UV curable material to UV energy.
    Type: Grant
    Filed: March 15, 2004
    Date of Patent: December 6, 2005
    Assignee: Henkel Corporation
    Inventors: James Robert Krogdahl, Patrick Joseph Courtney
  • Silicone resin composition
    Patent number: 6972314
    Abstract: This invention provides a silicone resin composition giving a silicone cured rubber exhibiting a higher elongation percentage as well as improved heat resistance, oil resistance and chemical resistance, which are particularly required for automobile applications. A silicone cured rubber meeting the above physical property requirements can be prepared by moisture-curing a silicone resin composition including 100 wt parts of (a) an OH-containing polysiloxane, 0.1 to 200 wt parts of (b) a carbodiimide and (c) an organosilicon crosslinking agent, or alternatively by thermally curing a silicone resin composition including 100 wt parts of (a) an OH-containing polysiloxane, 0.1 to 200 wt parts of (b) a carbodiimide and (d) an amino-containing silane.
    Type: Grant
    Filed: September 8, 2003
    Date of Patent: December 6, 2005
    Assignee: Henkel Corporation
    Inventors: Hideki Ueno, Hiroyuki Kayaki
  • Low shrinkage thermosetting resin compositions and methods of use therefor
    Patent number: 6963001
    Abstract: In accordance with the present invention, there are provided thermosetting resin compositions with a reduced propensity to shrink in volume upon cure and methods of use therefor. The compositions of the present invention include compounds having aromatic, rigid-rod like spacer groups between the crosslinkable moieties. As such, these compounds impart a degree of liquid crystal-like character to the thermosetting resin composition which results in lower shrinkage upon cure. This effect follows from the well-known expansion that occurs when liquid crystal-like materials pass from a nematic liquid crystal-like state to an isotropic state. Further provided by the present invention are low shrinkage die attach pastes and methods of use therefor.
    Type: Grant
    Filed: February 14, 2003
    Date of Patent: November 8, 2005
    Assignee: Henkel Corporation
    Inventors: Stephen M. Dershem, Kang Yang, Puwei Liu
  • Thermosetting resin compositions containing maleimide and/or vinyl compounds
    Patent number: 6960636
    Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.
    Type: Grant
    Filed: January 13, 2003
    Date of Patent: November 1, 2005
    Assignee: Henkel Corporation
    Inventors: Stephen M. Dershem, Puwei Liu
  • Cure accelerators for anaerobic curable compositions
    Patent number: 6958368
    Abstract: The present invention relates to new cure accelerators for anaerobic curable compositions. These anaerobic cure accelerators are generally sulfinimides and oxygen and sulfur derivatives thereof, sulfonimides and oxygen and sulfur derivatives thereof, sulfonamides and oxygen and sulfur derivatives thereof, and oxygen and sulfur analogues of sulfimides.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: October 25, 2005
    Assignee: Henkel Corporation
    Inventors: Philp T. Klemarczyk, Karen R. Brantl, Andrew D. Messana
  • Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex
    Patent number: 6951907
    Abstract: A thermosetting resin is useful as an underfilling sealant form mounting semiconductors onto a printed circuit board and comprises (a) an epoxy resin containing at least one multifunctional epoxy resin, (b) an adhesion promotor having at least two secondary amine groups wherein the weight ratio of epoxy resin:adhesion promotor being from about 2:1 to about 20:1, (c) a curative of a nitrogen-containing compound and a transition metal complex; and, optionally, a polysulfide toughening agent.
    Type: Grant
    Filed: April 14, 2003
    Date of Patent: October 4, 2005
    Assignee: Henkel Corporation
    Inventor: Mark M. Konarski
  • Heterobifunctional monomers and uses therefor
    Patent number: 6946523
    Abstract: In accordance with the present invention, there are provided novel heterobifunctional monomers and users for the same. Invention compounds have many of the properties required by the microelectronics industry, such as, for example, hydrophobicity, high Tg values, low dielectric constant, ionic purity, low coefficient of thermal expansion (CTE), and the like. These properties result in a thermoset that is particularly well suited to high performance applications where typical operating temperatures are often significantly higher than those at which prior art materials were suitable. Invention compounds are particularly ideal for use in the manufacture of electronic components, such as, for example, printed circuit boards, and the like.
    Type: Grant
    Filed: July 1, 2003
    Date of Patent: September 20, 2005
    Assignee: Henkel Corporation
    Inventors: Stephen M. Dershem, Kevin J. Forrestal, Puwei Liu
  • Initiator systems, polymerisable compositions, and uses thereof for bonding low surface energy substrates
    Patent number: 6939932
    Abstract: Use of an initiator system comprising: a combination of an organoborane and a polyaziridine, in a ratio of aziridine groups to boron atoms of greater than 1.3:1, as an initiator of polymerisation in an adhesive composition for bonding a low surface energy substrate; provided that the initiator system does not contain more than a trace amount of a complex of organoborane with a complexing agent selected from: an amine other than a polyaziridine; a complexing agent comprising at least one hydroxide; a complexing agent comprising at least one alkoxide; or amidine complexing agent.
    Type: Grant
    Filed: April 21, 2003
    Date of Patent: September 6, 2005
    Assignee: Loctite (R&D) Limited
    Inventors: Brendan J. Kneafsey, Gerry Coughlan
  • Reworkable epoxidized 1-(cyclo) alkenyl ether/polycarboxylic acid product
    Patent number: 6936664
    Abstract: The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components comprising (a) a curable epoxy component which is the reaction product of an epoxidized 1-alkenyl ether or 1-cycloalkenyl ether and a polycarboxylic acid, the reaction product being substantially free of unreacted acid or acid impurities; and (b) a curing agent for the epoxy component, wherein the reaction products of the epoxy composition are reworkable. The cured epoxy compositions of this invention contain thermally labile weak ?-alkoxy ester linkages which provide for the reworkable aspect of the invention.
    Type: Grant
    Filed: October 4, 2001
    Date of Patent: August 30, 2005
    Assignee: Henkel Corporation
    Inventors: John G. Woods, Susanne D. Morrill, Jianzhao Wang, Brendan J. Kneafsey
  • Flame-retardant molding compositions
    Patent number: 6936646
    Abstract: A flame-retardant molding composition that includes an epoxy resin, melamine cyanurate, and one or more hydrate metal salts capable of liberating water when heated. The hydrated metal salt may include one or more compounds selected from metal borate salts, Group IIB oxides, and polyhydroxides of one more elements selected from Group IIA elements and Group IIIB elements. The molding composition may be used to coast an electrical or electronic device by heating the molding composition to a temperature sufficient to cure the molding composition and form a polymer on the surface of the device. Electrical and electronic devices formed by the method are also disclosed.
    Type: Grant
    Filed: April 30, 2003
    Date of Patent: August 30, 2005
    Assignee: Henkel Corporation
    Inventors: Tanweer Ahsan, Charles N. Volante, Charles S. Bischof
  • Elastomer toughened radiation curable adhesives
    Patent number: 6921454
    Abstract: A radiation curable adhesive composition which includes: a) an ?,?-olefinically unsaturated ether monomer component consisting of one or more compounds having the formula: R[O—CH?CHR1]n??(I) where R is an n-valent carbon-linked organic group R1 is H or a monovalent carbon-linked organic group and n has a value of 1 or more, b) an elastomeric polymer having a tensile strength at break of greater than 1500 psi (10342 kPa), and an elongation at break of greater than 100%, and c) a cationic photoinitiator.
    Type: Grant
    Filed: November 27, 2001
    Date of Patent: July 26, 2005
    Assignee: Henkel Corporation
    Inventors: Weitong Shi, JoAnn DeMarco, Shabbir Attarwala
  • Photocurable adhesive compositions, reaction products of which have low halide ion content
    Patent number: 6918984
    Abstract: The present invention is directed to a photocurable composition for use as an encapsulant, for underfill or attachment adhesives, capable of curing at wavelengths greater than 290 nm. Reaction products of these photocurable compositions have a low level of extractable halide ion, such as less than 100 ppm. In use, the photocurable composition may be applied, for instance, over the wire bonds that electrically connect a semiconductor device to a substrate to maintain a fixed positional relationship and protect the integrity of the electrical connection from vibrational and shock disturbances, as well as from interference from environmental contaminants.
    Type: Grant
    Filed: June 24, 2002
    Date of Patent: July 19, 2005
    Assignee: Loctite (R&D) Limited
    Inventors: Helen M. Murray, Jonathan P. Wigham, John E. Cahill, Aisling Lakes, Matthew J. Holloway, Eadaoin D. Ledwidge, Mary B. Ward
  • Thermally reworkable epoxy resins and compositions based thereon
    Patent number: 6916890
    Abstract: The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components including (a) the epoxidized reaction product of a multifunctional 1-alkenyl ether or 1-cycloalkenyl ether and an alkenyl carboxylic acid, the epoxidized reaction product having two or more thermally labile alpha-alkoxy ester linkages; and (b) a curing agent for the epoxy component. The epoxy composition, when cured, provides a composition which is thermally reworkable, the weak ?-alkoxy ester linkages providing for the reworkable aspect of the invention.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: July 12, 2005
    Assignee: Henkel Corporation
    Inventors: John G. Woods, Susanne D. Morrill
  • Thermosetting resin compositions containing maleimide and/or vinyl compounds
    Patent number: 6916856
    Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.
    Type: Grant
    Filed: July 3, 2002
    Date of Patent: July 12, 2005
    Assignee: Henkel Corporation
    Inventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna, Jr.
  • Two-part, room temperature curable epoxy resin/ (meth)acrylate compositions and process for using same to bond substrates
    Patent number: 6911109
    Abstract: The present invention provides two part, room-temperature curable epoxy resin/(meth)acrylate compositions. The compositions provide among other advantageous properties high flash point and low odor, and reaction products thereof demonstrate at least comparable and often improved fixture time, improved adhesion strength, and improved adhesion strength over time, to substrates which are ordinarily difficult to bond (such as plastics) with epoxy-based compositions, as contrasted to commercially available comparable products that are of low flash point and higher odor.
    Type: Grant
    Filed: December 11, 2000
    Date of Patent: June 28, 2005
    Assignee: Henkel Corporation
    Inventors: Donald J. Giroux, Robert H. Pauze, Charles F. Schuft
  • Radiation-curable, cyanoacrylate-containing compositions
    Patent number: 6906112
    Abstract: A radiation-curable composition which includes a cyanoacrylate component or a cyanoacrylate-containing formulation; a metallocene component; and a polymerizingly effective amount of a photoinitiator to accelerate the rate of cure is provided.
    Type: Grant
    Filed: March 12, 2002
    Date of Patent: June 14, 2005
    Assignee: Henkel Corporation
    Inventors: Stan Wojciak, Shabbir Attarwala
  • Optimized anaerobic adhesive compositions and methods of preparing same
    Patent number: 6903147
    Abstract: The present invention relates to anaerobic adhesive compositions which have been optimized using experimental design techniques to produce desired physical properties. A simplified cure system is disclosed which permits enhanced fixture and cure times.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: June 7, 2005
    Assignee: Henkel Corporation
    Inventor: Eerik Maandi
  • Cure accelerators for anaerobic curable compositions
    Patent number: 6897277
    Abstract: The present invention relates to phenyl glycines and derivatives thereof as cure accelerators for anaerobic curable compositions.
    Type: Grant
    Filed: December 22, 2003
    Date of Patent: May 24, 2005
    Assignee: Henkel Corporation
    Inventors: Philip T. Klemarczyk, Karen R. Brantl
  • Foamable compositions
    Patent number: 6894082
    Abstract: This invention relates to latent foamable compositions for use in or as adhesives, sealants and/or coatings. The compositions include a curable component or a thermoplastic component, together with a latent foaming agent. In curable versions of the inventive compositions, a cure initiator or catalyst may also be included.
    Type: Grant
    Filed: September 16, 2002
    Date of Patent: May 17, 2005
    Assignee: Henkel Corporation
    Inventors: Karen R. Brantl, Philp T. Klemarczyk
  • Thermosetting resin compositions useful as underfill sealants
    Patent number: 6893736
    Abstract: The present invention provides a thermosetting resin composition useful as a highly filled low CTE underfilling sealant composition which completely fills the underfill space in a semiconductor device, such as a flip chip assembly which includes a semiconductor chip mounted on a carrier substrate, enables the semi-conductor to be securely connected to a circuit board by heat curing and with good productivity, and demonstrates acceptable heat shock properties (or thermal cycle properties). The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component, a latent hardener component, and a polysulfide-based toughening component. The latent hardener component includes a modified amide component and a latent catalyst therefor.
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: May 17, 2005
    Assignee: Henkel Corporation
    Inventor: Mark M. Konarski