Abstract: Restricting peripheral device protocols in confidential compute architectures, the method including: receiving a first address translation request from a peripheral device supporting a first protocol, wherein the first protocol supports cache coherency between the peripheral device and a processor cache; determining that a confidential compute architecture is enabled; and providing, in response to the first address translation request, a response including an indication to the peripheral device to not use the first protocol.

Abstract: A computing device chassis for a common cooling solution for die packages comprising: a chassis base comprising: an internal cavity; a cooling element housed in the internal cavity; and one or more thermal interfaces to the cooling element.

Abstract: Methods and apparatuses control electrical current supplied to a plurality of processing units in a multi-processor system. A plurality of current usage information corresponding to the processing units are received by a controller to determine a threshold current for each of the processing units. The controller determines a frequency reduction action and an instructions-per-cycle (IPC) reduction action for the each of the processing units based on the threshold current and regulates operations of the processing units based on the determined frequency and IPC reduction actions.

Abstract: Various semiconductor chips and chip stack arrangements are disclosed. In one aspect, a semiconductor chip stack is provided that includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first semiconductor chip includes a first logic layer and a first semiconductor layer on the first logic layer. The first semiconductor layer has plural first through-silicon transistors operable to selectively control the transmission of data from the first semiconductor chip to the second semiconductor chip and has plural first through-silicon vias to convey control signals to the second semiconductor chip.

Abstract: Methods and apparatuses control the clock rate of a processing unit. The methods and apparatus control the clock rate by generating an output clock rate based on the determined frequency adjustment such that the processing unit maintains the overclocking. The methods include: receiving an analog voltage supply in response to detecting overclocking in the processing unit; dynamically sensing measurements of an output voltage from a voltage generator based on the received analog voltage supply; determining characteristics of a voltage droop in the output voltage based on the dynamically sensed output voltage measurements; determining a frequency adjustment for the clock rate of the processing unit based on the determined characteristics of the voltage droop; and generating an output clock rate based on the determined frequency adjustment such that the processing unit maintains the overclocking.

Abstract: Various circuit boards with mounted passive components and method of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes at least partially encapsulating a first plurality of passive components in a molding material to create a first molded passive component group. The first molded passive component group is mounted on a surface of a circuit board. The first plurality of passive components are electrically connected to the circuit board.

Abstract: A semiconductor package includes a first die, a second die, and an interconnect die coupled to a first plurality of through-die vias in the first die and a second plurality of through-die vias in the second die. The interconnect die provides communications pathways the first die and the second die.

Abstract: Various methods an apparatus to use facial recognition in a computing device are disclosed. In one aspect, a method of controlling a component of a computing device is provided. The method includes taking an IR image of a user and a background with an IR sensor of a computing device. The computing device is in a location. The IR image is segmented into user image data and background image data. An ambient temperature of the location is determined using the background image data. An aspect of the component is controlled based on the ambient temperature.

Abstract: Error handling for resilient software includes: receiving data indicating a region of resilient memory; detecting an error associated with a region of memory; and preventing raising an exception for the error in response to the region of memory falling within the region of resilient memory by preventing the region of memory as being identified as including the error.

Abstract: Various chip stacks and methods and structures of interconnecting the same are disclosed. In one aspect, an apparatus is provided that includes a first semiconductor chip that has a first glass layer and plural first groups of plural conductor pads in the first glass layer. Each of the plural first groups of conductor pads is configured to bumplessly connect to a corresponding second group of plural conductor pads of a second semiconductor chip to make up a first interconnect of a plurality interconnects that connect the first semiconductor chip to the second semiconductor chip. The first glass layer is configured to bond to a second glass layer of the second semiconductor chip.

Abstract: Methods and apparatuses to control digital data transfer via a memory channel between a memory module and a processor are disclosed. At least one of the memory module or the processor coalesces a plurality of short data words into multicast coalesced block data comprising a single data block for transfer via the memory channel. Each of the plurality of short data words pertains to one of at least two partitioned memory submodules in the memory module. The multicast coalesced block data is communicated over the memory channel.

Abstract: Approaches are provided for implementing hardware-software collaborative address mapping schemes that enable mapping data elements which are accessed together in the same row of one bank or over the same rows of different banks to achieve higher performance by reducing row conflicts. Using an intra-bank frame striping policy (IBFS), corresponding subsets of data elements are interleaved into a single row of a bank. Using an intra-channel frame striping policy (ICFS), corresponding subsets of data elements are interleaved into a single channel row of a channel. A memory controller utilizes ICFS and/or IBFS to efficiently store and access data elements in memory, such as processing-in-memory (PIM) enabled memory.

Abstract: A method and apparatus controls power management of a graphics processing core when multiple virtual machines are allocated to the graphics processing core on a much finer-grain level than conventional systems. In one example, the method and apparatus processes a plurality of virtual machine power control setting requests to determine a power control request for a power management unit of a graphics processing core. The method and apparatus then controls power levels of the graphics processing core with the power management unit based on the determined power control request.

Abstract: A socket actuation mechanism for package insertion and package-socket alignment, including: a socket frame comprising a plurality of first hinge portions; a carrier frame comprising: a center portion comprising one or more package interlocks; and a tab extending from a first end of the carrier frame, the tab comprising a second hinge portion couplable with the plurality of first hinge portions to form a hinge coupling the carrier frame to the socket frame.

Abstract: One or more processors are operative to carry out neural network operations and include a plurality of compute units (CUs) configurable for neural network operations. The neural network compute unit remapping logic detects a condition to remap neural network compute units that are currently used in carrying out a neural network operation in a processor with at least one replacement compute unit that is not currently being used to carry out the neural network operation. In response to detecting the condition, the logic remaps a logical address of at least one currently used compute unit to a different physical address that corresponds to the replacement compute unit and causes the replacement compute unit to carry out neural network operations.

Abstract: A system for performing a scan test of a processor core includes a scan test module and a processor including a processor core and an input/output die, where the input/output die is coupled to the processor core. The scan test module transmits, in parallel to the input/output die, scan test input data. A serializer/deserializer module of the input/output die receives the input data, serializes the input data, and transmits the serialized input data to the processor core. A serializer/deserializer module of the processor core receives the serialized scan test input data, deserializes the input data, receives result data generated in dependence upon the input data, serializes the result data, and transmits the serialized result data to the input/output die. The input/output die serializer/deserializer module receives the result data, deserializes the result data, and provides the result data to the scan test module. Error detection can be carried out through redundancy.

Abstract: A semiconductor package for high-speed die connections using a conductive insert, the semiconductor package comprising: a die; a plurality of redistribution layers; a conductive insert housed in a perforation through the plurality of redistribution layers; and a conductive bump conductively coupled to an input/output (I/O) connection point of the die via the conductive insert.

Abstract: Various circuit board embodiments are disclosed. In one aspect, an apparatus is provided that includes a circuit board and a first phase change material pocket positioned on or in the circuit board and contacting a surface of the circuit board.

Abstract: Exemplary embodiments provide wear spreading among die regions (i.e., one or more circuits) in an integrated circuit or among dies by using operating condition data in addition to or instead of environmental data such as temperature data, from each of a plurality of die regions. Control logic produces a cumulative amount of time each of the plurality of die regions has spent at an operating condition based on operating condition data wherein the operating condition data is based on at least one of the following operating characteristics: frequency of operation of the plurality of die regions, an operating voltage of the plurality of die regions, an activity level of the plurality of die regions, a timing margin of the plurality of die regions, and a number of detected faults of the plurality of die regions. The method and apparatus spreads wear among the plurality of same type of die regions by controlling task execution among the plurality of die regions using the die wear-out data.

Abstract: Various semiconductor chip packages are disclosed. In one aspect, a semiconductor chip package is provided that includes a fan-out redistribution layer (RDL) structure that has plural stacked polymer layers, plural metallization layers, plural conductive vias interconnecting adjacent metallization layers of the metallization layers, and plural rivets configured to resist delamination of one or more of the polymer layers. Each of the plural rivets includes a first head, a second head and a shank connected between the first head and the second head. The first head is part of one of the metallization layers. The shank includes at least one of the conductive vias and at least one part of another of the metallization layers.