Abstract: The present invention provides an electromagnetic energy spot curing method and system which integrates the UV radiation with an inert gas to disperse the gas and the radiation energy simultaneously to cure an adhesive surface on a target or work piece. The system provides a means to cure the adhesive surface during photoinitiation to expel the atmospheric oxygen which otherwise would interfere with the curing cycle.

Abstract: This invention relates to (meth)acrylate based polymerizable compositions and adhesive systems prepared therefrom, which include an initiator system comprising a complex of an organoborane with a complexing agent, an aziridine-containing compound, and a carrier material with which the initiator system is unreactive and which renders the composition having a flash point above 140° F. The inventive compositions desirably have a flash point above 200° F., for each of the parts of the adhesive system. To achieve the physical properties of the inventive compositions and adhesive systems, it is desirable for the carrier material to have such flash points; however, provided that in their entirety the inventive compositions and adhesive systems have such flash points, it is not necessary for the carrier material itself to have such flash points. The inventive compositions and adhesive systems also include a package for controlling the rate of cure and indicating the extent of cure.

Abstract: The present invention is directed to methylene chloride-free, and optionally methanol-free, paint stripper and gasket remover formulations as alternatives to methylene chloride-based paint strippers and gasket removers.

Abstract: In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polysulfides have been found to be useful toughening agents of component level underfill adhesive compositions. Invention materials are liquid rubbers which provide improved fracture toughness while maintaining satisfactory capillary flow properties. Invention materials can be synthesized in neat (solventless) reactions from readily available low-cost raw materials and isolated in high yields. They have linear and branched telechelic structures with terminal epoxide functional groups, and are prepared without substantially increasing the molecular weight of the starting polysulfide materials. Invention materials are compatible with common epoxy formulations and may be used without purification. At low levels of incorporation, they provide adhesives that meet the minimum fracture toughness (Gq>2.

Abstract: Adhesive compositions are disclosed which include acrylates, their polymers, and free radical initiators. The compositions include a multi-functional alpha-alkoxyalkyl (meth)acrylate compound and a free radical initiator. The multi-functional alpha-alkoxyalkyl (meth)acrylate compound is the reaction product of: (a) a (meth)acrylic acid or a (meth)acrylate ester having a free carboxylic acid group; and (b) a compound including two or more 1-alkenyl ether groups and free of acetal and ketal groups, or a compound free of acetal and ketal groups and including one or more 1-alkenyl ether groups and a (meth)acrylate group. The compositions are easier and less expensive to prepare than conventional acrylate compositions and degrade when contacted with an acid medium or when heated. The compositions are useful in a wide range of applications and are compatible with conventional adhesive additives.

Abstract: A radiation-curable composition which includes a cyanoacrylate component or a cyanoacrylate-containing formulation; a metallocene component; a photoinitiator; and a luminescent and/or fluorescent dye.

Abstract: Compositions for bonding galvanized surfaces are disclosed. The compositions include either (i) a first part that includes at least one (meth)acrylate component in combination with a free radical inhibitor component and a phosphate ester component and a second part that includes at least one accelerator component or (ii) a first part that includes at least one (meth)acrylate component in combination with an accelerator and a phosphate ester component and a second part that includes a carrier component and a free radical initiator component. Methods for preparing and methods for using these compositions also are disclosed, as are processes for inhibiting corrosion on galvanized surfaces.

Abstract: A thermal interface for facilitating heat transfer from an electronic component to a heat sink. According to a preferred embodiment, the thermal interface comprises a first planar substrate that defines a first continuous peripheral edge, at least a portion of which extends beyond the interface mating surface between the electronic component and heat sink. Formed upon opposed sides of the substrate are layers of thermally conductive compositions, which preferably comprise certain novel graphitic allotrope compounds. The thermal interface further includes an adhesive deposited upon such portion of the peripheral edge extending beyond the mating surface between the electronic component and heat sink such that the thermal interface may be adhesively secured into position without forming an additional layer at the mating juncture between the electronic component and the heat sink.

Abstract: For attaching the oil sump (10) to the engine block (30) of a combustion engine, a seal is made between the engine block (30) and the oil sump (10) by means of a curable composition (20). The adhesion of the composition (20) when cured is sufficient to secure the oil sump (10) to the engine block (30). The adhesion should be at least 0.5 N/mm2, especially more than 0.8 N/mm2. The curable composition (20) can be a silicone composition. The oil sump (10) can be fixed to the engine block (30) at least during the curing of the composition (20). To this end, the edge of the oil sump can be designed such that a self-fixing takes place when the oil sump (10) is joined to the engine block (30).

Abstract: The present invention relates to adhesive and sealant compositions in non-flowable form. More particularly, the present invention relates to non-flowable adhesive and sealant compositions which are particularly useful in the threadlocking and sealing applications and which can be packaged in a convenient pocket-sized applicator dispenser.

Abstract: The present invention provides a thermoset conductive ink for use in through hole interconnections or similar electric and electronic applications to provide stable electrical connections. The conductive ink of this invention comprises a thermal curable resin system having an admixture of one or more maleimide, nadimide, or itaconimide containing resins, a comonomer and a catalyst, an electrically conductive material such as silver, copper or silver-coated copper, and optionally an organic solvent.

Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

Abstract: Flexible, moisture curing ABA triblock copolymers are prepared from poly(alkylene oxide) diols as the B segment and polyester diols as the A block. This backbone is end-capped with siloxy end groups to obtain RTV moisture curing triblocks having high strength and flexibility.

Abstract: A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

Abstract: A thermal interface wafer for facilitating heat transfer from an electronic component to a heat sink. The wafer is formed from at least one elongate, vertically-oriented strip of thermally conductive material having a layer of conformable, heat-conducting material formed thereon. Preferably, the substrate comprises a metal foil, such as aluminum or some other thermally-conductive metal, that is formed as a flat, spiral-like coil. Such strip may further be configured to have a serpentine configuration, or may alternatively be formed from a multiplicity of strips. The present invention further provides for methods of transferring heat from an electronic component to a heat sink, as well as methods for fabricating the thermal interface wafers of the present invention.

Abstract: An activator composition for the accelerated hardening of cyanoacrylate adhesives, wherein the activator comprises a member selected from the group consisting of: aromatic heterocyclic compounds having at least one N hetero atom in the ring(s) such as pyridines, quinolines and pyrimidines and substituted on the ring(s) with at least one electron-withdrawing group which decreases the base strength of the substituted compound compared to the corresponding unsubstituted compound, mixtures of any of the foregoing with each other, and/or with N,N-dimethyl-p-toluidine, and mixtures of any of the foregoing and/or N,N-dimethyl-p-toluidine with an organic compound containing the structural element, —N?C—S—S—, such as dibenzothiazyl disulfide. 6,6?dithiodinicotinic acid, 2,2?-dipyridyl disulfide, and bis(4-t-butyl-1-isopropyl-2-imidazolyl)disulfide. An activator composition may comprise a solution of one or more activators in a solvent mixture which comprises a volatile hydrocarbon and a cyclic ketone.

Abstract: A molding compound for use in encapsulating electronic packages which include an optoelectronic component, such as an LED, is provided. The molding compound of the present invention includes a partially cured epoxy composition having a phosphor material substantially uniformly distributed throughout the epoxy composition. The phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.

Abstract: A dispensing nozzle for dispensing anaerobic adhesives/sealants in an automated dispensing system, is provided. More specifically, the nozzle having a hollow body with an entry port and an exit port, the body having a wall with an internal wall surface which defines an elongate conduit arranged about a longitudinal axis of the nozzle, and linking the entry port to the exit port, where at the exit port the internal wall surface alternates in distance from the axis of the nozzle between axis proximate positions and axis distal positions, thereby forming a dispensing opening in the exit port of non-circular cross sectional area. The wall is flexible radially outwardly in the regions of the axis proximate positions.

Abstract: A cyanoacrylate composition comprising (i) at least one lower cyanoacrylate monomer component selected from ethyl cyanoacrylate or methoxy ethylcyanoacrylate; (ii) at least one higher cyanoacrylate monomer component than in an amount greater than 12% by weight based on the total weight of the combination of the lower cyanoacrylate monomer and the higher cyanoacrylate monomer and (iii) a plasticizer. The higher cyanoacrylate monomer and the plasticizer are chosen from certain ones. The compositions cure to give flexible polymeric materials which are desirably also transparent.

Abstract: The invention provides a method of forming a monolayer of substantive particles including the steps of applying to a substrate a curable composition having substantive particles contained therein, the substantive particles having a particle size on at least one dimension thereof of at least 1 micrometer and being in two or more groups of different sizes; exposing the substantive particle-containing curable composition to a source of energy suitable for effecting polymerization of the curable composition for a sufficient time to effect polymerization of a layer of the curable composition having a thickness of no more than 50% of the height of the largest substantive particles; and optionally, removing uncured curable composition. The invention also provides a method of forming a monolayer of substantive particles in a non-random array where the curable composition comprises a ferrofluid composition.