Abstract: A branch metric duplication method substantially reduces interconnection delays. The branch metric duplication method is particularly useful to implement a high speed radix-4 Viterbi decoder targeted for FPGA applications. The decoder includes a plurality of branch metric computation units (BMCUs), at least one add-compare-select unit (ACSU) having a plurality of cells, and a survivor path memory unit (SMU). The plurality of BMCUs, the at least one ACSU, and the SMU are configured to implement the decoder.

Abstract: According to one embodiment, a method for controlling positioning of an optical dithering element includes repeatedly driving the optical dithering element approximately between a plurality of desired positions by a generally periodic drive waveform. During a particular period of the drive waveform, the actual position of the optical dithering element is determined at a plurality of sample times. For each of the determined actual positions of the optical dithering element, a position error indicator is determined based upon whether the magnitude of the actual position is greater than, less than, or the same as a desired setpoint for the position of the optical dithering element. The method also includes generating an error signature for the particular period based on the determined error indicators and modifying the drive waveform in response to the error signature.

Abstract: A microelectromechanical device having a movable element with low mass inertia is disclosed herein. The movable element is held on a substrate such that the element is capable of rotating relative to the substrate; and the element has a mass inertia of 1.2×10?24 kg·m2 or less.

Abstract: A projection system, a spatial light modulator, and a method for forming a MEMS device is disclosed. The spatial light modulator can have two substrates bonded together with one of the substrates comprising a micromirror array. The two substrates can be bonded at the wafer level after depositing a getter material andlor solid or liquid lubricant on one or both of the wafers. The wafers can be bonded together hermetically if desired, and the pressure between the two substrates can be below atmosphere.

Abstract: The invention comprises a method of forming an integrated circuit, the method comprising: (1) forming a first dielectric layer disposed outwardly from a semiconductor substrate; (2) forming a first intermediate structure outwardly from the a dielectric layer, the first intermediate structure comprising a floating gate layer disposed outwardly from the first dielectric layer, a second dielectric layer disposed outwardly from the floating gate layer, and a first polysilicon layer disposed outwardly from the second dielectric layer; (3) removing regions of the first intermediate structure to form at least one gate stack disposed outwardly from the first dielectric layer; and (4) forming at least one dielectric isolation region after the formation of the gate stacks, wherein the at least one dielectric isolation region is disposed between two gate stacks.

Abstract: Disclosed herein is method of operating a device that comprises an array of micromirrors. The method comprises a process usable for repairing stuck micromirrors of the micromirror array during the operation. The reparation process applies, at the ON state, two consecutive refresh voltages to the mirror plates of the micromirrors in the array with the pulses being separated in time longer than the characteristic oscillation time of the micromirrors. The reparation process can be applied independently to the micromirrors. Alternatively, the reparation process can be incorporated with a bias inversion process.

Abstract: A display apparatus 200 includes a substrate 219 and a number of light emitting diodes (LEDs) 202 coupled to the substrate. An optical element 207 such as a shroud or an integrator rod is located adjacent to at least one of the LEDs. In operation, the optical element and the LEDs are movable relative to one another so that the optical element is adjacent to different ones of the LEDs at different times.

Abstract: A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

Abstract: A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between which a microelectromechanical device, such as a micromirror array device is located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer is deposited, and heated by the heater so as to bond the first and second package substrates together.

Abstract: Apparatus for converting orthogonal data to a format suitable for displaying the image on a diamond-shaped pixel array. A stream of digital data formatted for being displayed on an orthogonal pixel array is received at an IIR (Infinite Impulse Response) filter. The digital data stream is conditioned so that it can be sub-sampled and used on a diamond-shaped pixel array with minimal distortion. The sub-sampling comprises dropping even pixels in odd numbered orthogonal rows and dropping odd pixels on all even numbered rows. A tap is included at the IIR filter for providing a partially filtered version of the data stream to circuitry for reducing “ringing” of the image. The circuitry also detects edges in the image and emphasizes vertical transitions when a vertical edge is detected and emphasizes horizontal transitions when a vertical edge is not detected.

Abstract: Methods and apparatus are provided for preventing charge accumulation in microelectromechanical systems, especially in micromirror array devices having a plurality of micromirrors. Voltages are applied to the micromirrors for actuating the micromirrors. Polarities of the voltage differences between mirror plates and electrodes are inverted so as to prevent charge accumulation.

Abstract: A micromirror of a micromirror array of a spatial light modulator used in display systems comprises a mirror plate attached to a hinge that is supported by two posts formed on a substrate. Also the mirror plate is operable to rotate along a rotation axis that is parallel to but offset from a diagonal of the mirror plate when viewed from the top. An imaginary line connecting the two posts is not parallel to either diagonal of the mirror plate.

Abstract: Providing color management includes receiving measurements of the intensity of colors. A light source generates light beams to yield the colors, where the light beams are generated in accordance to image data to create an image. A target color value is established. A duty cycle sequence operable to control the light source is selected in accordance with the measurements and the target color value. Current levels for currents provided to the light source are selected in accordance with the duty cycle sequence and the target color value.

Abstract: In accordance with the present invention, a system and method to increase die stand-off height in a flip chip are provided. The system includes a plurality of separator pedestals disposed between a first face of a die and a second face of a substrate, the substrate positioned generally parallel with, and spaced apart from, the die, and the first face being opposite the second face. The plurality of separator pedestals are operable to selectively force the die and substrate apart, increasing the stand-off height of the flip chip assembly.

Abstract: A system and method implement very high data rate baseband DACs suitable for wireless applications related to new standards (e.g. Ultra-Wide Band) using CMOS processes allowing an integrated solution with the deep-submicron CMOS digital baseband. A single CMOS block working at full speed is discarded in favor of several blocks, each working at a fraction of the original data rate.

Abstract: A Universal Serial Bus (USB) modem (14) in which reassembly and segmentation operations are performed outside of the host computer (12) is disclosed. A USB interface device (30) is coupled to a digital signal processor (DSP) (32) in the modem (14), and contains a shared memory (44) in which bulk endpoints (51) are established, at which received ATM cell payload data may be stored. An ATM receive controller (134) is provided in the USB interface device (30), which receives each ATM cell from the DSP (32) and interrogates the ATM cell header to determine which, if any, virtual connection the cell corresponds. The ATM receive controller (134) then forwards the payload portion of the ATM cell, but not the ATM cell header, to the endpoint (51) corresponding to the virtual connection to which the ATM cell is directed. The disclosed ATM receive controller (134) also includes logic (64) for calculating a cyclic redundancy check value over the payload portion of the ATM cells that make up an ATM packet.

Abstract: A semiconductor device having reduced self and mutual capacitance of bonded wires is provided by coating the wires with a foamed polymer effectively having a very low dielectric constant. Additional benefits are realized by electrically insulating the wires against short-circuiting, by cushioning the wires with a low modulus sheath, and by protecting chip bond pad metallization TABLE 1 Method of Moments Capacitance Models Wire Dimensions 25 × 25 microns Separation between Wires 63.5 microns Distance to ground ?191 microns Model Dielectric Self capacitance Mutual Capacitance constant of Wire 1 Wire 2 separation Model Dielectric Wire 1 Wire 2- Mutual cap constants self cap self cap pf/cm pf/cm pf/cm Plastic encased 4.0 1.03 0.54 1.57 package Cavity package 4./1.0/4. 0.31 0.12 0.43 Foam sheath 4./1./4./1./4. 0.34 0.16 0.50 wires/molded Wires - no 1.? 0.26 0.13 ?0.39.

Abstract: A method for measuring noise parameters includes generating a noise signal at a noise source. The noise signal includes a first input signal at a first frequency and a second input signal at a second frequency. The first input signal and the second input signal are modulated onto a carrier to generate a modulated signal. The modulated signal is attenuated to a desired power level and applied to a device under test to obtain a noise measurement.

Abstract: A substrate that is not lying flat on its substrate tray can present significant process problems when a vacuum pickup attempts to pick up the substrate and fails due to the lack of a proper bond forming between the pickup and the substrate. The substrate left behind on the substrate tray could require human intervention. Intervention slows down the manufacturing process and increases costs. A method and apparatus to ensure that substrates are lying flat when presented to the vacuum pickup pad is disclosed. A plate with protrusions is raised into a substrate tray with holes. The protrusions lift the substrates up off the bottom of the substrate tray and ensure that they are laying flat when presented to the vacuum pickup pad.

Abstract: Disclosed herein are visual display systems and methods capable of having shifted bit-weights in neutral density filtering (NDF) applications. In one embodiment, a method (200) of displaying an image comprises transmitting light through an optical filter (17) comprising at least one high transmissivity portion configured to output light at an initial intensity, and at least one low transmissivity portion configured to output light at a lower intensity than the initial intensity, where the initial intensity and lower intensity output light illuminates a spatial light modulator (14). The method also includes providing a plurality of data bits (non-ND) from a predetermined number of data bits (B0–B7), where each of the plurality comprises a pulse-width longer than a load-time for operating the spatial light modulator (14).