Abstract: A system replicates the rapid temperature increases that are believed to cause microbump failures in certain applications of programmable logic devices (PLDs). The system configures a PLD under test with a circuit that switches a large amount of current and generates a large amount of heat when the circuit is clocked. The system monitors the temperature of the PLD and controls the switching of the circuit to achieve a predetermined temperature within a predetermined time period. The PLD is cooled, and the thermal cycling is repeated. The system detects microbump failures and communicates failure data to a computer for logging and analysis.

Abstract: A performance monitor is realized from programmable logic on the same integrated circuit as a processor. A user may use a programming and analysis tool to select a performance monitor soft core and to program it into the integrated circuit. The performance monitor is used to debug and/or monitor operation of the processor. After the debugging and/or performance monitoring, the portion of the programmable logic used to realize the performance monitor can be reconfigured and used to realize another portion of the user-specific circuit. Because the portion of the integrated circuit used to realize the performance monitor can be later used in the user-specific design, the cost of having to provide a no-longer-desired performance monitor in each integrated circuit used in the user's design is avoided. Because the performance monitor is realized from programmable logic, the performance monitor is more flexible than a conventional hardwired configurable performance monitor.

Abstract: A capacitive interposer (caposer) is disposed inside an integrated circuit package between a die and an inside surface of the package. Conductive layers within the caposer constitute a bypass capacitor. In a through-hole caposer, micro-bumps on the die pass through through-holes in the caposer and contact corresponding landing pads on the package. As they pass through the caposer, power and ground micro-bumps make contact with the plates of the bypass capacitor. In a via caposer, power and ground micro-bumps on the die are coupled to power and ground landing pads on the package as well as to the plates of the bypass capacitor by power and ground vias that extend through the caposer. In signal redistribution caposer, conductors within the caposer redistribute signals between die micro-bumps and package landing pads. In an impedance matching caposer, termination structures within the caposer provide impedance matching to a printed circuit board trace.

Abstract: A system for distributing a small signal differential signal to a circuit element. The system includes: a first converter configured to convert a first small signal differential signal to a first two phase full CMOS differential signal for input into the differential multiplexer; and a programmable driver circuit configured to boost an output current of the programmable driver circuit at selected frequencies and to convert two phase full CMOS differential signal outputs of the differential multiplexer to a second small signal differential signal.

Abstract: An FPGA is laid out as a plurality of repeatable tiles, wherein the tiles are disposed in columns that extend from one side of the die to another side of the die, and wherein each column includes tiles primarily of one type. Because substantially all die area of a column is due to tiles of a single type, the width of the tiles of each column can be optimized and is largely independent of the size of the other types of tiles on the die. The confines of each type of tile can therefore be set to match the size of the circuitry of the tile. Rather than providing a ring of input/output blocks (IOBs) around the die periphery, IOB tiles are disposed in columns only. Where more than two columns worth of IOBs is required, more than two columns of IOB tiles can be provided.

Abstract: An integrated circuit die contains digital circuitry that emits noise (for example, in the audio frequency range) in the form of electromagnetic radiation. The integrated circuit die is provided with a shielded platform above the digital circuitry. The shielded platform has one metal plate that is coupled to an analog supply voltage source and another metal plate that is coupled to an analog ground terminal. The digital circuitry is coupled to a digital supply voltage source. A second die with noise-sensitive analog circuitry is stacked on the shielded platform and is shielded by the shielded platform from the noise. The analog circuitry is powered by the analog supply voltage source. Conductive vias in a predetermined pattern protrude through the shielded platform and provide a standardized way of connecting any one of numerous noise-sensitive second dice to the relatively noisy digital circuitry of the underlying die.

Abstract: A method and apparatus for distributing multimedia content (such as video, games, music, pictures), where the multimedia content is stored in a plurality of set-top boxes that are connected to a cable network. A controller unit located at a central cable station manages the multimedia content. The multimedia content stored in the set-top boxes is made available to any set-top box on request to the controller in the central cable station. The controller unit also interfaces with a plurality of multimedia owners, many situated on the Internet, to source the multimedia content and to source service properties associated with the multimedia content. The controller unit informs the content owners and appropriate billing systems when a multimedia content has been delivered to a remote set-top box and has been consumed by an end user. The end user accesses the multimedia content through a television, a personal computer, or other multimedia appliance.

Abstract: A general purpose interface tile of a first integrated circuit includes a plurality of micropads. A second integrated circuit may be stacked on the first integrated circuit such that signals from the second integrated circuit are communicated through the micropads and the interface tile to other circuitry on the first integrated circuit. Similarly, signals from the first integrated circuit are communicated through the interface tile and the micropads to the second integrated circuit. In the event that the first integrated circuit is a programmable logic device having a programmable interconnect structure, the interface tile is part of and hooks into the programmable interconnect structure and provides a general purpose mechanism for coupling signals from the second integrated circuit to the programmable interconnect structure and/or for coupling signals from the programmable interconnect structure to the second integrated circuit.

Abstract: A supporting structure is wafer-bonded to the upper face side of a partially or fully processed device wafer. The device wafer includes a transistor having a well region that extends into the substrate material of the device wafer. The source and drain regions of the transistor extend into the well region. After attachment of the supporting structure, the device wafer is thinned from the back side until the bottom of the well region is reached. To reduce source and drain junction capacitances, etching can continue until the source and drain regions are reached. In one embodiment, all of the well-to-substrate junction is removed in a subsequent etching step, thereby reducing or eliminating the well-to-substrate junction capacitance of the resulting transistor. Resistance between the well electrode and the transistor channel is reduced because the well contact is disposed on the back side of the device wafer directly under the transistor gate.

Abstract: A series capacitor coupling (SCC) structure is controllable to capacitively couple a data input lead of the SCC structure to an output lead of the SCC, or to de-couple the data input lead from the data output lead. An SCC is controlled by a control bit stored in an associated memory cell. A multiplexer is fashioned out of a plurality of such SCC structures such that the edges of a digital signal received on a selected one of a plurality of multiplexer data input leads is coupled through the SCC structures onto an intervening node. The edges of the digital signal on the intervening node are then latched to recreate the incoming digital signal and the latched signal is output onto a multiplexer data output lead. The multiplexer is very fast and has a low leakage current in comparison to conventional transmission gate multiplexers used in programmable logic devices.

Abstract: A balanced clock tree has a coaxial structure when a piece of the tree is viewed in cross-section. A plate is capacitively coupled to the inner conductor that runs down the center of the coaxial structure. This plate is usable to AC couple into the clock signal being propagated down the clock line. A programmable structure is disclosed for doing this whereby the clock signal is capacitively coupled from the clock line onto the input lead of a latch. The latch recreates the clock signal. The latch drives the recreated clock signal onto a local clock conductor. The structure is programmable in that it either couples the clock signal onto the local conductor or not depending on the state of a configuration bit in a memory cell of the programmable structure. In one embodiment, the clock tree can be tapped without substantially affecting signal propagation characteristics of the clock tree.

Abstract: An FPGA is readily connectable to a high-speed fiber optic link by snap fitting an external fiber optic cable into an accommodating duplex fiber optic connector of a low-profile packaged FPGA integrated circuit. The low-profile packaged FPGA integrated circuit includes a die-bonded assembly disposed within a co-fired multilayer ceramic integrated circuit package. The die-bonded assembly includes the optoelectronic die, the bottom surface of which is die-bonded and electrically interconnected by micropads to the upper surface of the core of an FPGA integrated circuit die. A first optical fiber communicates light from the connector, through the package, and to a photodetector on the optoelectronic die. A second optical fiber communicates light from a laser diode on the optoelectronic die, through the package, and to the connector. In some embodiments, a micromirror device is disposed within the package to redirect light between the optoelectronic die and the optical fibers.

Abstract: The circuitry of a programmable logic device (for example, an FPGA) includes a configurable logic portion and a configuration memory. The configuration memory stores configuration data that configures the configurable logic portion to realize a user-defined circuit. The configurable logic portion is disposed on a first die whereas the configuration memory is disposed on a second die. The second die is bonded to the first die in stacked relation. Each bit of configuration data passes from the second die to the first die through a pair of micropads. One micropad of the pair is disposed on the first die and the other micropad of the pair is disposed on the second die. When the first die and second die are brought together in face-to-face relation, the two micropads form an electrical connection through which the configuration data bit passes from the second die to the first die.

Abstract: Individual IP vendors can directly license their IP modules to PLD users. Each PLD has a unique device identifier (UDI). If a user obtains a license to use an IP module on a particular PLD, then the IP vendor issues the user an authorization code (AC). The user supplies the AC to a license manager. The license manager decrypts the AC and checks that the UDI of the supplied AC matches the UDI of the PLD. If the two match, then the license manager encrypts a key, and sends the encrypted key to the PLD. The PLD uses a private key to decrypt the key. When the configuration bitstream for the design is later sent to the PLD, the license manager encrypts the IP module portion of the bitstream with the key. The PLD receives the bitstream and uses the decrypted key to decrypt the IP module portion.

Abstract: A wafer of integrated circuits under test (ICUT) is tested by supplying power to the ICUTs using power and ground traces that extend between rows of the ICUTs in scribe streets. Test information is supplied to each ICUT by transmitting the test information optically onto the entire wafer. A diode on each ICUT receives the optical test information. The ICUT uses the test information to perform a self-test. Each ICUT has a diode for transmitting optical test information. All ICUTs on the wafer transmit results of the self-tests at the same time. A test device receives the optical test information and identifies the information from each of the many ICUTs, one from another. An entire wafer of ICUTs is therefore tested simultaneously without using a probe card either to power an ICUT or to supply test information to or receive test information from an ICUT.

Abstract: A capacitive interposer (caposer) is disposed inside an integrated circuit package between a die and an inside surface of the package. Conductive layers within the caposer constitute a bypass capacitor. In a through-hole caposer, micro-bumps on the die pass through through-holes in the caposer and contact corresponding landing pads on the package. As they pass through the caposer, power and ground micro-bumps make contact with the plates of the bypass capacitor. In a via caposer, power and ground micro-bumps on the die are coupled to power and ground landing pads on the package as well as to the plates of the bypass capacitor by power and ground vias that extend through the caposer.

Abstract: A die having a bypass capacitor is stacked on another die having an active circuit. The active circuit draws a spike of current, for example, during a switching period of a voltage on its output lead from one digital logic level to another digital logic level. The bypass capacitor provides a portion of the spike of current through a conductive plug that extends from a plate of the bypass capacitor to a power lead of the active circuit. The length of the conductive plug is reduced by extending the conductive plug from the bypass capacitor to the active circuit orthogonally to the planar orientation of the dice. Reducing the length of the conductive plug reduces the resistance and inductance of the conductive plug and, in turn, reduces the drop in voltage between the voltage on the bypass capacitor and the voltage on the power lead of the active circuit.

Abstract: A wafer of integrated circuits under test (ICUT) is tested by supplying power to the ICUTs using power and ground traces that extend between rows of the ICUTs in scribe streets. Test information is supplied to each ICUT by transmitting the test information optically onto the entire wafer. A diode on each ICUT receives the optical test information. The ICUT uses the test information to perform a self-test. Each ICUT has a diode for transmitting optical test information. All ICUTs on the wafer transmit results of the self-tests at the same time. A test device receives the optical test information and identifies the information from each of the many ICUTs, one from another. An entire wafer of ICUTs is therefore tested simultaneously without using a probe card either to power an ICUT or to supply test information to or receive test information from an ICUT.

Abstract: An interface device is connected to a host by an I/O bus and provides hardware and processing mechanisms for accelerating data transfers between a network and a storage unit, while controlling the data transfers by the host. The interface device includes hardware circuitry for processing network packet headers, and can use a dedicated fast-path for data transfer between the network and the storage unit, the fast-path set up by the host. The host CPU and protocol stack avoids protocol processing for data transfer over the fast-path, freeing host bus bandwidth, and the data need not cross the I/O bus, freeing I/O bus bandwidth. The storage unit may include RAID or other multiple drive configurations and may be connected to the INIC by a parallel channel such as SCSI or by a serial channel such as Ethernet or Fibre Channel.

Abstract: Program code for a Processor is stored in a non-volatile memory (for example, flash memory). An individual data bit stored in a memory cell of the non-volatile memory can be changed from an unprogrammed state to a programmed state using a write cycle. An individual bit stored in the memory cannot, however, be changed from the programmed state back to the unprogrammed state without performing an erase cycle on all the bits of a page of memory cells. The processor has an instruction set that includes a multi-bit breakpoint instruction, all the bits of which are the programmed state. Because all the bits of the breakpoint instruction are the programmed state of the memory, the breakpoint instruction can be written over any other instruction that is stored in the memory without having to perform an erase cycle or erase an entire page of program code.