Patents Represented by Attorney W. James Brady, III
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Patent number: 7567255Abstract: A control module for use in an image display system includes a gain module operable to amplify a signal received by the control module and to communicate an amplified signal having at least one clipped pixel. The at least one clipped pixel is capable of generating a color having a hue that is substantially different than a hue of a color that was specified by the signal. The control module further includes a formatter coupled to the gain module. The formatter operable to receive the amplified signal and to adjust the hue of the color associated with the at least one clipped pixel. In one particular embodiment, the hue of the color associated with the at least one clipped pixel is adjusted to substantially the hue of the color that was specified by the signal.Type: GrantFiled: December 30, 2003Date of Patent: July 28, 2009Assignee: Texas Instruments IncorporatedInventor: Roger M. Ikeda
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Patent number: 7492108Abstract: System and method for improving efficiency in driving LEDs. A preferred embodiment comprises a switch current regulator coupled to a current control signal input, the switch current regulator to control an amount of current provided to the LED based upon a magnitude of a voltage on the current control signal input, a switching voltage regulator coupled to the switch current regulator and the LED, the switching voltage regulator to provide current to the LED, and a sensor coupled to the switch current regulator, the LED, and a signal feedback circuit, the sensor to measure status information regarding the switch current regulator and the LED and provides the information to a controller, wherein the status information can be used to adjust the current on the current control signal input.Type: GrantFiled: August 11, 2005Date of Patent: February 17, 2009Assignee: Texas Instruments IncorporatedInventors: Getzel Gonzalez Garcia, Stephen Wesley Marshall, Steven Monroe Penn
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Patent number: 7450297Abstract: The present invention provides a method for manufacturing a digital micromirror device and a method for manufacturing a projection display system. The method for manufacturing the digital micromirror device may include providing a material stack, the material stack including a spacer layer having one or more openings therein and located over control circuitry located on or in a semiconductor substrate, a layer of hinge material located over the spacer layer and within the one or more openings, and a layer of hinge support material located over the layer of hinge material and within the one or more openings. The method may further include patterning the layer of hinge support material using photoresist, patterning the layer of hinge material using the patterned layer of hinge support material as a hardmask, and removing the patterned layer of hinge support material from over an upper surface of the patterned layer of hinge material.Type: GrantFiled: August 15, 2005Date of Patent: November 11, 2008Assignee: Texas Instruments IncorporatedInventors: Anthony DiCarlo, Stephen Meisner
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Patent number: 7449358Abstract: A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.Type: GrantFiled: March 29, 2005Date of Patent: November 11, 2008Assignee: Texas Instruments IncorporatedInventors: Satyadev R. Patel, Andrew G. Huibers, Steve S. Chiang
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Patent number: 7449765Abstract: A MEMS (micro electro-mechanical system) semiconductor device and a method for producing such a device. A preferred embodiment of the present invention comprises the a wafer having a continuous BCS (bondline control structure) surrounding a MEMS active area that is affixed to an interposer layer, which is in turn affixed to a cover to form a sealed cavity over the surface of the MEMS. To fabricate this device, a wafer is populated with MEMS devices. The BCS is formed in the same process step as a device structure, for example a spacer layer. The BCS remains, however, even if all or a portion of this spacer layer is removed. In this way when the reflecting surface of the MEMS device has been formed, an interposer layer may be mounted to the BCS using a filler-less adhesive, and a cover can likewise be affixed to the interposer layer.Type: GrantFiled: February 27, 2006Date of Patent: November 11, 2008Assignee: Texas Instruments IncorporatedInventors: John Charles Ehmke, James Norman Hall
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Patent number: 7432572Abstract: The present invention provides methods of manufacturing a MEMS assembly. In one embodiment, the method includes mounting a MEMS device, such as a MEMS mirror array, on an assembly substrate, where the MEMS device has a sacrificial layer over components formed therein. The method also includes coupling an assembly lid to the assembly substrate and over the MEMS device to create an interior of the MEMS assembly housing the MEMS device, whereby the coupling maintains an opening to the interior of the MEMS assembly. Furthermore, the method includes removing the sacrificial layer through the opening. A MEMS assembly constructed according to a process of the present invention is also disclosed.Type: GrantFiled: September 19, 2005Date of Patent: October 7, 2008Assignee: Texas Instruments IncorporatedInventor: Joshua Malone
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Patent number: 7422920Abstract: A spatial light modulator is disclosed, along with a method for making such a modulator that comprises an array of micromirror devices. The center-to-center distance and the gap between adjacent micromirror devices are determined corresponding to the light source being used so as to optimize optical efficiency and performance quality. The micromirror device comprises a hinge support formed on a substrate and a hinge that is held by the hinge support. A mirror plate is connected to the hinge via a contact, and the distance between the mirror plate and the hinge is determined according to desired maximum rotation angle of the mirror plate, the optimum gap and pitch between the adjacent micromirrors. In a method of fabricating such spatial light modulator, one sacrificial layer is deposited on a substrate followed by forming the mirror plates, and another sacrificial layer is deposited on the mirror plates followed by forming the hinge supports.Type: GrantFiled: March 23, 2006Date of Patent: September 9, 2008Assignee: Texas Instruments IncorporatedInventors: Satyadev R. Patel, Andrew G. Huibers
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Patent number: 7414296Abstract: The present invention provides method of manufacturing a metal-insulator-metal capacitor (100). A method of manufacturing includes depositing a first refractory metal layer (105) over a semiconductor substrate (110). The first refractory metal layer (105) over a capacitor region (200) of the semiconductor substrate (110) is removed and a second refractory metal (300) is deposited over the capacitor region (200). Other aspects of the present invention include a metal-insulator-metal capacitor (900) and a method of manufacturing an integrated circuit (1000).Type: GrantFiled: February 13, 2006Date of Patent: August 19, 2008Assignee: Texas Instruments IncorporatedInventors: Tony Thanh Phan, Farris D. Malone
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Patent number: 7413994Abstract: The present invention provides a photoresist removal process and a method for manufacturing an interconnect using the same. One embodiment of the photoresist removal process includes, among other steps, providing a low dielectric constant (k) substrate having a photoresist layer located thereover, and removing the photoresist layer using a plasma which incorporates a gas which includes hydrogen or deuterium and a small amount of oxygen less than about 20 volume percent of the gas. Another embodiment of the photoresist removal process includes, among other steps, providing a low dielectric constant (k) substrate having a photoresist layer located thereover, removing a bulk portion of the photoresist layer using a plasma which incorporates a gas which includes hydrogen or deuterium, and removing a small portion of the photoresist layer using a plasma which incorporates a gas which includes oxygen, wherein the order of the two removing steps is interchangeable.Type: GrantFiled: June 8, 2005Date of Patent: August 19, 2008Assignee: Texas Instruments IncorporatedInventors: Patricia Beauregard Smith, Laura M. Matz, Vinay Shah
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Patent number: 7415378Abstract: The present invention provides a method for analyzing critical defects in analog integrated circuits. The method for analyzing critical defects, among other possible steps, may include fault testing a power field effect transistor (120) portion of an analog integrated circuit (115) to obtain electrical failure data. The method may further include performing an in-line optical inspection of the analog integrated circuit (115) to obtain physical defect data, and correlating the electrical failure data and physical defect data to analyze critical defects.Type: GrantFiled: January 31, 2005Date of Patent: August 19, 2008Assignee: Texas Instruments incorporatedInventors: Martin B. Mollat, Milind V. Khandekar, Tony T. Phan, Kyle M. Flessner
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Patent number: 7411717Abstract: A spatial light modulator comprises an array of micromirror devices each of which has a reflective and deflectable mirror plates. The mirror plates are moved between an ON and OFF state during operation, wherein the OFF state is a state wherein the mirror plate is not parallel to the substrate on which the mirror plate is formed. The micromirror device may have an ON state stopper for limiting the rotation of the mirror plate at the ON state angle, but does not have an OFF state stopper. The non-zero OFF state is achieved by attaching the mirror plate to a deformable hinge held by a hinge support that is curved at the natural resting state.Type: GrantFiled: October 21, 2005Date of Patent: August 12, 2008Assignee: Texas Instruments IncorporatedInventors: Satyadev Patel, Andrew Huibers
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Patent number: 7404909Abstract: The invention provides a method for manufacturing a microelectronic device and a microelectronic device. The method for manufacturing the microelectronic device, without limitation, may include forming a first mirror layer over and within one or more openings in a sacrificial spacer layer, and forming a dielectric layer over an upper surface of the first mirror layer and within the one or more openings. The method may further include subjecting the dielectric layer to an etch, the etch removing the dielectric layer from the upper surface and leaving dielectric portions along sidewalls of the one or more openings, and forming a second mirror layer over the first mirror layer and within the one or more openings, the dielectric portions separating the first mirror layer and the second mirror layer along the sidewalls.Type: GrantFiled: December 6, 2006Date of Patent: July 29, 2008Assignee: Texas Instruments IncorporatedInventor: David A. Rothenbury
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Patent number: 7406178Abstract: The present invention is a digital dynamic compression or automatic gain control (AGC) (10) adapted for use in high quality audio and hearing aids applications. An efficient digital AGC design employs two compact ROM-based tables (ROM_CSD, ROM_SPL) in addition to two comparators (COMP_A, COMP_B) and several registers (REG_A, REG_B, ADDR_A, ADDR_B). While one ROM stores the values of discrete input signal levels, the other contains gain codes based on a canonical signed digit (CSD) coding approach that leads to a very simple gain multiplier (20). In many cases an extremely compact table for gain values can be achieved by reusing a single small-size ROM that behaves like one that is several time larger. Two design examples are shown to expound the insights of the new digital AGC design. For the less-than-half-dB-gain-step cases only two adders are required for the multiplier whereas just three adders are needed in the situations with less than quarter-dB gain steps.Type: GrantFiled: April 6, 2001Date of Patent: July 29, 2008Assignee: Texas Instruments IncorporatedInventors: Zhongnong Jiang, James R. Hochschild
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Patent number: 7405856Abstract: A display system includes a light source 110 and a spatial light modulator 122 located to receive light from the light source. The spatial light modulator (e.g., a DMD) includes a number of independently controllable elements that are activated for a period of time to display light of a desired brightness. A light sensor 136 is located to determine a characteristic of light from the light source 110. A control circuit 126 is coupled to the spatial light modulator 122 and controls the period of time that the independently controllable elements are activated. This period of time is based at least in part by an input received from the light sensor 136.Type: GrantFiled: June 15, 2007Date of Patent: July 29, 2008Assignee: Texas Instruments IncorporatedInventors: Donald B. Doherty, Daniel J. Morgan
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Patent number: 7405860Abstract: A projection system, a spatial light modulator, and a method for forming a micromirror array such as for a projection display are disclosed. The spatial light modulator can have two substrates bonded together with one of the substrates comprising a micro-mirror array. The two substrates can be bonded at the wafer level after depositing a getter material and/or solid or liquid lubricant on one or both of the wafers if desired. In one embodiment of the invention, one of the substrates is a light transmissive substrate and a light absorbing layer is provided on the light transmissive substrate to selectively block light from passing through the substrate. The light absorbing layer can form a pattern, such as a frame around an array of micro-mirrors.Type: GrantFiled: March 9, 2005Date of Patent: July 29, 2008Assignee: Texas Instruments IncorporatedInventors: Andrew G. Huibers, Satyadev R. Patel
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Patent number: 7402878Abstract: A novel method of packaging electronic devices (e.g. any device that receives or transmits electronic signals) including microelectromechanical devices, semiconductor devices, light emitting devices, light modulating devices, light modulating devices, and light detecting device has been provided herein. The electronic device is placed between two substrates, at least one of which has a cavity for holding the electronic device. The two substrates are then bonded and hermetically sealed with a sealing medium. The adhesion of the sealing medium to the substrates, especially when one of the two substrates is ceramic, can be improved by applying a metallization layer to the surface of the substrate.Type: GrantFiled: May 24, 2004Date of Patent: July 22, 2008Assignee: Texas Instruments IncorporatedInventor: Terry Tarn
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Patent number: 7403324Abstract: A spatial light modulator has an array of reflective surfaces of deflectable mirror plates. For improving the reflectivity of the mirror plates, layers that are preferably transmissive to visible light are provided on the reflective surfaces of the mirror plates. The layers may have different thicknesses and/or refractive indices to the visible light to optimize the reflectivity of the mirror plates.Type: GrantFiled: January 25, 2006Date of Patent: July 22, 2008Assignee: Texas Instruments IncorporatedInventor: Andrew G. Huibers
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Patent number: 7402458Abstract: An improved window frame and window piece for a micromirror assembly is disclosed herein. The window frame includes a stress-relieving contour positioned in the middle of the frame that can absorb the mechanical stresses applied to the window frame from the ceramic base and from the window piece. The window frame may be comprised of a single piece of sheet metal that has been stamped to include a stress-relieving contour. The stress-relieving contour may be comprised of a variety of shapes, including a āUā shape, an inverted āUā shape, a curved step shape, or other combinations thereof.Type: GrantFiled: April 28, 2005Date of Patent: July 22, 2008Assignee: Texas Instruments IncorporatedInventors: Bradley Morgan Haskett, John Patrick O'Connor, Steven E. Smith, Mark Myron Miller, Ivan Kmecko, Jwei Wien Liu, Edward Carl Fisher, Frank O. Armstrong, Daniel C. Estabrook, Jeffrey E. Faris
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Patent number: 7396716Abstract: The present invention provides a method of fabricating a microelectronics device. In one aspect, the method comprises forming a capping layer 610 over gate structures 230 located over a microelectronics substrate 210 wherein the gate structures 230 include sidewall spacers 515 and have a doped region 525 located between them. A protective layer 710 is placed over the capping layer 610 and the doped region 525, and a portion of the protective layer 710 and capping layer 610 that are located over the gate structures are removed to expose a top surface of the gate structures 230. A remaining portion of the protective layer 710 and capping layer 610 remains over the doped region 525. With the top surface of the gate structures 230 exposed, metal is incorporated into the gate structures to form gate electrodes 230.Type: GrantFiled: August 11, 2005Date of Patent: July 8, 2008Assignee: Texas Instruments IncorporatedInventors: Freidoon Mehrad, Shaofeng Yu, Joe G. Tran
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Patent number: 7394140Abstract: Disclosed herein is a micromirror array device that comprises an array of reflective deflectable mirror plates each being associated with one single addressing electrode to be deflected to an ON state angle. A light transmissive electrode is disposed proximate to the mirror plates for deflecting the mirror plates to a non-zero OFF angle. The mirror plates are arranged in the array with a center-to-centre distance of 10.17 microns or less.Type: GrantFiled: April 19, 2005Date of Patent: July 1, 2008Assignee: Texas Instruments IncorporatedInventors: Satyadev Patel, Andrew Huibers, Chris Spindt, Peter H Heureux