Abstract: A removable oxide spacer is used to reduce the size of a contact opening in a memory cell between polysilicon word lines below a lithographic minimum. The removable spacer is deposited before the buried contact patterning and etching. Since word lines diverge at a cell location, the removable spacer retains a lesser thickness over the divergent area contact opening and a greater thickness elsewhere between word lines due to the more narrow gap therebetween and the spacer being deposited such that it fills the gap. The removable spacer reduces the buried contact size since the actual self-aligned contact area is defined by the spacer sidewall. The removable spacer is formed of materials having higher etching selectivity relative to materials forming underlying structures. Etching of the spacer creates a buried contact opening smaller than a lithographic minimum because silicon oxide surrounding the buried contact area is protected by the removable spacer.

Abstract: A molding machine for encapsulating electronic devices mounted on one side of a substrate, and having a ball-grid array, pin-grid array, or land-grid array on the opposite side, has a two member biased floating plate apparatus to compensate for variations in substrate thickness, and a gas collection/venting apparatus for relieving gases emitted from the non-encapsulated underside of the substrate.

Abstract: A hybrid lead frame having leads for conventional lead-to-I/O wire bonding, and leads for power and ground bussing that extend over a surface of the semiconductor die are provided where the leads for bussing are held in place by lead-lock tape to prevent bending and/or other movement of the bussing leads during manufacturing. More specifically, the lead-lock tape is transversely attached across a plurality of bussing leads proximate to and outside of the position where the die is to be attached.

Abstract: The invention includes a method of reducing the microbial population on a textile in a washing machine. The washing machine has an outer shell for containing fluids and an internal assembly for containing textiles. The method includes introducing a wash liquor into the internal assembly, thus contacting the textile with the wash liquor and wetting the textile. The wash liquor is then removed from the internal assembly and the outer shell at a first point. At a second point, a combination of ozone gas, oxygen and/or oxygen enriched air is mixed into the wash liquor being removed from the outer shell to form an ozonated wash liquor. This ozonated wash liquor is re-introduced into the outer shell and internal assembly thus contacting the textile with the ozonated wash liquor for a period of time.

Abstract: Groups, separated by periodic spaces and each containing n articles gathered together, are formed from a regular flow of articles. This result is achieved by means of a thrust element which periodically penetrates the input flow of articles, bringing about the desired accumulation as a result of a forward acceleration or thrust performed beginning with the articles which are to be in the upstream position, in the direction of advance of the articles, within each group. The preferred application is for automatic packaging plants.

Abstract: A cutting element and drill bits so equipped particularly suited for drilling subterranean formations exhibiting a superabrasive cutting face with at least a portion of extremely low surface roughness, by way of example on the order of a polished, mirror-like finish. The cutting face includes a peripheral cutting edge adjacent the low surface roughness portion of the cutting face for engaging a subterranean formation, the cutting edge being of sharp configuration and essentially defining a line of contact with the formation lying between the cutting face and a side surface of the cutting element extending rearwardly therefrom. In certain formations, particularly soft, plastic formations, the drill bits equipped with the inventive cutting element may be employed as a system and method with drilling fluids modified to maintain the integrity of formation cuttings by stabilizing and locking in reactive clays present in the rock to inhibit bit balling and facilitate hydraulic cuttings removal from the bit face.

Abstract: An anastomosis apparatus includes a first rigid element and a second rigid element. The first element defines a first passageway or lumen which extends along its entire length. In construction the first element includes a first tubular portion in association with a first flange disposed on one end of the first tubular portion. The first flange is fixedly secured to the first tubular portion. The second element defines a second passageway along its entire length which is dimensioned to slidably receive and retain the first tubular portion. The second element includes a second tubular portion in association with a second flange disposed on a proximal end of the second tubular portion.

Abstract: An inventive Leads-Over-Chip (LOC) lead frame includes an assembly of interdigitated leads constructed to overlie double-sided adhesive tape on the front-side surface of an integrated circuit (IC) die. An attachment surface of each lead is adhesively attachable to the tape, and at least some of the leads are constructed to extend across the front-side surface of the die from one edge substantially to another edge, such as an adjacent or opposing edge. As a result, a substantial area of the front-side surface of the die is adhesively attachable to the leads through the tape, so the die is supportable in an IC package in an improved manner, and the heat may be conducted away from the die through the lead frame in an improved manner.

Abstract: A rotary drag bit being suitable for directional drilling. The bit includes a bit body from which extend radially-oriented blades carrying PDC cutters. The blades extend to primary gage pads, above which secondary gage pads are either longitudinally spaced or rotationally spaced, or both, defining a gap or discontinuity between the primary and secondary gage pads through which drilling fluid from adjacent junk slots may communicate laterally or circumferentially. Longitudinally leading edges of the secondary gage pads carry cutters for smoothing the sidewall of the borehole. The tandem primary and secondary gage pads provide enhanced bit stability and reduced side cutting tendencies. The discontinuities between the primary and secondary gage pads enhance fluid flow from the bit face to the borehole annulus above the bit, promoting formation cuttings removal. The tandem gage arrangement also has utility in conventional bits not designed specifically for directional drilling.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A method and apparatus for repair of a multi-chip module such as a memory module is provided, where at least one redundant or auxiliary chip attach location is provided on the substrate of the multi-chip module. The auxiliary chip attach location preferably provides contacts for attachment of more than one type of replacement semiconductor chip. Accordingly, when one or more chips on the multi-chip module are found to be completely or partially defective, at least one replacement chip can be selected and attached to the auxiliary location to provide additional memory to bring the module back to its design capacity.

Abstract: A method of fabricating row lines over a field emission array. The method employs only two mask steps to define row lines and pixel openings through selected regions of each of the row lines. In accordance with the method of the present invention, a layer of conductive material is disposed over a substantially planarized surface of a grid of semiconductive material. A layer of passivation material is then disposed over the layer of conductive material. In one embodiment of the method, a first mask may be employed to remove passivation material and conductive material from between adjacent rows of pixels and from substantially above each of the pixels of the field emission array. A second mask is employed to remove semiconductive material from between the adjacent rows of pixels. In another embodiment of the method, a first mask is employed to facilitate removal of passivation material, conductive material, and semiconductive material from between adjacent rows of pixels of the field emission array.

Abstract: A method for producing integrated circuit devices comprises the steps of forming and packaging such devices at the wafer scale, including forming a plurality of chip circuits with bond pads, adhesively fixing a plate of glass to the active surface of the wafer, slicing the wafer, applying a sealant layer to the backside of the wafer, forming contact holes through the upper glass plate, metallizing the glass plate and singulating the individual chips. Use of etchable glass for the package and palladium for metallization provides an advantageous construction method.

Abstract: A core barrel having an inner tube for coring and, alternately, a center plug assembly for closing the throat of the core bit at the bottom of the assembly for drilling in lieu of coring. The inner tube assembly and plug assembly are disposable and retrievable through the drill string on a wireline using an overshot. The core bit is of a stabilized, preferably anti-whirl, design and may be a low-invasion core bit used in cooperation with a low-invasion coring shoe. A logging tool and data transmission assembly may be incorporated in the plug assembly for logging while drilling. Alternatively, sensors for logging borehole parameters and a data transmission assembly may be incorporated in the inner tube assembly, in the wall of the core barrel, above the core barrel, or in a combination of such locations.

Abstract: An apparatus and method for routing all external connection points of a double-sided edge connector of a circuit card to one side of a test tray suitable for testing with a bed of nails, "pogo pin" or similar type of load board for functional testing of said circuit card. A first embodiment of the apparatus includes a pivotally mounted or snap-in removable electrical and mechanical receptacle with a slot or socket suitable for holding a double-sided edge connector of a circuit card in a test tray. The receptacle pivots or is otherwise mounted in the test tray to allow the circuit card to lie co-planar with the test tray, thus providing perpendicular contact to the pins of a bed of nails load board. Another embodiment provides a fixed receptacle mounted vertically that routes all edge connector traces to the bottom surface of the test tray, again, suitable for engaging with a bed of nails-type test board.