Patents Represented by Law Firm Thomason and Moser
  • Patent number: 6221174
    Abstract: The present invention is a method of wafer processing which improves the reliability of an integrated titanium (Ti)/titanium nitride (TiN) CVD film formed from a reaction of titanium tetrachloride (TiCi4) and ammonia (NH3). A Ti film is subject to a treatment of NH3 gas to render the Ti film unreactive towards attack by chlorine and hydrogen chloride. A thin seed layer of TiN film is deposited upon the treated Ti film using a thermal TiCl4/NH3 reaction. Subsequent TiN film deposition upon the seed layer results in a successful integration of a Ti/TiN film stack for a Ti film thickness up to about 300 Å.
    Type: Grant
    Filed: February 11, 1999
    Date of Patent: April 24, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Fufa Chen, Yin Lin, Jianhua Hu, Frederick Wu, Ming Xi, Li Wu
  • Patent number: 6221784
    Abstract: An apparatus and method for in-situ etching of a substrate comprising both a polysilicon layer and an overlying dielectric layer. An embodiment of the method comprises an anisotropic etch of the dielectric layer in a chamber using a first fluorinated gas (such as CF4, NF3, SF6, and the like) as an etch gas to expose at least a portion of underlying polysilicon layer. Following the anisotropic etch and without removing the substrate from the chamber, i.e., in situ, an isotropic etch is preformed on the underlying polysilicon layer using a second fluorinated gas (such as CF4, NF3, SF6, and the like) as an etch gas.
    Type: Grant
    Filed: November 29, 1999
    Date of Patent: April 24, 2001
    Assignee: Applied Materials Inc.
    Inventors: Ursula Schmidt, Walter Schoenleber, Michael Schmidt
  • Patent number: 6221221
    Abstract: Apparatus providing a low impedance RF return current path between a shield member and a pedestal in a semiconductor wafer processing chamber. The return path reduces RF voltage drop between the shield member and the pedestal during processing. The return path comprises a conductive strap connected to the pedestal and a conductive bar attached to the strap. A toroidal spring makes multiple parallel electrical connections between the conductive bar and the shield member. A support assembly, attached to a collar on the chamber wall, supports the conductive bar.
    Type: Grant
    Filed: November 16, 1998
    Date of Patent: April 24, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Ayad Al-Shaikh, Michael Rosenstein, Bradley O. Stimson, Jianming Fu, Praburam Gopalraja
  • Patent number: 6220942
    Abstract: A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.
    Type: Grant
    Filed: April 2, 1999
    Date of Patent: April 24, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Sidney Huey, Fred C. Redeker
  • Patent number: 6220941
    Abstract: The present invention provides a method and apparatus for delivering one or more rinse agents to a surface, such as a polishing pad surface and preferably one or more polishing fluids. The invention also provides a method of cleaning one or more surfaces, such as a polishing pad surface and a substrate surface, by delivering a spray of one or more rinse agents to the surface and, preferably, causing the rinse agent to flow across the surface from a central region to an outer region where unwanted debris and material is collected.
    Type: Grant
    Filed: October 1, 1998
    Date of Patent: April 24, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Boris Fishkin, Charles C. Garretson, Peter McKeever, Thomas H. Osterheld, Gopalakrishna B. Prabhu, Doyle E. Bennett, Benjamin A. Bonner, Sidney Huey
  • Patent number: 6222337
    Abstract: The present invention generally provides a robot that can transfer a workpiece, such as a silicon wafer, at increased speeds and accelerations/decelerations. More particularly, the present invention provides a robot wrist for mechanically clamping a workpiece to a workpiece handling member of an extendable robot arm. The wafer clamp selectively applies sufficient force to center the workpiece and prevent slippage and damage to the workpiece during rapid rotation and radial movement of the handling member. In one embodiment, a clamp for securing silicon wafers uses two independent clamp fingers to position and hold the wafer with minimal particle generation and wafer damage. The clamp is designed so that wafers are normally clamped except during full extension of the wafer handling member to deliver or pickup a wafer.
    Type: Grant
    Filed: June 2, 1999
    Date of Patent: April 24, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Tony Kroeker, Jeffrey C. Hudgens
  • Patent number: 6217655
    Abstract: A stand-off pad, and method of fabricating the same, for supporting a workpiece in a spaced apart relation to a workpiece support chuck. More specifically, the wafer stand-off pad is fabricated of a polymeric material, such as polyimide, which is disposed upon the support surface of the chuck. The stand-off pad maintains a wafer, or other workpiece, in a spaced apart relation to the support surface of the chuck. The distance between the underside surface of the wafer and the chuck is defined by the thickness of the stand-off pad. This distance should be larger than the expected diameter of contaminant particles that may lie on the surface of the chuck. In this manner, the contaminant particles do not adhere to the underside of the wafer during processing and the magnitude of the chucking voltage is maintained between the workpiece and the chuck.
    Type: Grant
    Filed: January 31, 1997
    Date of Patent: April 17, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Ananda H. Kumar, Shamouil Shamouilian, Hyman J. Levinstein, Vijay Parkhe
  • Patent number: 6217426
    Abstract: A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a substrate. The deflection surface may comprise one or more passageways extending through the pad which vent to atmosphere. In one embodiment, the deflection area defines a raised area and a recessed area. The raised area provides a mounting surface for the platen while the recessed area allows for compliance of the pad. In another embodiment, the deflection area comprises a plurality of channels defining a plurality of slanted protrusions. The channels may be non-intersecting such that the slanted protrusions are elongated portions disposed on the pad. Alternatively, the channels may be intersecting such that the slanted protrusions are isolated from one another and are disposed on the pad in spaced relation.
    Type: Grant
    Filed: April 6, 1999
    Date of Patent: April 17, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Steven Zuniga, Hung Chen
  • Patent number: 6218301
    Abstract: A method of forming tungsten films on oxide layers is disclosed. The tungsten films are formed on the oxide layers by treating the oxide using a silane based gas mixture followed by the thermal decomposition of a W(CO)6 precursor. After the W(CO)6 precursor is thermally decomposed, additional layer of tungsten may be optionally formed thereon from the thermal decomposition of tungsten hexafluoride (WF6).
    Type: Grant
    Filed: July 31, 2000
    Date of Patent: April 17, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Hyungsuk Alexander Yoon, Michael X. Yang, Ming Xi
  • Patent number: 6217715
    Abstract: Internal surfaces of a vacuum chamber are coated with a metal or metal oxide to reduce pump down time and base pressure. The metal is sputter deposited within a partially assembled chamber from a target which comprises the metal. The chamber is then configured to process a substrate such as a silicon wafer.
    Type: Grant
    Filed: February 6, 1997
    Date of Patent: April 17, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Bingxi Sun, Imran Hashim
  • Patent number: 6217802
    Abstract: A polymer pelletizing apparatus includes a device for automatically and electronically indexing (advancing) a set of pelletizer knives by a predetermined distance upon the expiration of a predetermined time period. This advancement is continued for the useful life of the pelletizer knives and is called the advancement cycle. The predetermined distance and predetermined time period are entered into a PLC. The PLC is connected to an external advancing device such that when the PLC determines that the predetermined time period has expired, the PLC causes the external advancing device to index or advance the pelletizer knives by a predetermined distance. This advancement cycle provides consistent wear of the pelletizer knives and accurately provides an estimate of the need for a knife change.
    Type: Grant
    Filed: December 30, 1998
    Date of Patent: April 17, 2001
    Assignee: Pelletizer Knives, Inc.
    Inventors: Gregory S. Messina, Michael A. Tofte
  • Patent number: 6219219
    Abstract: A cathode assembly having a pedestal and a detachable susceptor. Various contact assemblies containing a canted spring are utilized to make electrical connection between the pedestal and detachable susceptor. The canted spring has coils that are tilted in one direction and joined end to end to form a doughnut shape. Such a spring creates multiple parallel self-loading electrical connections via the turns of the spring. The turns act like electrical wires to ensure reliable RF electrical energy transfer. The canted spring contact of the present invention allows for flat contact between the pedestal and the chuck.
    Type: Grant
    Filed: September 30, 1998
    Date of Patent: April 17, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Gilbert Hausmann, Anantha Subramani, Peter Satitpunwaycha, Raymond Gristi, Bradley O. Stimson, Chia-Au Bill Lu, Lawrance A. Ringor, Michael N. Sugarman
  • Patent number: 6217196
    Abstract: A small and non-intrusive reflector is disclosed for use with a strobe light system for enhancing light distribution for wall mounted application, while maintaining a low current draw. The reflector comprises a “top reflective section” and a “bottom reflective section”, where each reflective section comprises three distinct reflective portions: a left reflective portion, a center reflective portion and a right reflective portion. Collectively, top section left portion and bottom section left portion provide illumination to a negative horizontal range of viewing angles, whereas top section right portion and bottom section right portion provide illumination to a positive horizontal range of viewing angles. Finally, the top section center portion and bottom section center portion provide illumination to a range of horizontal and vertical viewing angles.
    Type: Grant
    Filed: March 20, 1998
    Date of Patent: April 17, 2001
    Assignee: Wheelock, Inc.
    Inventors: Joseph Kosich, Luy Nguyen, David H. Strome
  • Patent number: 6217087
    Abstract: A lock mechanism is provided which may actuate both a deadbolt and flush bolts in response to a single lock movement. The mechanism includes a dual element bolt throw and flush bolt actuator, which locks in place in the extended position if the end of the bolt is pressed inwardly. The throw includes a transfer mechanism which translates the horizontal movement of the bolt to vertical movement at the flush bolts. The flush bolts also include a mechanism to limit retraction thereof if the extending end of the flush bolt is exposed to inward directed force. The entire lock mechanism may be actuated by a standard cylindrical lockset having actuating jaws extending therefrom. The lock mechanism case may include an aperture therein, through which the handle housing extends, which aligns the jaws in the handle housing with the rear end of the bolt.
    Type: Grant
    Filed: March 30, 1999
    Date of Patent: April 17, 2001
    Inventor: Mark Weston Fuller
  • Patent number: 6214714
    Abstract: A method of film processing comprises forming an integrated titanium/titanium nitride (Ti/TiN) film structure having an intermediate layer. The intermediate layer comprises species containing Si, and preferably containing Si and Ti, such as titanium silicide (TiSix), or TiSixOy, among others. The intermediate layer protects the underlying Ti film against chemical attack during subsequent TiN deposition using a titanium tetrachloride (TiCl4)-based chemistry. The method allows reliable Ti/TiN film integration to be achieved with excellent TiN step coverage. For example, the film structure can be used as an effective barrier layer in integrated circuit fabrication.
    Type: Grant
    Filed: June 25, 1999
    Date of Patent: April 10, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Shulin Wang, Ming Xi, Zvi Lando, Mei Chang
  • Patent number: 6215640
    Abstract: An apparatus and method for actively controlling surface potential of an electrostatic chuck. The apparatus and method utilize a sensor and a control circuit. The sensor comprises an antenna on the chuck surface coupled to a field effect transistor (FET). The sensor produces a signal indicative of an electrical characteristic such as surface potential of the electrostatic chuck. The sensor signal provides feedback to the control circuit. The control circuit compares the sensor signal to a predetermined setpoint corresponding to a desired value of the surface potential. The control circuit provides a control signal to a power supply coupled to one or more chuck electrodes. The control signal causes the power supply to change the electrode voltage such that the resulting change in surface potential tends to null the difference between the sensor signal and the set point thus ensuring a constant chucking force.
    Type: Grant
    Filed: December 10, 1998
    Date of Patent: April 10, 2001
    Assignee: Applied Materials, Inc.
    Inventor: Gilbert Hausmann
  • Patent number: 6214121
    Abstract: A semiconductor wafer processing apparatus, and more specifically, an apparatus containing a pedestal assembly having a thermally controlled platen for providing a controllable, uniform temperature distribution across the diameter of a semiconductor wafer. The thermally controlled platen heats and cools the semiconductor wafer placed upon the platen so the workpiece may be maintained uniformly at a predetermined temperature.
    Type: Grant
    Filed: July 7, 1999
    Date of Patent: April 10, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Thomas K. Cho, Tetsuya Ishikawa
  • Patent number: D440473
    Type: Grant
    Filed: June 6, 2000
    Date of Patent: April 17, 2001
    Inventor: Zareh Khachatoorian
  • Patent number: D440835
    Type: Grant
    Filed: June 6, 2000
    Date of Patent: April 24, 2001
    Inventor: Zareh Khachatoorian
  • Patent number: D440836
    Type: Grant
    Filed: June 6, 2000
    Date of Patent: April 24, 2001
    Inventor: Zareh Khachatoorian