Abstract: A semiconductor device has a substrate having a plurality of metal traces. At least one electronic component is electrically coupled to a first surface of the substrate. A mold compound is used for encapsulating portions of the electronic component and the first surface of the substrate, wherein a portion of the mold compound is removed around at least one side of the electronic component. A conductive coating is applied to the mold compound and an area where the portion of the mold compound is removed.

Abstract: A circuit board has an insulative layer including a first surface and a second surface opposite to the first surface. A plurality of electrically conductive patterns is formed on the first surface of the insulative layer. Conductive lands are formed in a die mounting region of the first surface of the insulative layer and electrically connected to one of the plurality of conductive patterns on the first surface. An extending pattern extends from the conductive lands to outside of the mounting region. A protective layer covers the first surface of the insulative layer and the electrically conductive patterns. A trench is formed in the protective layer to expose the conductive lands and the extending patterns.

Abstract: A radiation detection aircraft has at least one component member of the aircraft having scintillator material. A signal converter is coupled to the at least one component member. An accumulator is coupled to the signal converter.

Abstract: A semiconductor package has a first substrate having a plurality of electrically conductive patterns formed thereon. A first semiconductor die is coupled to the plurality of conductive patterns. A second semiconductor die is coupled to the first semiconductor die by a die attach material. A third semiconductor die is coupled to the second semiconductor die by a die attach material. A second substrate having a plurality of electrically conductive patterns formed thereon is coupled to the third semiconductor die. A plurality of contacts is coupled to a bottom surface of the first substrate. A connector jack is coupled to the second substrate. A plurality of leads is coupled to the second semiconductor die by conductive wires.

Abstract: There is provided a seat assembly for use in a downhole oil pump ball valve. The assembly includes a seat, a seat rest, and a ball. The seat is used for seating the ball of the ball valve. The seat has an outer wall and a top surface and a curved shoulder surface between the outer wall and the top surface. The seat rest receives the seat, and the seat rest has a curved corner surface so that when the seat is assembled with the seat rest the seat and seat rest are in substantial contact at all points of the curved shoulder surface and the curved corner surface.

Abstract: A universal tool for installing annular parts, components, or devices such as tapered and non-tapered bearings on shafts includes a cap, a tube, and cooperating interchangeable force distributors. A first interchangeable tapered force distributor attaches to the tube and includes a tapered or beveled edge allowing for proper visual alignment with, and isolated force distribution on, the inner race of a tapered bearing. A second interchangeable non-tapered force distributor also attaches to the tube and includes an annular flange with a substantially flat surface that cooperates with the inner and outer races of the ball bearing such that force applied to the cap of the universal tool is evenly distributed around the inner and outer races of the ball bearing. A connector piece can be used to connect two tubes in order to accommodate longer shafts.

Abstract: A system to launch and recover an Unmanned Aerial Vehicle (UAV) aircraft has a pole member attached to a deck of a ship. An arm member is attached to the pole member and extends away from the pole member in an approximately horizontal direction. The arm member is able to move rotationally and vertically on the pole member. An attachment mechanism is attached to a distal end of the arm member for holding and capturing the UAV aircraft. Momentum of the UAV aircraft causes the arm member to move rotationally around and vertically on the pole member when the UAV aircraft is coupled to the attachment mechanism.

Abstract: A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. A cover substrate having a plurality of metal traces and a plurality of cover vias is provided. A first die is attached to the first surface of the substrate and positioned over the opening. Side members are coupled to ground planes on the base substrate and cover substrate to form an RF shield around the first die. At least one wirebond having a first end attached to the first die and a second end attached to a metal trace of the base substrate is provided. The at least one wirebond forms a loop wherein a top section of the loop contacts a metal trace of the cover substrate.

Abstract: A liquid medication dispenser includes a housing that has open top and bottom. The housing includes a central channel and a plurality of internal compartments disposed around the central channel. Each internal compartment is configured to hold liquid medication. The central channel is provided with symmetrically disposed bottom apertures configured to open into respective internal compartments. A shaft is configured to rotate and advance within the central channel. The shaft has a bottom hollow portion and at least one lateral aperture thereon configured to align with each one of the bottom channel apertures. The lateral shaft aperture aligns with a respective bottom channel aperture to allow transfer of liquid medication under gravity from the corresponding internal compartment into the bottom hollow portion of the shaft. The bottom hollow portion is apertured at one end to allow for transferred liquid medication to drip out of the dispenser in a controlled fashion.

Abstract: A semiconductor device has a substrate. A die is attached to a first surface of the substrate. A heat sink is provided having an approximately planer member and support members extending from the planer member. The support members are attached to the first surface of the substrate to form a cavity over the die with the planer member positioned above the die. An encapsulant is provided for encapsulating the device, wherein an exterior surface of the planer member is exposed. A non-tapered opening is formed in the planer member. The encapsulant is injected through the opening to encapsulate the cavity and the encapsulant will partially fill the non-tapered opening.

Abstract: A garment hanger has a pair of clamping members. Each clamping member comprises a pair of planer end sections and a central curved section attached to the pair of planer end members. The pair of end sections of a first clamping member will touch a corresponding pair of end sections of a second clamping member and the central curved section of the first and second clamping members form an elongated oval when the pair of clamping members is placed together in a closed position. A locking device is attached to the central curved section of the first and second clamping members. The locking device secures the pair of clamping members together. When pressure is applied to the locking device, the locking device forces opens and separates the pair of clamping members. A hook assembly is attached to the locking device.

Abstract: An electrical waveform generating circuit has a programmable current source-driver. A digital switched current source is coupled to the programmable current source-driver and controlled by waveforms stored in the programmable current source-driver. A plurality of MOSFETs is coupled to the programmable current source driver. A center-tapped RF transformer is provided and has a primary coupled to the plurality of high voltage MOSFETs. A transducer is coupled to a secondary of the RF transformer.

Abstract: A semiconductor device has a substrate having a plurality of metal layers. A die coupled to the substrate. A first wire fence structure is formed on the substrate. A second wire fence structure is formed on the substrate. A mold compound is used for encapsulating the die, a first surface of the substrate, the first wire fence structure, and the second wire fence structure, wherein a top portion of at least one of the first wire fence structure or the second wire fence structure is exposed. A conductive coating is applied to the mold compound and to the portion of the at least one of the first wire fence structure or the second wire fence structure is exposed.

Abstract: An integrated circuit module has a substrate having a plurality of metal traces. At least one semiconductor package is electrically coupled to at least one metal trace on a first surface of the substrate. At least one electronic component is electrically coupled to at least one metal trace on the first surface of the substrate. A non-conductive coating covers exposed active surfaces on the first surface of the substrate. A conductive coating is applied to the non-conductive coating, and electrically contacting ground pads exposed on the substrate.

Abstract: A system to electronically assist health care professionals quickly and efficiently calculate dosages and infusion rates for emergency drugs. The system comprises a portable hand-held calculator incorporating user input keys dedicated to commonly prescribed drugs, quick entry of default drug values, and toggles between at least two operational modes, specifically between adult and pediatric modes. In addition, the system alarms on the entry of “out-of-range” drug values, titrates, immediately ascertains compatibilities between drugs, and allows the updating of stored drug parameters by means of physical or wireless data ports.

Abstract: A door system for an aircraft has a flight deck door hingely coupled to a flight deck bulkhead. A lavatory is adjacent to the flight deck bulkhead and formed of a lavatory bulkhead. A lavatory door is coupled to the lavatory bulkhead. A latching mechanism is attached to the flight deck door. The latching mechanism in a first position engages the flight deck bulkhead and in a second position engages the lavatory bulkhead.

Abstract: An electroactive lens driver generates a variable root-mean-square drive voltage for controlling an electroactive lens by controlling the duty cycle of a modified square wave.

Abstract: A semiconductor package and method of fabricating has a substrate having conductive patterns formed thereon. A semiconductor die is attached to the substrate. An electrically connecting member is electrically coupled to the semiconductor die and the conductive patterns. A plurality of lands is coupled to the substrate. At least one land is pivotally mounted to the substrate. A first section of the pivotally mounted land is in contact with the substrate. A second section of the pivotally mounted land is floating to form a void area between the substrate and the second section. An encapsulant is used for encapsulating a top surface of the substrate, the semiconductor die, and the electrically connecting member. A solder ball is electrically coupled to each land.

Abstract: A locking device is adapted for receipt within the main cavity of an underground enclosure. The locking device includes a container having a main body and a container top which define an interior compartment for holding the items of the underground enclosure. The main body is adapted to be assembled in the main cavity of the underground enclosure and is sized to be retained within the underground enclosure. The container top has a selective open position to allow access to the interior compartment of the main body and a selective closed locked position to deter access thereto. An arm assembly coupled to the container top is moveable between an extended engaged position to retain the container top on the container and a collapsed disengaged position to allow release of the container top from the container.

Abstract: A ultrasound transmit pulse waveform generator for driving a piezoelectric transducer in medical ultrasound imaging, nondestructive testing (NDT) ultrasound imaging applications, includes a capacitor, switching programmable current sources, and a power amplifier.