Abstract: A method and apparatus for improving the speed of a wordline in a memory device. A wordline structure includes a main wordline for selectively distributing a main wordline signal and a plurality of wordlines selectively coupled to the main wordline. Each of the wordlines is selectively coupled to a lower resistivity shared interconnection line by way of a selected one of a plurality of switching elements each commonly coupled on one end to the shared interconnection line and individually coupled on an opposing end to the plurality of wordlines. Each of the plurality of switching elements is selectively activated to couple one of the plurality of wordlines to the shared interconnection line when the main wordline signal is selectively coupled to one of the plurality of wordlines.

Abstract: A sealing layer is provided on the surface of a substrate such as a semiconductor wafer. The sealing layer includes apertures which expose external contact locations for semiconductor dice formed on the wafer. Solder paste is deposited in the apertures and reflowed to form discrete conductive elements for attachment of the electronic devices to higher level circuit structures. The wafer is then divided or “singulated” to provide individual semiconductor dice having their active surfaces covered by the sealing layer. In this manner, the sealing layer initially acts as a stencil for forming the discrete conductive elements and subsequently forms a chip scale package structure to protect the semiconductor dice from the environment.

Abstract: A hand-held power syringe. The power syringe includes a handle with pivotally connected first and second members. The first member is also pivotally connectable to a syringe barrel, while the second member is pivotally connectable to a syringe plunger. These three pivotal connections provide leverage for forcing high viscosity fluids into and out of a receptacle of the syringe barrel. One or both of the first and second members of the handle may be bent to facilitate a user's gripping and movement of the first and second handle members. The power syringe may be used in any suitable injection, infusion, or sample-obtaining application, including angiography and angioplasty.

Abstract: One or more of stabilizers are disposed on the surface of a semiconductor device or test substrate that includes bond pads or contact pads located at or proximate to a centerline thereof prior to bonding the semiconductor device face-down upon the test substrate. Upon assembly of the semiconductor device and test substrate, the stabilizers prevent the semiconductor device from tipping or tilting relative to the test substrate. The stabilizers may be preformed structures which are attached to a surface of a semiconductor device, test substrate, or both, or are fabricated on such a surface. Stereolithographic techniques may be used to fabricate the stabilizers. In addition, a machine vision system may be used in conjunction with the stereolithographic technique to recognize the position and orientation of a semiconductor device or test substrate on which the stabilizer is to be fabricated.

Abstract: A process for forming an etch mask having a discontinuous regular pattern utilizes beads, each of which has a substantially unetchable core covered by a removable spacer coating. Beads are dispensed as a hexagonally packed monolayer onto a thermo-adhesive layer. Following a vibrational step which facilitates hexagonal packing of the beads, the resultant assembly is heated so that the beads adhere to the adhesive layer. Excess beads are then discarded. Spacer shell material is then removed from each of the beads, leaving core etch masks. The core-masked target layer is then plasma etched to form a column of target material directly beneath each core. The cores and any spacer material underneath the cores are removed. The resulting circular island of target material may be used as an etch mask during wet isotropic etching of an underlying layer.

Abstract: A method of removing organic particles from a registration mark on a semiconductor wafer. The method comprises providing a semiconductor wafer comprising at least one registration mark at least partially filled with organic particles. The at least one registration mark has a trench width from approximately 1.0 ?m to approximately 3.0 ?m. The semiconductor wafer is exposed to a cleaning solution comprising tetramethylammonium hydroxide and at least one surfactant, such as an acetylenic diol surfactant. The semiconductor wafer is exposed to an ultrasonic or megasonic vibrational energy. A semiconductor wafer previously subjected to a chemical mechanical planarization treatment and having a reduced amount of organic particles in a registration mark is also disclosed.

Abstract: Methods and apparatus for evanescent light fluoroimmunoassays are disclosed. The apparatus employs a planar waveguide and optionally has multi-well features and improved evanescent field intensity. The preferred biosensor and assay method have the capture molecules immobilized to the waveguide surface by site-specific coupling chemistry. Additionally, the coatings used to immobilize the capture molecules provide reduced non-specific protein adsorption.

Abstract: Apparatus and methods for non-invasively determining the cardiac output or pulmonary capillary blood flow of a patient using partial re-breathing techniques. The apparatus includes a substantially instantaneously adjustable deadspace volume for accommodating differences in sizes or breathing capacities of various patients. The apparatus may be constructed of inexpensive elements, including one or more two-way valves, which render the apparatus very simple to use and inexpensive so that the unit may be employed as a disposable product. The method of the invention includes estimating the cardiac output or pulmonary capillary blood flow of a patient based on partial pressure of alveolar CO2, rather than on the partial pressure of end tidal CO2, as previously practiced. A computer program for calculating the cardiac output or pulmonary capillary blood flow of a patient is also disclosed.

Abstract: An implantable osmotically driven delivery system having a dynamic, two-way valve and a self-adjusting, variable geometry fluid flow channel. As pressure within the agent delivery system increases, the fluid channel narrows, thereby restricting flow. At exceptionally high pressures, the valve can be designed to close altogether at the orifice or delivery end, or it can provide a minimal leak path so that a maximum fluid flow is never exceeded. At zero or very low pressures, the valve will close completely at the beneficial agent reservoir end, isolating the beneficial agent formulation from external fluid infiltration and thereby eliminating diffusion of external fluid into the beneficial agent formulation.

Abstract: A method and apparatus for aligning a semiconductor device with a corresponding landing site on a carrier substrate. At least two apertures are formed in a semiconductor device, the apertures passing from a first major surface to a second, opposing major surface of the semiconductor device. Corresponding alignment features are provided on the carrier substrate at the landing site to which the semiconductor device is to be mounted. The alignment features are aligned with the corresponding apertures to effect alignment of the semiconductor device. The alignment features may include apertures corresponding in size, shape and arrangement to the semiconductor device apertures. Alignment pins may be placed through the at least two apertures to assist with alignment.

Abstract: Flip-chip semiconductor assemblies, each including integrated circuit (IC) dice and an associated substrate, are electrically tested before encapsulation using an in-line or in situ test socket or probes at a die-attach station. Those assemblies using “wet” quick-cure epoxies for die attachment may be tested prior to the epoxy being cured by pressing the integrated circuit (IC) dice against interconnection points on the substrate for electrical connection, while those assemblies using “dry” epoxies may be cured prior to testing. In either case, any failures in the dice or in the interconnections between the dice and the substrates can be easily fixed, and the need for the use of known-good-die (KGD) rework procedures during repair is eliminated.

Abstract: A superabrasive cutter-equipped rotary drag bit especially suitable for directional drilling in subterranean formations is provided. The bit may employ PDC cutters in an engineered cutter placement profile exhibiting optimal aggressiveness in relation to where the cutters are positioned along the profile of the bit extending from a cone region laterally, or radially, outward toward a gage region therefore. The engineered cutter placement profile may include cutters exhibiting differing degrees of aggressiveness positioned in order to maximize rate-of-penetration and minimize torque-on-bit while maintaining side cutting capability and steerability.

Abstract: An image detection apparatus including a field emission array and signal transmission circuits in communication with pixels of the field emission array. The field emission array includes a p-type substrate with an array of n-wells therein. Emitter tips, in communication with the n-wells, protrude from an emission surface of the p-type substrate. A detection surface of the p-type substrate is located opposite the emission surface thereof. Each signal transmission circuit of the field emission array includes a capacitor, a baseline potential transistor, and a signal transmission transistor. A first side of the capacitor communicates with a corresponding n-well of the field emission array. A second side of the capacitor communicates with the baseline potential transistor and the signal transmission transistor. The baseline potential transistor and the signal transmission transistor may share a drain.

Abstract: A locking valve stem cap system includes a sleeve, a valve stem cap, and a rotation tool. The sleeve is configured to threadingly engage a valve stem, with a portion of a threaded region of the valve stem protruding into a cap receptacle thereof. The valve stem cap is configured to be inserted into the cap receptacle of the sleeve and to threadingly engage the portion of the threaded region that is located within the cap receptacle. The rotation tool is configured to facilitate rotation of the valve stem cap when the outer periphery thereof is substantially surrounded by the sleeve, thereby facilitating tightening or loosening of the valve stem cap relative to the sleeve. Methods for installing and removing the valve stem cap system from a valve system are also disclosed.

Abstract: This invention relates to an improved snowmobile ski having a vertical fin on the topside of the ski with a surface area large enough to minimize or prevent sideways slippage of the ski during a turn. The fin, if a single fin is used, is located adjacent the outboard edge of the ski. A snowmobile ski with dual topside fins having outwardly projecting lips along the upper edges of said fins has improved performance in deep snow.

Abstract: A solder mask includes an opening through which intermediate conductive elements may be positioned between bond pads of a semiconductor die exposed through an aligned opening in a carrier substrate to which the solder mask is secured and corresponding contact areas of the carrier substrate. An assembly is formed by forming the solder mask on or securing the solder mask to the carrier substrate. The semiconductor die is then attached to the carrier substrate such that bond pads of the semiconductor die are exposed through the aligned openings in the carrier substrate and solder mask. Intermediate conductive elements are then used to electrically connect the bond pads to corresponding contact areas on the carrier substrate. An encapsulant material is introduced into an area defined by the solder mask and carrier substrate openings such that the intermediate conductive elements and semiconductor die surface within the aligned openings are encapsulated.

Abstract: A method of forming ?-alane. The method includes reacting aluminum trichloride and an alkali metal hydride to form an alane-ether complex solution. An aqueous ether solution is optionally added to the alane-ether complex solution to form a partially hydrolyzed ether/alane-ether complex solution. A solution of a crystallization additive is added to the alane-ether complex solution or to the aqueous ether/alane-ether complex solution to form a crystallization solution. The crystallization additive is selected from the group consisting of squalene, cyclododecatriene, norbornylene, norbornadiene, a phenyl terminated polybutadiene, 2,4-dimethyl anisole, 3,5-dimethyl anisole, 2,6-dimethyl anisole, polydimethyl siloxane, and mixtures thereof. Ether is removed from the crystallization solution to crystallize the ?-alane.

Abstract: A folded interposer used to achieve a high density semiconductor package is disclosed. The folded interposer is comprised of a thin, flexible material that can be folded around one or multiple semiconductor dice in a serpentine fashion. The semiconductor dice are then attached to a substrate through electrical contacts on the interposer. The folded interposer allows multiple semiconductor dice to be efficiently stacked in a high density semiconductor package by reducing the unused or wasted space between stacked semiconductor dice. Vias extending through the folded interposer provide electrical communication between the semiconductor dice and the substrate. The present invention also relates to a method of packaging semiconductor dice in a high density arrangement and a method of forming the high density semiconductor package.

Abstract: Methods and apparatus for evanescent light fluoroimmunoassays are disclosed. The apparatus employs a planar waveguide with an integral semicylindrical lens, and has multi-analyte features and calibration features, along with improved evanescent field intensity. A preferred embodiment of the biosensor and assay method has patches of capture molecules, each specific for a different analyte disposed adjacently within a single reservoir. The capture molecules are immobilized to the patches on the waveguide surface by site-specific coupling of thiol groups on the capture molecules to photo-affinity crosslinkers, which in turn are coupled to the waveguide surface or to a nonspecific binding-resistant coating on the surface. The patches of different antibodies are produced by selectively irradiating a portion of the waveguide surface during the process of coupling the photo-affinity crosslinkers, the selective irradiation involving a mask, a laser light source, or the like.

Abstract: An architecture for dynamically repairing a semiconductor memory, such as a Dynamic Random Access Memory (DRAM), includes circuitry for dynamically storing memory element remapping information. Memory is tested for errors by writing, then reading a plurality of memory blocks, such as rows or columns, in parallel. Memory is dynamically reprogrammed in order to remap unused spare memory elements for failed memory elements when errors are detected. Unused spare memory elements are remapped utilizing a circuit that overrides unblown fuses or antifuses.