Patents Assigned to ADVANCED MICRO DEVICES (AMD)
  • Patent number: 11955447
    Abstract: In an implementation, a semiconductor chip includes a device layer, an interconnect layer fabricated on the device layer, the interconnect layer including a conductive pad, and a conductive pillar coupled to the conductive pad. The conductive pillar includes at least a first portion having a first width and a second portion having a second width, the first portion being disposed between the second portion and the conductive pad, wherein the first width of the first portion is greater than the second width of the second portion.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: April 9, 2024
    Assignees: ADVANCED MICRO DEVICES, INC., ATI TECHNOOGIES ULC
    Inventors: Suming Hu, Farshad Ghahghahi
  • Patent number: 11947455
    Abstract: Disclosed is a system and method for use in a cache for suppressing modification of cache line. The system and method includes a processor and a memory operating cooperatively with a cache controller. The memory includes a coherence directory stored within a cache created to track at least one cache line in the cache via the cache controller. The processor instructs a cache controller to store a first data in a cache line in the cache. The cache controller tags the cache line based on the first data. The processor instructs the cache controller to store a second data in the cache line in the cache causing eviction of the first data from the cache line. The processor compares based on the tagging the first data and the second data and suppresses modification of the cache line based on the comparing of the first data and the second data.
    Type: Grant
    Filed: April 17, 2023
    Date of Patent: April 2, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventor: Paul J. Moyer
  • Patent number: 11934764
    Abstract: Manufacturing a semiconductor chip based on redefining tolerance rules to create an otherwise prohibited structure including redefining a tolerance rule to permit creation of a minimum area metal trench structure violating the tolerance rule during a routing operation; and fabricating the minimum area metal trench structure on the semiconductor substrate based on the redefined tolerance rule.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: March 19, 2024
    Assignees: ADVANCED MICRO DEVICES, INC., ATI TECHNOLOGIES ULC
    Inventors: Richard Schultz, Wenyi Yin, Tanmoy Saha
  • Patent number: 11934827
    Abstract: An apparatus that manages multi-process execution in a processing-in-memory (“PIM”) device includes a gatekeeper configured to: receive an identification of one or more registered PIM processes; receive, from a process, a memory request that includes a PIM command; if the requesting process is a registered PIM process and another registered PIM process is active on the PIM device, perform a context switch of PIM state between the registered PIM processes; and issue the PIM command of the requesting process to the PIM device.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: March 19, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Sooraj Puthoor, Muhammad Amber Hassaan, Ashwin Aji, Michael L. Chu, Nuwan Jayasena
  • Patent number: 11934698
    Abstract: Process isolation for a PIM device through exclusive locking includes receiving, from a process, a call requesting ownership of a PIM device. The request includes one or more PIM configuration parameters. The exclusive locking technique also includes granting the process ownership of the PIM device responsive to determining that ownership is available. The PIM device is configured according to the PIM configuration parameters.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: March 19, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Sooraj Puthoor, Muhammad Amber Hassaan, Ashwin Aji, Michael L. Chu, Nuwan Jayasena
  • Patent number: 11921634
    Abstract: Leveraging processing-in-memory (PIM) resources to expedite non-PIM instructions executed on a host is disclosed. In an implementation, a memory controller identifies a first write instruction to write first data to a first memory location, where the first write instruction is not a processing-in-memory (PIM) instruction. The memory controller then writes the first data to a first PIM register. Opportunistically, the memory controller moves the first data from the first PIM register to the first memory location. In another implementation, a memory controller identifies a first memory location associated with a first read instruction, where the first read instruction is not a processing-in-memory (PIM) instruction. The memory controller identifies that a PIM register is associated with the first memory location. The memory controller then reads, in response to the first read instruction, first data from the PIM register.
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: March 5, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Jagadish B. Kotra, John Kalamatianos, Yasuko Eckert, Yonghae Kim
  • Patent number: 11917794
    Abstract: Separating temperature domains in cooled systems, including: cooling at least one first component of a circuit board using a first cooling system; and conductively coupling the at least one first component to at least one second component using a superconductive portion of a power plane of the circuit board.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: February 27, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Andrew G. Kegel, Jeffrey Bialozor
  • Patent number: 11911839
    Abstract: A semiconductor device includes a first die, the first die including a first dielectric layer and a plurality of first bond pads formed within apertures in the first dielectric layer, and a second die bonded to the first die, the second die including a second dielectric layer and a plurality of second bond pads protruding from the second dielectric layer. The first die is bonded to the second die such that the plurality of second bond pads protrude into the apertures in the first dielectric layer to establish respective metallurgical bonds with the plurality of first bond pads. A reduction in the distance between the respective bond pads of the dies results in a lower temperature for establishing a hybrid bond.
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: February 27, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Priyal Shah, Rahul Agarwal, Raja Swaminathan, Brett P. Wilkerson
  • Patent number: 11914517
    Abstract: Methods and apparatus provide monitoring of memory access traffic in a data processing system by tracking, such as by data fabric hardware control logic, a number of cache line accesses to a page of memory associated with one or more memory devices, and producing spike indication data that indicates a spike in cache line accesses to a given page of memory. Pages are moved from a slower memory to a faster memory based on the spike indication data. In some implementations, the tracking is done by updating a cache directory with data representing the tracked number of cache line accesses.
    Type: Grant
    Filed: November 11, 2020
    Date of Patent: February 27, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Sergey Blagodurov, Marko Scrbak, Brandon K. Potter
  • Patent number: 11907070
    Abstract: An integrated circuit includes one or more processing units that execute instructions that employ a register file, control logic creates a pre-startup register free list, prior to normal operation of at least one of the processing units, that includes a list of registers devoid of defective registers. In some implementations, no column and row repair information is provided to register file repair logic. In certain examples, the register file is configured as a repair-less register file. During normal operation of the one or more processing units, the integrated circuit employs the pre-startup register free list to select registers in a register file for the executing instructions. Associated methods are also presented.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: February 20, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Eric Busta, Michael L. Golden, Sean M. O′Mullan, James Wingfield, Keith A. Kasprak, Russell Schreiber, Michael Estlick
  • Patent number: 11902571
    Abstract: Region of interest (ROI)-based upscaling for video conferences, the method including: identifying, in a video frame of a video conference at a first resolution, a boundary region for an object; applying, to a portion of the video frame bound by the boundary region, a machine learning upscaling algorithm to generate an upscaled portion of the video frame corresponding to a second resolution; and generating an upscaled video frame at the second resolution by combining a first plurality of pixels in the upscaled portion of the video frame corresponding to the object with a second plurality of pixels.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: February 13, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventor: Roto Le
  • Patent number: 11899642
    Abstract: A method and apparatus perform a first hash operation on a first key wherein the first hash operation is biased to map the first key and associated value to a set of frequently-accessed buckets in a hash table. An entry for the first key and associated value is stored in the set of frequently-accessed buckets. A second hash operation is performed on a second key wherein the second hash operation is biased to map the second key and associated value to a set of less frequently-accessed buckets in the hash table. An entry for the second key and associated value is stored in the set of less frequently-accessed buckets. The method and apparatus perform a hash table look up of the requested key in the set of frequently-accessed buckets, if the requested key is not found, then a hash table lookup is performed in the set of less frequently-accessed buckets.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: February 13, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventor: Nuwan Jayasena
  • Patent number: 11900161
    Abstract: Memory allocation for processing-in-memory operations, including: receiving, by an allocation module, a memory allocation request indicating a plurality of data structure operands for a processing-in-memory operation; determining a memory allocation pattern for the plurality of data structure operands, wherein the memory allocation pattern interleaves a plurality of component pages of a memory page across the plurality of data structure operands; and allocating the memory page based on the determined memory allocation pattern.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: February 13, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Anirban Nag, Nuwan Jayasena, Shaizeen Aga
  • Patent number: 11886370
    Abstract: A semiconductor package includes multiple dies that share the same package pin. An output enable register provided on each die is used to select the die that drives an output to the shared pin. A hardware arbitration circuit ensures that two or more dies do not drive an output to the shared pin at the same time.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: January 30, 2024
    Assignees: ADVANCED MICRO DEVICES, INC., ATI TECHNOLOGIES ULO
    Inventors: Yulei Shen, Tyrone Tung Huang, Chen-Kuan Hong
  • Patent number: 11880248
    Abstract: A docking station for secondary external cooling for mobile computing devices, including: one or more ports for docking a mobile computing device; a docking platform for supporting the mobile computing device; a cooling element; and a thermal interface housed in the docking platform for transferring heat between the mobile computing device and the cooling element.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: January 23, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Christopher M. Jaggers, Christopher M. Helberg
  • Patent number: 11880277
    Abstract: Selecting an error correction code type for a memory device includes: selecting, by the memory device in dependence upon predefined selection criteria, one of a plurality of error correction code types and carrying out memory access requests utilizing the selected error correction code type.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: January 23, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Sudhanva Gurumurthi, Vilas Sridharan
  • Patent number: 11875425
    Abstract: Implementing heterogeneous wavefronts on a graphics processing unit (GPU) is disclosed. A scheduler assigns heterogeneous wavefronts for execution on a compute unit of a processing device. The heterogeneous wavefronts include different types of wavefronts such as vector compute wavefronts and service-level wavefronts that vary in resource requirements and instruction sets. As one example, heterogeneous wavefronts may include scalar wavefronts and vector compute wavefronts that execute on scalar units and vector units, respectively. Distinct sets of instructions are executed for the heterogeneous wavefronts on the compute unit. Heterogeneous wavefronts are processed in the same pipeline of the processing device.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: January 16, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Sooraj Puthoor, Bradford Beckmann, Nuwan Jayasena, Anthony Gutierrez
  • Patent number: 11876718
    Abstract: Graded throttling for network-on-chip traffic, including: calculating, by an agent of a network-on-chip, a number of outstanding transactions issued by the agent; determining that the number of outstanding transactions meets a threshold; and implementing, by the agent, in response to the number of outstanding transactions meeting the threshold, a traffic throttling policy.
    Type: Grant
    Filed: October 6, 2022
    Date of Patent: January 16, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventor: Narendra Kamat
  • Patent number: 11868777
    Abstract: Processor-guided execution of offloaded instructions using fixed function operations is disclosed. Instructions designated for remote execution by a target device are received by a processor. Each instruction includes, as an operand, a target register in the target device. The target register may be an architected virtual register. For each of the plurality of instructions, the processor transmits an offload request in the order that the instructions are received. The offload request includes the instruction designated for remote execution. The target device may be, for example, a processing-in-memory device or an accelerator coupled to a memory.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: January 9, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: John Kalamatianos, Michael T. Clark, Marius Evers, William L. Walker, Paul Moyer, Jay Fleischman, Jagadish B. Kotra
  • Patent number: 11868778
    Abstract: Compacted addressing for transaction layer packets, including: determining, for a first epoch, one or more low entropy address bits in a plurality of first transaction layer packets; removing, from one or more memory addresses of one or more second transaction layer packets, the one or more low entropy address bits; and sending the one or more second transaction layer packets.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: January 9, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Ganesh Dasika, Sergey Blagodurov, Seyedmohammad Seyedzadehdelcheh