Abstract: A voltage reference circuit comprising a first reference voltage source, a second reference voltage source, at least one of said first and second reference voltage sources being dependent on temperature, and first circuitry connected to at least one of said first and second reference voltage sources to provide a third reference voltage, said third reference voltage being dependent on temperature.

Abstract: A plurality of fold decoders are each coupled to a different set of successive entries within an instruction fetch buffer stack and check the contents of the successive entries for a variable number of variable-length instructions which may be folded. Folding information for each of the respective set of entries, identifying a number of instructions therein which may be folded (if any) and a size of each instruction which may be folded, is produced by the fold decoders and stored in the first entry of the set, then transmitted to the main decoder for use in folding instructions during decoding.

Abstract: There is disclosed a data processor comprising: 1) an instruction execution pipeline comprising N processing stages for executing a load instruction; 2) a status register for storing a modifiable configuration value, the modifiable configuration value having a first value indicating the data processor is capable of executing a misaligned access handling routine and a second value indicating the data processor is not capable of executing a misaligned access handling routine; 3) a misalignment detection circuit for determining if the load instruction performs a misaligned access to a target address of the load instruction and, in response to a determination that the load instruction does perform a misaligned access, generating a misalignment flag; and 4) exception control circuitry capable of detecting the misalignment flag and in response thereto determining if the modifiable configuration value is equal to the first value.

Abstract: In linear arrays of charge coupled device photosensors, sensor integrated circuits are contained in surface mountable packaging allowing individual segments to be soldered into place within the array. For solder-mountable packaging, unencapsulated sensor circuits are mounted onto a lead frame strip with the space between the circuits equaling the width of a singulation saw. After die mounting and wire bonding, a continuous strip of plastic or resin molding covers the wire bonds on one side and the edge of the silicon on the other, protecting the lead frame strip and other parts, leaving the active sensor area exposed. The lead frame is then trimmed and formed in a conventional manner, and the packaged sensor circuits are separated with a singulation saw cutting between the circuits. The resulting self-contained device may then be surface mounted within a linear array with solder rather than depending on Chip On Board technology.

Abstract: The bottom mold portion for a transfer molding system is covered with a deformable material. During mold clamping, the deformable material contacts the bottom surface of the packaging substrate on which the integrated circuit die is mounted. Deformation of this relatively soft covering on the bottom mold portion accommodates thickness variations in the packaging substrate, as well as non-planarity of the adhesive layer between the integrated circuit die and packaging substrate in exposed active area integrated circuits.

Abstract: A method of fabricating an integrated circuit sensor package. The method comprises the steps of: 1) mounting a substrate on a first mold block, the substrate comprising a substantially planar material having a first substrate surface and a second substrate surface that contacts a mounting surface of the first mold block; 2) placing an adhesive on the first substrate surface; 3) placing an integrated circuit sensor on the adhesive; and 4) pressing a second mold block against the first substrate surface. The second mold block comprising a cavity portion for receiving the integrated circuit sensor, a contact surface surrounding the cavity portion, and a compliant layer mounted with the cavity portion. Pressing the second mold block against the first substrate surface causes the contact surface to form with the first substrate surface a seal surrounding the integrated circuit sensor.

Abstract: There is disclosed a memory capable of storing a present value and at least one past value of a variable accessible by a first memory address. The memory comprises a memory block comprising R rows of memory cells and a row address decoder for decoding the first memory address. During a read operation, the row address decoder causes data to be retrieved from a row in which data stored to the first memory address was last written. During a write operation, the row address decoder causes data to be stored in a next-sequential row following the last-written row.

Abstract: A VLSI contact formation process in which a nitride layer is used to stop a wet oxide etch. An anisotropic plasma etch is used to cut a substantially vertical contact hole through the nitride and underlying layers. Thus, the resulting contact hole has a “Y”-shaped profile.

Abstract: There is disclosed a data processor having a clustered architecture that comprises a plurality of clusters and an interrupt and exception controller. Each of the clusters comprises an instruction execution pipeline having N processing stages. Each of the N processing stages is capable of performing at least one of a plurality of execution steps associated with instructions being executed by the clusters. The interrupt and exception controller operates to (i) detect an exception condition associated with one of the executing instructions, wherein this executing instruction issued at time t0, and (ii) generate an exception in response to the exception condition upon completed execution of earlier ones of the executing instructions, these earlier executing instructions issued at time preceding t0.

Abstract: A hard mask, e.g., a silicon dioxide or silicon nitride film, is used to avoid organic polymer materials in copper plasma etch applications. The hard mask would be deposited as a blanket layer on the Cu metal layer and itself be patterned and etched with a conventional photolithographic resist pattern. The hard mask etch is stopped shortly before the Cu surface is exposed. Halting the hard mask etch before the Cu surface is exposed facilitates the use of conventional cleaning processes following the hard mask etch. The remaining thin layer of hard mask can be etched through during the beginning of the Cu metal etch process. Any remaining hard mask deposited on the Cu metal layer can form a part of a new dielectric layer.

Abstract: In a packaged integrated circuit, electrostatic discharge protection is provided by portions of a lead frame on which the integrated circuit is mounted. The lead frame includes a die paddle on which an integrated circuit die is mounted, with plastic or epoxy material encapsulating exposed surfaces of the integrated circuit die except for a sensing surface, and supporting pins or leads formed from the lead frame. Portions of the lead frame extending from the die paddle are folded around sides of the encapsulated integrated circuit die and over, or adjacent to and level with, a peripheral upper surface of the encapsulated integrated circuit die to form an electrostatic discharge ring. The lead frame portions folded around the integrated circuit package are connected to ground through a ground pin, so that charge on a human finger touching the electrostatic discharge ring is dissipated to ground before the finger contacts a sensing surface of the integrated circuit.

Abstract: A method for removing heat from an active area of an integrated circuit device is provided. The method includes applying a separator to the active area of the integrated circuit device. A thermally conductive element is coupled to the active area of the integrated circuit device outwardly of the separator.

Abstract: A gate structure in a transistor and method for fabricating the structure. A gate structure is formed on a substrate. The gate structure includes three layers: an oxide layer, a nitride layer and a polysilicon layer. The oxide layer is located on the substrate, the nitride layer is located on the oxide layer, and the polysilicon layer is located on the nitride layer. The gate structure is reoxidized to form a layer of oxide over the gate structure.

Abstract: In capacitive sensor circuits where physical contact is required and excess pressure may be inadvertently applied to the sensor surface, aluminum is not sufficiently hard to provide “scratch” protection and may delaminate, causing circuit failure, even if passivation integrity remains intact. Because hard passivation layers alone provide insufficient scratch resistance, at least the capacitive electrodes and preferably all metallization levels within the sensor circuit in the region of the capacitive electrodes between the surface and the active regions of the substrate are formed of a conductive material having a hardness greater than that of aluminum. The selected conductive material preferably has a hardness which is at least as great as the lowest hardness for any interlevel dielectric or passivation material employed.

Abstract: The invention comprises a lid that is capable of being placed in contact with and attached to an integrated circuit that has an exposed surface of an integrated circuit die. The lid has portions that form a cavity between a surface of the lid and the exposed surface of the integrated circuit die when the lid is placed in contact with the integrated circuit. The lid also has portions that form a first fluid conduit for transporting a fluid into the cavity and a second fluid conduit for transporting the fluid out of the cavity. Heat from the integrated circuit die is absorbed by the fluid by direct convection and removed from the integrated circuit when the fluid is removed from the cavity.

Abstract: A method for providing a leadframeless package structure is provided. The method includes providing a temporary carrier. The temporary carrier is coupled to a metal foil layer with a temporary adhesive layer. An integrated circuit chip is coupled to the metal foil layer. The temporary adhesive layer and the temporary carrier are removed to form the leadframeless package structure after molding.

Abstract: There is disclosed a data processor having a clustered architecture that comprises a plurality of clusters, an instruction cache and a power-down controller. Each of the clusters comprises an instruction execution pipeline having N processing stages. Each of the N processing stages is capable of performing at least one of a plurality of execution steps associated with instructions being executed by the clusters. The power-down controller monitors the instruction cache and each instruction execution pipeline to identify power-down conditions associated with the same and, in response to an identified power-down condition, at least one of: (i) bypasses performance of at least a portion of subsequent ones of the N processing stages associated with an executing instruction, (ii) powers down the instruction cache, and (iii) powers down the data processor.

Abstract: A method of fabricating an integrated circuit having an n-channel and a p-channel transistor is provided. The method includes forming LDD regions for the n-channel transistors self-aligned to the gate electrodes. A first oxide is then formed over the structure and the n-type silicon regions are implanting with a p+ type dopant through the first oxide to form the source and drain regions of the p-channel transistor. A second oxide is formed over structure. The two oxide layers are then etched to provide sidewall spacers, having an inner portion formed from the first oxide and an outer portion formed from the second oxide. The p-type silicon regions are implanted with an n+ type dopant to form the low resistivity regions of the n-channel transistor. The p+ implants in the source and drain of the p-channel transistor typically outdiffuse toward the gates during further thermal processing of the device.

Abstract: An apparatus for managing vertical dependencies between instructions in first and second instruction pipelines includes: 1) identifier (ID) reclaim circuitry for determining a sequential set of retired identifiers associated with retired instructions and for determining a next retire ID sequentially following the set; 2) first ID generation circuitry for sequentially assigning identifiers to destination registers associated with instructions entering the pipelines; 3) second ID generation circuitry associated with the first pipeline for identifying a first dependent source register associated with a first dependent source operand of a first instruction entering the first pipeline and assigning an ID of the first register to the first operand; and 4) instruction scheduling circuitry for comparing the first operand ID of the first instruction with the next retire ID and scheduling the first instruction for execution if the first operand ID is less than or equal to the next retire ID.

Abstract: An improved vacuum plasma etching device for plasma etching semiconductor wafers that have a photo-resist pattern. The improved plasma etching device has a reaction chamber in which the plasma etching is performed during a process cycle, an entrance vacuum loadlock for holding the next semiconductor wafer to be plasma etched, an exit vacuum loadlock for transporting the semiconductor wafers out of the reaction chamber after the plasma etching process, and a source of ultraviolet light. Exposing the semiconductor wafer to the ultraviolet light cures the photo-resist patterns, thereby improving CD dispersion, enhancing pattern transfer, and preventing photo-resist reticulation. Curing the photo-resist patterns while the semiconductor wafer is being held during the process cycle in the entrance vacuum loadlock, increases efficiency and productivity.