Patents Assigned to ADVANCED MICRO DEVICES (AMD)
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Patent number: 12282776Abstract: Hybrid parallelized tagged geometric (TAGE) branch prediction, including: selecting, based on a branch instruction, a first plurality of counts from at least one TAGE table; selecting, based on the branch instruction, a second plurality of counts from at least one non-TAGE branch prediction table; generating, based on the first plurality of counts and a second plurality of counts; and wherein selecting the first plurality of counts and selecting the second plurality of counts are performed during a same branch prediction pipeline stage.Type: GrantFiled: March 30, 2022Date of Patent: April 22, 2025Assignee: ADVANCED MICRO DEVICES, INC.Inventors: Anthony Jarvis, Thomas Clouqueur
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Patent number: 12276850Abstract: A semiconductor package includes a first mold layer at least partially encasing at least one photonic integrated circuit. A redistribution layer structure is fabricated on the first mold layer, the redistribution layer structure including dielectric material and conductive structures. A second mold layer at least partially encasing at least one semiconductor chip is fabricated on the redistribution layer structure. The redistribution layer structure provides electrical pathways between the at least one semiconductor chip and the at least one photonic integrated circuit. One or more voids are defined in the second mold layer in an area above an optical interface of the at least one photonic integrated circuit such that light is transmittable through dielectric material above the optical interface.Type: GrantFiled: July 24, 2023Date of Patent: April 15, 2025Assignee: ADVANCED MICRO DEVICES, INC.Inventors: Brett P. Wilkerson, Raja Swaminathan, Kong Toon Ng, Rahul Agarwal
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Patent number: 12271318Abstract: Method and apparatus monitor eviction conflicts among cache directory entries in a cache directory and produce cache directory victim entry information for a memory manager. In some examples, the memory manager reduces future cache directory conflicts by changing a page level physical address assignment for a page of memory based on the produced cache directory victim entry information. In some examples, a scalable data fabric includes hardware control logic that performs the monitoring of the eviction conflicts among cache directory entries in the cache directory and produces the cache directory victim entry information.Type: GrantFiled: December 28, 2020Date of Patent: April 8, 2025Assignee: ADVANCED MICRO DEVICES, INC.Inventors: Brandon K. Potter, Marko Scrbak, Sergey Blagodurov, Kishore Punniyamurthy, Nathaniel Morris
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Patent number: 12266585Abstract: Various semiconductor chip devices with stacked chips are disclosed. In one aspect, a semiconductor chip device is provided. The semiconductor chip device includes a first semiconductor chip that has a floor plan with a high heat producing area and a low heat producing area. At least one second semiconductor chip is stacked on the low heat producing area. The semiconductor chip device also includes means for transferring heat from the high heat producing area.Type: GrantFiled: November 2, 2021Date of Patent: April 1, 2025Assignee: ADVANCED MICRO DEVICES, INC.Inventors: John Wuu, Samuel Naffziger, Patrick J. Shyvers, Milind S. Bhagavat, Kaushik Mysore, Brett P. Wilkerson
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Patent number: 12265441Abstract: Graphics processing unit (GPU) selection based on a utilized power source, including: determining that an apparatus is using a direct current (DC) power source instead of an Alternating Current (AC) power source; and causing, in response to the apparatus using the DC power source, the apparatus to preferentially utilize an integrated graphics processing unit (iGPU) over a discrete graphics processing unit (dGPU) while using the DC power source.Type: GrantFiled: March 31, 2021Date of Patent: April 1, 2025Assignees: ADVANCED MICRO DEVICES, INC., ATI TECHNOLOGIES ULCInventors: Dmitri Tikhostoup, Vladimir Giemborek, William Herz
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Patent number: 12266611Abstract: A semiconductor module includes two or more semiconductor dies and an interconnect structure coupled to the two or more semiconductor dies. The interconnect structure implements a plurality of die-to-die connection pathways having a first density and a plurality of fan-out redistribution pathways having a second density that is different from the first density.Type: GrantFiled: October 30, 2020Date of Patent: April 1, 2025Assignee: ADVANCED MICRO DEVICES, INC.Inventors: Rahul Agarwal, Brett P. Wilkerson, Raja Swaminathan
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Patent number: 12260225Abstract: A system for providing system level sleep state power savings includes a plurality of memory channels and corresponding plurality of memories coupled to respective memory channels. The system includes one or more processors operative to receive information indicating that a system level sleep state is to be entered and in response to receiving the system level sleep indication, moves data stored in at least a first of the plurality of memories to at least a second of the plurality of memories. In some implementations, in response to moving the data to the second memory, the processor causes power management logic to shut off power to: at least the first memory, to a corresponding first physical layer device operatively coupled to the first memory and to a first memory controller operatively coupled to the first memory and place the second memory in a self-refresh mode of operation.Type: GrantFiled: September 13, 2022Date of Patent: March 25, 2025Assignee: ADVANCED MICRO DEVICES, INC.Inventors: Jyoti Raheja, Hideki Kanayama, Guhan Krishnan, Ruihua Peng
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Patent number: 12253961Abstract: Staging memory access requests includes receiving a memory access request directed to Dynamic Random Access Memory; storing the memory access request in a staging buffer; and moving the memory access request from the staging buffer to a command queue.Type: GrantFiled: December 27, 2019Date of Patent: March 18, 2025Assignee: ADVANCED MICRO DEVICES, INC.Inventors: James R. Magro, Kedarnath Balakrishnan, Ravindra N. Bhargava, Guanhao Shen
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Patent number: 12249519Abstract: Various semiconductor chip packages are disclosed. In one aspect, a semiconductor chip package includes a package substrate that has a first side and a second side opposite to the first side. A semiconductor chip is mounted on the first side. Plural metal anchor structures are coupled to the package substrate and project away from the first side. A molding layer is on the package substrate and at least partially encapsulates the semiconductor chip and the anchor structures. The anchor structures terminate in the molding layer and anchor the molding layer to the package substrate.Type: GrantFiled: June 17, 2022Date of Patent: March 11, 2025Assignee: ADVANCED MICRO DEVICES, INC.Inventors: Priyal Shah, Milind S. Bhagavat, Brett P. Wilkerson, Lei Fu, Rahul Agarwal
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Patent number: 12248423Abstract: An apparatus includes logic circuitry that selects a retag transaction identifier for an original transaction identifier of an incoming transaction request, based on a plurality of sub-groups of retag tracking data. Each sub-group of retag tracking data is associated with a corresponding sub-group of retag transaction identifiers in a group of retag transaction identifiers. The logic circuitry retags the incoming transaction request with the selected retag transaction identifier (ID) by replacing the original transaction identifier associated with the incoming transaction request and sends the retagged incoming transaction request to a target. A returned response is received from the target. The retag transaction ID in the returned response is removed and replaced with the original transaction ID before being sent as a reply to the requesting unit. Associated methods are also presented.Type: GrantFiled: February 2, 2023Date of Patent: March 11, 2025Assignees: ADVANCED MICRO DEVICES, INC., ATI TECHNOLOGIES ULCInventors: Buheng Xu, Dong Yu, Philip Ng, Lianji Cheng
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Patent number: 12250493Abstract: Machine learning-based multi-view video conferencing from single view video data, including: identifying, in video data, a plurality of objects; and generating a user interface comprising a plurality of first user interface elements each comprising a portion of the video data corresponding to one or more of the plurality of objects.Type: GrantFiled: May 25, 2023Date of Patent: March 11, 2025Assignee: ADVANCED MICRO DEVICES, INC.Inventor: Roto Le
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Patent number: 12243576Abstract: A method for performing stutter of dynamic random access memory (DRAM) where a system on a chip (SOC) initiates bursts of requests to the DRAM to fill buffers to allow the DRAM to self-refresh is disclosed. The method includes issuing, by a system management unit (SMU), a ForceZQCal command to the memory controller to initiate the stutter procedure in response to receiving a timeout request, such as an SMU ZQCal timeout request, periodically issuing a power platform threshold (PPT) request, by the SMU, to the memory controller, and sending a ForceZQCal command prior to a PPT request to ensure re-training occurs after ZQ Calibration. The ForceZQCal command issued prior to PPT request may reduce the latency of the stutter. The method may further include issuing a ForceZQCal command prior to each periodic re-training.Type: GrantFiled: May 17, 2023Date of Patent: March 4, 2025Assignee: ADVANCED MICRO DEVICES, INC.Inventors: Jing Wang, Kedarnath Balakrishnan, Kevin M. Brandl, James R. Magro
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Patent number: 12238872Abstract: Various circuit boards and methods of fabricating and using the same are disclosed. In one aspect, a circuit board is provided that has a substrate with a pocket and a conductor layer. A chiplet is positioned in the pocket. The chiplet has plural bottom side interconnects electrically connected to the conductor layer and plural top side interconnects adapted to interconnect with two or more semiconductor chips.Type: GrantFiled: February 8, 2022Date of Patent: February 25, 2025Assignee: ADVANCED MICRO DEVICES, INC.Inventor: Robert N. McLellan
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Patent number: 12237286Abstract: A semiconductor package for high-speed die connections using a conductive insert, the semiconductor package comprising: a die; a plurality of redistribution layers; a conductive insert housed in a perforation through the plurality of redistribution layers; and a conductive bump conductively coupled to an input/output (I/O) connection point of the die via the conductive insert.Type: GrantFiled: August 25, 2023Date of Patent: February 25, 2025Assignee: ADVANCED MICRO DEVICES, INC.Inventor: Rahul Agarwal
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Patent number: 12223324Abstract: A data processing system includes a vector data processing unit that includes a shared scheduler queue configured to store in a same queue, at least one entry that includes at least a mask type instruction and another entry that includes at least a vector type instruction. Shared pipeline control logic controls a vector data path or a mask data path, based a type of instruction picked from the same queue. In some examples, at least one mask type instruction and the at least one vector type instruction each include a source operand having a corresponding shared source register bit field that indexes into both a mask register file and a vector register file. The shared pipeline control logic uses a mask register file or a vector register file depending on whether bits of the shared source register bit field identify a mask source register or a vector source register.Type: GrantFiled: September 30, 2022Date of Patent: February 11, 2025Assignee: ADVANCED MICRO DEVICES, INC.Inventors: Michael Estlick, Eric Dixon, Theodore Carlson, Erik D. Swanson
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Patent number: 12216162Abstract: A system for performing a scan test of a processor core includes a scan test module and a processor including a processor core and an input/output die, where the input/output die is coupled to the processor core. The scan test module transmits, in parallel to the input/output die, scan test input data. A serializer/deserializer module of the input/output die receives the input data, serializes the input data, and transmits the serialized input data to the processor core. A serializer/deserializer module of the processor core receives the serialized scan test input data, deserializes the input data, receives result data generated in dependence upon the input data, serializes the result data, and transmits the serialized result data to the input/output die. The input/output die serializer/deserializer module receives the result data, deserializes the result data, and provides the result data to the scan test module. Error detection can be carried out through redundancy.Type: GrantFiled: August 3, 2023Date of Patent: February 4, 2025Assignee: ADVANCED MICRO DEVICES, INC.Inventors: Ahmet Tokuz, Saurabh B. Upadhyay
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Patent number: 12210891Abstract: A processing system includes physical function circuitry to execute virtual functions and a processing unit configured to operate in a first mode that allows more than one virtual function to execute on the physical function circuitry and a second mode that constrains the physical function circuitry to executing a single virtual function. A first virtual function modifies a state of the processing unit in response to the processing unit being in the second mode. A host driver executing on the processing unit modifies an operating mode indicator to indicate that the processing unit is operating in the first mode or to indicate that the processing unit is operating in the second mode. Microcode executing on the processing unit accesses the operating mode indicator to determine whether the processing unit is operating in the first mode or the second mode.Type: GrantFiled: December 18, 2020Date of Patent: January 28, 2025Assignees: ADVANCED MICRO DEVICES (SHANGHAI) CO., LTD., ATI TECHNOLOGIES ULCInventors: Yinan Jiang, ZhenYu Min, WenWen Tang
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Patent number: 12210465Abstract: An electronic device includes a processor that executes one or more guest operating systems and an input-output memory management unit (IOMMU). The IOMMU accesses, for/on behalf of each guest operating system among the one or more guest operating systems, IOMMU memory-mapped input-output (MMIO) registers in a separate copy of a set of IOMMU MMIO registers for that guest operating system.Type: GrantFiled: January 11, 2021Date of Patent: January 28, 2025Assignees: ADVANCED MICRO DEVICES, INC., ATI Technologies ULCInventors: Maggie Chan, Philip Ng, Paul Blinzer
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Patent number: 12204935Abstract: Methods, systems, and apparatuses provide support for allowing thread forward progress in a processing system and that improves quality of service. One system includes a processor; a bus coupled to the processor; a memory coupled to the processor via the bus; and a floating point unit coupled to the processor via the bus, wherein floating point unit comprises hardware control logic operative to: store for each thread, by a scheduler of the floating point unit, a counter; increase, by the scheduler, a value of the counter for each thread corresponding to a thread when at least one source ready operation exist for the thread; compare, by the scheduler, the value of the counter to a predetermined threshold; and make other threads ineligible to be picked by the scheduler when the counter is greater than or equal to the predetermined threshold.Type: GrantFiled: July 30, 2021Date of Patent: January 21, 2025Assignee: ADVANCED MICRO DEVICES, INC.Inventors: Michael Estlick, Erik Swanson, Eric Dixon
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Patent number: 12204774Abstract: An apparatus includes a memory controller that includes logic to receive a first memory request having a first request type and a second memory request having a second request type. The apparatus also includes a scheduling unit that includes logic to schedule an order of the first and second memory requests for execution based upon a first parameter value and a second parameter value. The first parameter value corresponds to a utility and energy cost for the first memory request and the second parameter value corresponds to a utility and energy cost for the second memory request.Type: GrantFiled: November 14, 2022Date of Patent: January 21, 2025Assignee: ADVANCED MICRO DEVICES, INC.Inventors: Alexandru Dutu, Nuwan Jayasena, Yasuko Eckert, Niti Madan, Sooraj Puthoor