Patents Assigned to Advanced Interconnect Materials LLC
  • Patent number: 7626665
    Abstract: To provide a highly conductive Cu alloy which is advantageous in that an alloying element added to Cu is first reacted with oxygen contained in a gas atmosphere or solid in contact with the Cu member to form an oxide film which can prevent oxidation of Cu. The copper alloy comprises copper (Cu) containing an inevitable impurity, and an element added to the copper, wherein the added element is capable of being dissolved in the copper in an amount of 0.1 to 20 at. %, wherein the added element has an oxide formation free energy smaller than that of Cu and has a diffusion coefficient in Cu larger than the self-diffusion coefficient of Cu.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: December 1, 2009
    Assignees: Tohoku University, Advanced Interconnect Materials LLC
    Inventor: Junichi Koike
  • Publication number: 20090290116
    Abstract: The present invention includes a liquid crystal display device having an oxide film having high adhesiveness to a substrate to thereby prevent oxidation of a wiring material or the like, and includes, an electrode or a terminal electrode having high conductivity, and a manufacturing method therefor. Consequently, in the present invention, a liquid crystal display device has an electrode terminal of a TFT substrate, wherein the electrode is formed on an insulator and is comprised of a conductive layer mainly consisting of copper and an oxide covering an outer part, further the oxide is a layered structure of transparent electrodes, the layered portion having ohmic contact, and the oxide mainly consists of manganese oxide.
    Type: Application
    Filed: May 29, 2009
    Publication date: November 26, 2009
    Applicants: Tohoku University, Advanced Interconnect Materials, LLC
    Inventors: Junichi Koike, Hideaki Kawakami
  • Publication number: 20090253260
    Abstract: A semiconductor device enables a barrier layer to fully acquire a barriering property against the diffusion of Cu from a wiring main body and the diffusion of Si from an insulating film, enhances the adhesiveness of the barrier layer and the insulating film and excels in reliability of operation over a long period of time. In this invention, a semiconductor device provided on an insulating film with a wiring includes the insulating film containing silicon, a wiring main body formed of copper in a groove-like opening disposed in the insulating film, and a barrier layer formed between the wiring main body and the insulating film and made of an oxide containing Cu and Si and Mn.
    Type: Application
    Filed: March 24, 2009
    Publication date: October 8, 2009
    Applicant: Advanced Interconnect Materials, LLC
    Inventor: Junichi KOIKE
  • Publication number: 20090212432
    Abstract: A semiconductor device enables a barrier layer to fully acquire a barriering property against the diffusion of Cu from a wiring main body and the diffusion of Si from an insulating film, enhances the adhesiveness of the barrier layer and the insulating film and excels in reliability of operation over a long period of time.
    Type: Application
    Filed: February 27, 2007
    Publication date: August 27, 2009
    Applicant: Advanced Interconnect Materials, LLC
    Inventor: Junichi Koike
  • Publication number: 20090095620
    Abstract: A semiconductor device enables a barrier layer to fully acquire a barriering property against the diffusion of Cu from a wiring main body and the diffusion of Si from an insulating film, enhances the adhesiveness of the barrier layer and the insulating film and excels in reliability of operation over a long period of time. In this invention, a semiconductor device provided on an insulating film with a wiring includes the insulating film containing silicon (Si), a wiring main body formed of copper (Cu) in a groove-like opening disposed in the insulating film, and a barrier layer formed between the wiring main body and the insulating film and made of an oxide containing Cu and Si and Mn.
    Type: Application
    Filed: November 20, 2008
    Publication date: April 16, 2009
    Applicant: Advanced Interconnect Materials, LLC
    Inventor: Junichi Koike
  • Publication number: 20080278649
    Abstract: The present invention includes a liquid crystal display device with an oxide film having high adhesiveness to a semiconductor layer or a pixel electrode to thereby prevent oxidation of a wiring material or the like, and includes a source electrode and a drain electrode having high conductivity, and a manufacturing method therefor. In one embodiment of the present invention, a liquid crystal display device has a TFT electrode of a TFT substrate, wherein a source electrode or a drain electrode includes a layer of mainly copper and an oxide covering an outer part of the layer. Further, in the present invention, the semiconductor layer or the pixel electrode and said source electrode or the drain electrode are in ohmic contact in the TFT electrode.
    Type: Application
    Filed: May 9, 2007
    Publication date: November 13, 2008
    Applicants: Tohoku University, Advanced Interconnect Materials, LLC
    Inventors: Junichi Koike, Hideaki Kawakami
  • Publication number: 20080252843
    Abstract: The present invention includes a liquid crystal display device having an oxide film having high adhesiveness to a substrate to thereby prevent oxidation of a wiring material or the like, and includes, an electrode or a terminal electrode having high conductivity, and a manufacturing method therefor. Consequently, in the present invention, a liquid crystal display device has an electrode terminal of a TFT substrate, wherein the electrode is formed on an insulator and is comprised of a conductive layer mainly consisting of copper and an oxide covering an outer part, further the oxide is a layered structure of transparent electrodes, the layered portion having ohmic contact, and the oxide mainly consists of manganese oxide.
    Type: Application
    Filed: April 10, 2007
    Publication date: October 16, 2008
    Applicants: Tohoku University, Advanced Interconnect Materials, LLC
    Inventors: Junichi Koike, Hideaki Kawakami
  • Publication number: 20080170193
    Abstract: The present invention has been made to form an oxide film having high adhesiveness to a substrate to thereby prevent oxidation of a wiring material or the like, and also provide a liquid crystal display device provided with wiring, an electrode or a terminal electrode having high conductivity, and a manufacturing method therefor. Consequently, the present invention, a liquid crystal display device comprising gate wiring or a gate electrode formed on a substrate on a TFT side of the TFT liquid crystal display device, wherein the wiring or the electrode has a structure of being held between two different insulation layers or insulators, and the structure is comprised of a first layer mainly consisting of copper and a second layer consisting of an oxide covering an outer circumferential part of the first layer, further, the second layer has compositional formula of CuXMnYSiZO (0<X<Y, 0<Z<Y).
    Type: Application
    Filed: January 12, 2007
    Publication date: July 17, 2008
    Applicants: Tohoku University, Advanced Interconnect Materials, LLC
    Inventors: Junichi Koike, Hideaki Kawakami