Abstract: A device and method for strengthening a natural fingernail includes a nail reinforcing device made of a pliable and conformable material having a thickness that is less than the thickness of a natural fingernail. The nail reinforcing device can be preformed and shaped to correspond to the shape of a natural fingernail or can be shaped to correspond to the general shape of the natural fingernail to which it is attached or adhered. A method for strengthening a natural fingernail of the present invention comprises applying an adhesive to at least a portion of the bottom (underneath) surface of the free end of the natural fingernail, to at least a portion of the top surface of the natural fingernail, or to at least a portion of the upper surface of the nail reinforcing device. The body of the nail reinforcing device is then positioned and maintained under the natural fingernail so as to provide contact between the upper surface of the nail reinforcing device and the bottom surface of the natural fingernail.

Abstract: A redundancy architecture for repairing a DRAM includes fuse banks for storing the row addresses of defective rows in sub-arrays of the DRAM. Row decoders activate a redundant row in one of the sub-arrays in response to receiving a row address matching one of the stored defective row addresses and, at the same time, disable a redundant row in the other of the sub-arrays that is arranged in an order complementary to that of the activated redundant row. By activating a redundant row in one sub-array and disabling the corresponding redundant row in an adjacent sub-array, the architecture allows for repairs to be conducted in the one sub-array while a good row in the adjacent sub-array is allowed to continue in operation.

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.

Abstract: A method and apparatus for connecting a lead of a lead frame to a contact pad of a semiconductor chip using a laser or other energy beam is herein disclosed. The lead may be wire bonded to the contact pad by heating the ends of a wire until the wire fuses to the contact pad and lead or an energy-fusible, electrically-conductive material may be used to bond the ends of the wire to the contact pad and lead. In addition, this invention has utility for both conventional lead frame/semiconductor chip configurations and lead-over-chip configurations. In addition, with a lead-over-chip configuration, the lead may be directly bonded to the contact pad with a conductive material disposed between the lead and the contact pad.

Abstract: A margin test on a Dynamic Random Access Memory (DRAM) in accordance with the invention begins with a supply voltage level being stored in all memory cells of the DRAM. Circuitry incorporated into each sense amplifier of the DRAM then isolates the digit line equilibrating circuitry in each sense amplifier from the cell plate voltage DVC2 or supply voltage V.sub.cc to which the equilibrating circuitry is normally connected and connects the equilibrating circuitry to ground instead. The equilibrating circuitry is then activated for a predetermined refresh interval of about 150 to 200 milliseconds to equilibrate the true and complementary digit lines in each digit line pair of the DRAM to ground for the refresh interval. This stresses all the memory cells in the DRAM with a V.sub.cc -to-ground voltage drop for the entire refresh interval.

Abstract: A cutting element for use in drilling subterranean formations. The cutting element includes a superabrasive table between about 0.070 inch and 0.150 inch thickness, mounted to a supporting substrate. The superabrasive table includes a two-dimensional cutting face having a cutting edge along at least a portion of its periphery, and a rake land extending forwardly and inwardly from the cutting edge at an angle of between about 10.degree. and 80.degree. to the longitudinal axis of the cutting element for a width, measured along the surface of the rake land, of not less than about 0.050 inch. The interface between the superabrasive volume and the substrate, taken to the rear of the cutting edge, is located no less than about 0.015 inch to the rear of the cutting edge.

Abstract: A process for manufacturing semiconductor device including a heat sink adjacent to a die. A dam is positioned at the peripheral edges of the heat sink. During a transfer molding process, the dam serves two purposes. First, the dam prevents damage to the mold. Second, the dam prevents encapsulant packaging compound material from flowing onto the heat sink. The dam may be a gasket. The dam may also be a burr created by, for example, stamping the bottom of the heat sink. The dam may include copper, polyamides, and leadlock tape. The dam may be permanently connected to the heat sink or removed following packaging. The dam may be removed mechanically, through the use of heat, or during an electrolytic deflash cycle.

Abstract: A window buck is formed of side walls that are extruded from vinyl. The side walls have interior channels. The side walls may be formed to effect a female-male connection between the ends of two adjoining side walls. Alternatively a locking member is provided that is sized to frictionally engage a selected channel. The edges of the side members are shaped for abutment to each other with a connector in the channels to hold the window buck together. The window buck thereafter may be placed before the cement wall is formed and is sized to receive a window frame. The window buck may be formed into selected geometric shapes. Window bucks of different dimensions may be assembled by selected sides of different dimensions from bins or pallets of presized side members.

Abstract: A lead-over-chip single-in-line memory module (LOC SIMM) and method of manufacturing is disclosed that provides for shortened wire bonds and case of rework for unacceptable semiconductor dice. More specifically, the LOC SIMM of the present invention includes a plurality of slots extending through a circuit board with an equal number of semiconductor dice attached thereto such that the active surfaces of the dice are exposed through the slots. Wire bonds or TAB connections are made from the exposed active surface of the die, through the slot, and to contacts on the top surface of the circuit board. Dice proven unacceptable during bum-in and electrical testing of the module are replaced by known good dice (KGD) by breaking their respective wire bonds, attaching a KGD to the circuit board, and forming new electrical connections between the KGD and the circuit board.

Abstract: A lead frame casing for housing a stack of lead frame strips. The casing includes a central volume-defined between substantially rigid members and resilient members. The former define at least one reference plane and the latter are deflected toward the former when a lid is placed over the casing to align the strips of the stack against the reference plane and immobilize the stack to prevent damage during transport and handling of the casing and to facilitate handling of the lead frames by automated equipment.

Abstract: A lifting mechanism for a sedimentation tank is provided for vertically raising and lowering a rake assembly in such sedimentation tank. The lifting mechanism comprises one or more elongate members pivotally connected to certain structural elements of the assemblage, such as the rotary drive motor, rake assembly, column or bridge. The pivotal connections of the elongate members are positioned about a horizontal axis and are oriented to receive the torque forces imposed on the assemblage as the rake assembly rotates in the tank simultaneously with vertical lifting. The torque forces are translated into the pivotal connections and are able to counteract those forces to facilitate vertically raising and lowering the rake assembly while it is being rotated in the sedimentation tank.

Abstract: A de-marking apparatus and method are provided for de-marking a marked packaged integrated circuit (IC). The de-marking apparatus comprises a de-marking head for removing a thin layer of material from the marked surface. The apparatus may also include mechanisms for feeding, transferring and conveying the marked ICs to and from the de-marking head, and washing, drying, and receiving the de-marked ICs in an automated fashion. The method includes physically removing package material from a marked IC surface and producing a surface reflectivity suitable for re-marking with a laser beam.

Abstract: An oximetry sensor comprising a wrap member including a fastener and adhesive member and an LED assembly and photodiode connected to a cable.

Abstract: Circuitry stress tests a Dynamic Random Access Memory (DRAM) by connecting a sense amplifier of the DRAM to at least two pairs of complementary bitlines within the same sub-array of the DRAM through two pairs of isolation transistors activated at substantially the same time. The circuitry thus provides for the stress testing of memory cells associated with sense amplifiers connected to only one sub-array within a DRAM or other semiconductor memory. The apparatus also provides an alternative to conventional methods for stress testing memory cells associated with sense amplifiers connected to more than one sub-array within a DRAM or other semiconductor memory.

Abstract: A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip on board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric connections achieve electric communication between the stacked substrates, must be of sufficient height to give clearance for the components mounted on the substrates, and should preferably be sufficiently strong enough to give support between the stacked substrates.

Abstract: A semiconductor wafer having dice that include circuitry that is placed into a mode when the circuitry receives an alternating signal having certain characteristics. The alternating signal may be supplied from a system controller through a probe, probe pad, and conductive path on the wafer. In a preferred embodiment, the conductive path simultaneously carries a VCC power signal and the alternating signal to the circuitry. However, the alternating signal may be carried on a conductive path different from the one carrying the VCC signal. A great deal of information may be conveyed through the alternating signal, making other signals unnecessary in controlling, testing, stressing, and repairing dice on the wafer. For example, clocking information may be conveyed through the alternating signal. The circuitry may be placed in different modes in response to different characteristics of the alternating signal. The alternating signal and a VCC power signal are received through a single contact on each die.

Abstract: Compressible lock washers for use in catheter connectors. One such lock washer (60) includes a support ring (62) and tube engagement flanges (64) extending centrally therefrom, oblique to the ring and each extending from the same side thereof. The tube engagement flanges (64) define a tube receptacle (72) through which a catheter tube (58) may be inserted. Upon compression of the lock washer (60), the tube engagement flanges (64) are forced toward the ring (62), decreasing the diameter of the tube receptacle (72). Thus, during compression of the lock washer (60), the tube engagement flanges (64) engage the catheter tube (58) which runs through the tube receptacle (72), securing the catheter tube within the catheter connector (20) with which the lock washer is associated.

Abstract: Presented are ways to address the problem of replication competent adenovirus in adenoviral production for use with, for example, gene therapy. Packaging cells having no overlapping sequences with a selected vector and are suited for large scale production of recombinant adenoviruses. A system for use with the invention produces adenovirus incapable of replicating. The system includes a primary cell containing a nucleic acid based on or derived from adenovirus and an isolated recombinant nucleic acid molecule for transfer into the primary cell. The isolated recombinant nucleic acid molecule is based on or derived from an adenovirus, and further has at least one functional encapsidating signal, and at least one functional Inverted Terminal Repeat. The isolated recombinant nucleic acid molecule lacks overlapping sequences with the nucleic acid of the cell.