Abstract: The invention relates to compounds of formula I ##STR1## wherein A is a radical of formula ##STR2## R.sub.1 and R.sub.2 are each independently of the other hydrogen, C.sub.1 --C.sub.4 alkyl, C.sub.1 C.sub.4 alkoxy, halogen or a radical of formula ##STR3## wherein X is --O--, --CH.sub.2 --, --C(CH.sub.3).sub.2 -- or --SO.sub.2 --, and R.sub.3 and R.sub.4 are each independently of the other hydrogen, C.sub.1 --C.sub.4 alkyl or phenyl, as well as compositions comprising these compounds.The compositions are particularly suitable for making integrated circuits.

Abstract: Photopolymerisable compositions comprising(a) a tetraacrylate of formula I or II ##STR1## wherein R.sub.1 is a hydrogen atom or methyl,X.sub.1 and X.sub.2 are each independently of the other --O-- or --CO--O--,R.sub.2 is a divalent aliphatic, cycloaliphatic or aromatic radical of a diglycidyl compound that contains no more glycidyl ether or ester groups,A is a divalent aliphatic, cycloaliphatic or aromatic radical of a diisocyanate compound that contains no more isocyanate groups,n is an integer from 1 to 8, andR.sub.3 is a tetravalent cycloaliphatic radical of a diepoxide compound that contains no more 1,2-epoxide groups at the cycloaliphatischen ring,(b) at least one liquid radically polymerisable compound that differs from component a), and(c) a radical photoinitiator, are suitable preferably for the production of three-dimensional objects by the stereolithographic technique.

Abstract: Solutions of accelerator systems comprising a binary system comprisinga) 10 to 90% by weight of a salt of formula I[Me].sub.m.sup.x.sym. [R].sub.n.sup.y.crclbar. (I),wherein x and y are the respective number of charges and m and n are each a number 1, 2, 3 or 4, Me is a metal atom and R is the radical of an alcohol, phenol or thiophenol or of a carboxylic acid or thiocarboxylic acid, or10 to 90% by weight of a salt of formula II[Me.sub.1 ].sub.m.sup.x.sym. [A].sub.n.sup.y.crclbar. (II),with an organic complex former containing one or more hetero atoms having free electron pairs,wherein Me.sub.1 is a metal atom or a group of the formula N(R.sub.1).sub.4, S(R.sub.1).sub.3 or P(R.sub.1).sub.4 wherein each R.sub.1 independently of the others is hydrogen, an unsubstituted or substituted C.sub.1 -C.sub.6 alkyl or aryl radical, A is any anion and x, y, m and n are as defined above, andb) 90 to 10% by weight of an organic solvent containing at least one --OH, --OR.sub.1, --COOH, --COOR.sub.1, --COR.sub.1 or --CON(R.

Abstract: The present invention relates to impregnating solutions consisting:of an active principle A+B in which: A denotes at least one thermoplastic poly(imide-amide) oligomer functionalized at the chain ends with an alkenyloxy, maleimido or nadimido group, B denotes a coreactant chosen from: B1=an imide ingredient, B2=an acrylate ingredient, B3=an alkenylphenol ingredient, B4=a novolac resin, B5=a vinyl ingredient, B6=an epoxy resin, B7=an amino ingredient and B8=a mixture of a number of ingredients B1 to B7;and of one or a number of aprotic polar solvent(s), the concentration of the active principle in the solution being between 2 and 80% by weight.These solutions are employed especially for the production of preimpregnated intermediate articles.

Abstract: Novel (cyclo)aliphatic epoxy compounds that contain at least one acrylate group in the molecule and at least one cycloaliphatic epoxy group can be used for the production of coating formulations, adhesives, photoresists or in stereolithography. As they contain a cohesive homogeneous network, the three-dimensional objects produced have very good green strength and very good strength properties.

Abstract: An apparatus for coating board-shaped articles, especially printed circuit boards, comprises a preheating station for the printed circuit boards which is arranged at the entrance to the apparatus, and following the preheating station, in the sequence of their arrangement, at least one coating station for coating at least one side of the printed circuit boards with preferably UV-hardenable plastics, lacquer or the like, and at least one vapour-removal and drying station, each of which processing stations has transport means for the printed circuit boards. The transport means in the vapour-removal and drying station are equipped with carrying elements for the longitudinal edges of the printed circuit boards, the width of which elements can be adjusted to the width of the printed circuit boards to be carried and which support and guide the printed circuit boards at the longitudinal edges over their entire length.

Abstract: Liquid radiation-curable formulation, in particular for stereolithography, based on at least one compound that contains free radically polymerisable groups, and at least one photoinitiator suitable for the polymerisation, which formulation additionally contains a polyoxyalkylene-polysiloxane block copolymer that is selected from copolymers of the chemical formulaeR.sup.1 --(OC.sub.c H.sub.2c).sub.d --{[T]--(C.sub.c H.sub.2c O).sub.d-1 --(C.sub.c H.sub.2c)}.sub.g --OR.sup.1 (I) ##STR1## wherein: R.sup.1 is a hydrogen atom or a C.sub.1 -C.sub.8 alkyl group;R.sup.2 is a methyl or phenyl group;[T] is a polysiloxane group [PS] terminated as described in the specification in more detail;[PS] is the group of formula ##STR2## and [Alk] is an alkylene group of 3 to 10 carbon atoms, as well as novel block copolymers of formulae (I) and (II). The cured formulations have, inter alia, superior impact strength.

Abstract: There is disclosed a solid composition of polyglycidyl compounds having a molecular weight of less than 1500, which composition consists of one or more than one solid polyglycidyl compound and altogether not less than 5% by weight of one or of a mixture of more than one polyglycidyl compound, which compound or mixture is normally in liquid form, said amount being based on the total amount of all polyglycidyl compounds in the composition, which composition contains the said solid polyglycidyl compounds or at least part of the said solid polyglycidyl compounds in form of one or a mixture of more than one solid mixed phase, which solid mixed phase or mixture of more than one solid mixed phase essentially comprises the total amount of the polyglycidyl compounds which are normally in liquid form as additional component or components.

Abstract: A liquid composition which on exposure to actinic radiation polymerizes to form a heat-curable solid film adhesive, said composition comprising (A) a heat-curable phenol-aldehyde resol resin, (B) a photopolymerizable polyurethane or polyester having, on average, more than one polymerizable acrylic group per molecule, or a mixture of said polyurethane and said polyester, (C) a photopolymerization initiator for (B) and (D) a polyvinylacetal.

Abstract: The present invention provides a process for making a cured plastics moulding by introducing a pre-heated curable resin composition to a hotter mould which is at a temperature high enough to initiate curing of the resin, and supplying further resin under pressure to compensate for shrinkage of the composition, wherein the curable resin is an epoxy resin formulation comprising an epoxy resin containing more than one epoxide group per molecule on average, an acid anhydride hardener, an accelerator and a filler, the epoxy resin, hardener and accelerator being chosen so that the formulation is stable at 25.degree. C. for at least 14 days.

Abstract: A liquid composition which on exposure to actinic radiation polymerises to form a heat-curable solid film adhesive, said composition comprising (A) a heat-curable phenol-aldehyde resol resin, (B) a photopolymerisable resin having, on average, more than one polymerisable acrylic group per molecule, (C) a photopolymerisation initiator for (B) and (D) an aminotriazine-formaldehyde resin.

Abstract: A reaction product formed between an epoxy resin, a phenol compound such as bisphenol or the like and an isocyanate compound contains oxazolidone rings and it is a polymeric epoxy resin. Herein is provided an epoxy resin composition comprising said reaction product and a curing agent.The said reaction product contains oxazolidone rings and epoxy groups, and is excellent in heat resistance and adhesive property. Further said reaction product is made into a polymer by the use of the bisphenol compound and at the same time it contains oxazolidone rings; it is excellent in toughness and water resistance. When a tetrabromobisphenol is used as the bisphenol compound, flame retardance is also good.Accordingly, the epoxy resin composition of the present invention is excellent in heat resistance, toughness, adhesive property and water resistance. When a brominated compound is used as the phenol compound, the epoxy resin composition of the invention exhibits an excellent flame retardance.

Abstract: Positive photoresist compositions comprising, in an organic solvent, at leasta) one alkali-soluble resin,b) one photosensitive quinone diazide,c) one aromatic hydroxy compound of formula I ##STR1## wherein each R is --H, C.sub.1 -C.sub.4 alkyl, C.sub.1 -C.sub.4 alkoxy, --OCH.sub.2 C.sub.6 H.sub.5, --OC.sub.6 H.sub.5 or --COOC.sub.1 -C.sub.4 alkyl, and R.sub.1 and R.sub.2 are each independently of the other H, C.sub.1 -C.sub.4 alkyl, --C.sub.6 H.sub.5 or a cycloaliphatic 5- or 6-membered ring, a is an integer from 0 to 4, and m and n are each independently of the other 0, 1 or 2, which compound enhances the photosensitivity and/or the rate of development, and optionallyd) additional customary modifiers, are eminently suitable for making relief structures.

Abstract: A storage-stable suspension of an epoxy resin hardener and a toughener useful as a molding composition is prepared via a) the addition of an organic solvent to an aqueous emulsion of the toughener when using a water-sensitive hardener, such as a polycarboxylic anhydride, removing the water as an azeotrope by vacuum distillation, then adding the epoxy resin hardener and removing the residual solvent by vacuum distillation, or b) the addition of an aqueous emulsion of the toughener with or without an organic solvent to the epoxy resin hardener when using a water-insensitive hardener such as a polyamine, and removing the water and any organic solvent by vacuum distillation.

Abstract: A process for the production of glycidyl ether of an aliphatic, cycloaliphatic or araliphatic primary or secondary alcohol, comprising:A) reacting epichlorohydrin with a molar excess of the alcohol in the presence of a Lewis acid catalyst; optionallyB) dehydrochlorinating the product so obtained; andC) reacting the product from step A) or B) with a molar excess of epichlorohydrin in the presence of alkali and a phase transfer catalyst, and then isolating the glycidyl ether product so obtained.

Abstract: Bis(4-cyanatophenyl)-1,1-ethane, a low viscosity liquid, which is useful in wet filament winding, resin transfer molding and pultrusion processes is made by reacting cyanogen chloride dissolved in methylisobutylketone with a methylisobutylketone solution of bis(4-hydroxylphenyl)-1,1-ethane and a tertiary amine.

Abstract: Polyimide oligomers are described which comprise the intercondensation product of a monomer mixture comprising (A) at least one aromatic bis(ether anhydride), (B) at least one phenylindane diamine, and (C) at least one end-cap monomer selected from the group consisting of monoanhydrides, acyl halides and amines, wherein each end-cap monomer (C) contains at least one crosslinkable group in the molecule and wherein the phenylindane diamine component (B) is present in the mixture in a stoichiometric excess. The monomers react in a suitable solvent under an inert atmosphere to form polyimide oligomers having a number average molecular weight of from about 1,000 to about 15,000. The polyimide oligomers of the present invention are readily processed to form polyimide matrix resins with high temperature and oxidative stability.

Abstract: Addition of compounds of formula I ##STR1## in which R.sup.1 to R.sup.4 are each hydroxyl or C.sub.1-6 -alkoxy and R.sup.5 to R.sup.10 are each hydrogen or C.sub.1-6 -alkyl,to positive photoresist compositions based on a diazoquinone/novolak resin effectively suppresses stray radiation and halation effects in corresponding photoresist coatings, in particular if these coatings have been applied to highly reflective substrates.

Abstract: Curable compositions based on epoxy resins or a mixture of epoxy resins and polyisocyanates and containing at least one compound of formula I: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5, R.sub.6, R.sub.7, R.sub.8 and R.sub.9 are each independently of one another hydrogen, alkyl, aryl, arylalkyl or halogen, and R.sub.2 together with R.sub.3 and R.sub.5 together with R.sub.6 and R.sub.8 together with R.sub.9 may each also represent a fused benzene ring.The compositions have high reactivity and at the same time good storage stability.

Abstract: A process is provided for the fabrication of orthopaedic aids from a semifinished material which is obtainable from a hardened material based on one or more than one epoxy resin and one or more than one polyamine as essential polymer component, which process includes shaping the hardened material after heating said material to above the glass transition point and cooling it again, to the use of said material for the fabrication of made-to-measure orthopaedic aids and to the orthopaedic aids so obtained.