Abstract: Flip-chip semiconductor assemblies, each including integrated circuit (IC) dice and an associated substrate, are electrically tested before encapsulation using an in-line or in situ test socket or probes at a die-attach station. Those assemblies using “wet” quick-cure epoxies for die attachment may be tested prior to the epoxy being cured by pressing the integrated circuit (IC) dice against interconnection points on the substrate for electrical connection, while those assemblies using “dry” epoxies may be cured prior to testing. In either case, any failures in the dice or in the interconnections between the dice and the substrates can be easily fixed, and the need for the use of known-good-die (KGD) rework procedures during repair is eliminated.

Abstract: The present invention provides an improved surface P-channel transistor and a method of making the same. A preferred embodiment of the method of the present invention includes providing a semiconductor substrate, forming a gate oxide layer over the semiconductor substrate, subjecting the gate oxide layer to a remote plasma nitrogen hardening treatment followed by an oxidative anneal, and forming a polysilicon layer over the resulting gate oxide layer. Significantly, the method of the present invention does not require nitrogen implantation through the polysilicon layer overlying the gate oxide and provides a surface P-channel transistor having a polysilicon electrode free of nitrogen and a hardened gate oxide layer characterized by a large concentration of nitrogen at the polysilicon electrode/gate oxide interface and a small concentration of nitrogen at the gate oxide/semiconductor substrate interface.

Abstract: A quad flat no-lead (QFN) grid array semiconductor package and method for making the same is disclosed. The package includes a semiconductor die and a lead frame having a plurality of conductive elements patterned in a grid-type array. A plurality of bond pads on the semiconductor die is coupled to the plurality of conductive elements, such as by wire bonding. The semiconductor die and at least a portion of the lead frame are encapsulated in an insulative material, leaving the conductive elements exposed along a bottom major surface of the package for subsequent electrical connection with higher-level packaging. Individual conductive lead elements, as well as the grid array pattern, are formed by wire bonding multiple bond pads to a single lead at different locations and subsequently severing the lead between the bonding locations to form multiple conductive elements from each individual lead.

Abstract: An apparatus and method for singulating IC devices or semiconductor devices and/or components thereof. The apparatus includes a flexible membrane or bladder configured to receive an applied fluid pressure on a surface thereof and expand in response to the applied fluid pressure. Upon expansion of the flexible membrane, a semiconductor device or semiconductor device component is contacted by the flexible membrane and immobilized. The semiconductor device may then be subjected to a predetermined test or manufacturing operation. Subsequent any processing to the semiconductor device or component, the fluid pressure is released such that the flexible membrane contracts and releases the semiconductor device to be advanced for further processing, testing, or preparation for shipping.

Abstract: An embodiment of the rocket motor of this invention employs an insensitive munitions approach that, when subjected to elevated external temperatures, is activated by thermal expansion of the main propellant and gas generation from a secondary insensitive munitions charge. In a preferred embodiment, the rocket motor also includes a pressure equalizing system that accommodates changing temperature conditions during storage as well as varying gas pressure inherent in gun-launched systems in a manner that allows for thinner case cylinder design and increased propellant volume.

Abstract: A sense amplifier for use in a memory device and in a memory-resident system. The sense amplifier operates on a lower voltage consistent with the voltage range of the differential input data and the sense amplifier further operates on a higher voltage to level-shift the output signal concurrently with the sensing operation. The sense amplifier includes a pair of differential cross-coupled inverters whose inputs are coupled to receive the data from the memory. Once the input nodes of the cross-coupled inverters are charged, the cross-coupled inverters are further coupled to pull-up and pull-down circuits that span the higher voltage range for performing the level-shifting functionality. In order to recondition the sense amplifier for a subsequent sensing process, a clamp circuit shorts the level-shifted outputs together to prevent a higher voltage level from being inadvertently passed to the memory device when isolating pass gates are reactivated.

Abstract: An apparatus for positioning dicing saw blades at a fixed axial distance from one another independent of the thickness of the saw blades, where the saw blade thickness varies within a range. Flanges, spacers, and retention spacers may be employed to achieve desired spacing of dicing saw blades in the assembly. At least one biasing element that is at least partially constrained about its outer radial periphery may be employed to achieve axial positional independence of each dicing saw blade with respect to other dicing saw blades of the assembly. Further, at least one retention feature may also be used to fix the position of the at least one biasing element in the assembly. Machining techniques may be used to form the components and features of the present invention.

Abstract: An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. The semiconductor substrate includes one or more vias having conductive material formed therein and which extend from an active surface to a back surface of the semiconductor substrate. The redistribution lines are patterned on the back surface of the semiconductor substrate, extending from the conductive material in the vias to predetermined locations on the back surface of the semiconductor substrate that correspond with an interconnect pattern of another substrate for interconnection thereto.

Abstract: A method and apparatus for aligning a semiconductor device with a corresponding landing site on a carrier substrate. At least two apertures are formed in a semiconductor device, the apertures passing from a first major surface to a second, opposing major surface of the semiconductor device. Corresponding alignment features are provided on the carrier substrate at the landing site to which the semiconductor device is to be mounted. The alignment features are aligned with the corresponding apertures to effect alignment of the semiconductor device. The alignment features may include apertures corresponding in size, shape and arrangement to the semiconductor device apertures. Alignment pins may be placed through the at least two apertures to assist with alignment.

Abstract: An emission structure includes a resistor with at least one emitter tip thereover and at least one substantially vertically oriented conductive element positioned adjacent the resistor. The conductive element may contact the resistor. A method for fabricating the emission structure includes forming at least one conductive line, depositing at least one layer of semiconductive or conductive material over and laterally adjacent the at least one conductive line, and forming a hard mask in recessed areas of the surface of the uppermost material layer. The underlying material layer or layers are patterned through the hard mask, exposing substantially longitudinal center portions of the conductive lines. The remaining semiconductive or conductive material is patterned to form the emitter tip and resistor. At least the substantially central longitudinal portion of the conductive trace is removed to form the conductive element.

Abstract: A portable light delivery device for delivering light to the blood supply of a human body through a nonocular area of skin on the body includes an attachment member, a portable light delivery unit connected to the attachment member and a portable power supply. The portable light delivery unit provides one or more wavelengths of light within a specifically determined range of intensity and a specifically determined angle of illumination. A portable control unit may be included on the light delivery device for selectively controlling the light delivery unit. A programming device associated with the control unit selectively changes the programming of the controller. The light delivery device is portably secured to a region of the body having a substantial amount of blood vessels near the surface thereof to deliver light to the blood supply of the body for treating mood disorders, seasonal affective disorder and disorders involving circadian rhythm and sleep.

Abstract: A snowmobile ski with a pair of outboard keels and laterally projecting, upwardly slanting, lateral wings attached proximate the outboard keels is disclosed. A ski of this structure has improved flotation and resistance to side slippage in turns.

Abstract: A multi-part lead frame semiconductor device assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame semiconductor device assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.

Abstract: A method of removing organic particles from a registration mark on a semiconductor wafer. The method comprises providing a semiconductor wafer comprising at least one registration mark at least partially filled with organic particles. The at least one registration mark has a trench width from approximately 1.0 ?m to approximately 3.0 ?m. The semiconductor wafer is exposed to a cleaning solution comprising tetramethylammonium hydroxide and at least one surfactant, such as an acetylenic diol surfactant. The semiconductor wafer is exposed to an ultrasonic or megasonic vibrational energy. A semiconductor wafer previously subjected to a chemical mechanical planarization treatment and having a reduced amount of organic particles in a registration mark is also disclosed.

Abstract: Osmotic delivery system semipermeable body assemblies that control the delivery rate of a beneficial agent from an osmotic delivery system incorporating one of the semipermeable body assemblies are provided. A semipermeable body assembly or plug includes a semipermeable body which is positionable in an opening of an osmotic delivery system. The semipermeable body has a hollow interior portion having a size selected to obtain a predetermined liquid permeation rate through the semipermeable body. Because the beneficial agent in the osmotic delivery system is delivered at substantially the same rate, the osmotic agent imbibes liquid which has permeated through the plug from a surrounding environment, and the liquid permeation rate through the plug controls the delivery rate of the beneficial agent from the osmotic delivery system.

Abstract: A method and apparatus for achieving a consistent depth of immersion of a semiconductor element into an exposed surface of an adhesive material pool when applying the adhesive material, conductive or non-conductive, to the semiconductor element or portion thereof. The consistent depth of immersion is defined by a stop which is attached to a reservoir used to form the adhesive material pool, attached to a stencil which is used in conjunction with the reservoir to form a level upper surface on the adhesive material, or operates independently from the reservoir and/or stencil.

Abstract: The present invention relates to enhanced protection of the active surface and the bond wires or ball array of a microelectronic device, and to thermal management of the microelectronic device as it is packaged with a printed circuit board (PCB) or other substrate. The enhanced protection and thermal management are accomplished with a high-temperature thermal grease that is glob topped or encapsulated over the bond wires or ball array, and the active surface of the microelectronic device. The high-temperature thermal grease exchanges heat, particularly by conduction, away from the active surface of the microelectronic device as well as away from the bond wires.

Abstract: A method for reworking a ball grid array (BGA) of solder balls is provided including one or more defective solder balls on an electronic component workpiece using a single-ball extractor/placer apparatus having a heatable capillary tube pickup head optionally augmented with vacuum suction. A defective solder ball is identified, extracted by the pickup head and disposed of. A nondefective solder ball is picked up by the pickup head, positioned on the vacated attachment site, and thermally softened for attachment to the workpiece. Flux may be first applied to the replacement solder ball or to the vacated attachment site. The extractor/placer apparatus may be automated to locate, extract and replace defective balls for completion of a fully operable BGA.

Abstract: A step-gradient composite waveguide for evanescent sensing in fluorescent binding assays comprises a thick substrate layer having one or more thin film waveguide channels deposited thereon. In one embodiment, the substrate is silicon dioxide and the thin film is silicon oxynitride. Specific binding molecules having the property of binding with specificity to an analyte are immobilized on the surface of the thin film channels. In preferred embodiments, the composite waveguide further includes light input coupling means integrally adapted to the thin film channels. Such light coupling means can be a grating etched into the substrate prior to deposition of the thin film, or a waveguide coupler affixed to the upper surface of the thin film. The waveguide coupler has a thick input waveguide of high refractive index which receives the laser light through one end and propagates it by total internal reflection.

Abstract: A receiver cover includes a stationary member that is configured to be secured to an end of a receiver for a trailer hitch. The receiver cover also includes a door which is hingedly connected to the stationary member. The door may be biased toward the stationary member, such as by one or more of a living hinge, a coiled spring, a magnetic field, or the like. Thus, when the receiver is not in use, the door automatically closes and is secured in a closed position over a receptacle in a receiver with which the receiver cover is used. When access to the receptacle of the receiver is desired, such as for coupling a trailer hitch therewith, the door may be opened against the bias so as to expose the receptacle.