Patents Assigned to ADVANCED MICRO DEVICES (AMD)
  • Patent number: 10943880
    Abstract: Various semiconductor chips and packages are disclosed. In one aspect, an apparatus is provided that includes a semiconductor chip that has a side, and plural conductive pillars on the side. Each of the conductive pillars includes a pillar portion that has an exposed shoulder facing away from the semiconductor chip. The shoulder provides a wetting surface to attract melted solder. The pillar portion has a first lateral dimension at the shoulder. A solder cap is positioned on the pillar portion. The solder cap has a second lateral dimension smaller than the first lateral dimension.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: March 9, 2021
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Priyal Shah, Milind S. Bhagavat, Lei Fu
  • Patent number: 10944422
    Abstract: Entropy agnostic data encoding includes: receiving, by an encoder, input data including a bit string; generating a plurality of candidate codewords, including encoding the input data bit string with a plurality of binary vectors, wherein the plurality of binary vectors includes a set of deterministic biased binary vectors and a set of random binary vectors; selecting, in dependence upon a predefined criteria, one of the plurality of candidate codewords; and transmitting the selected candidate codeword to a decoder.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: March 9, 2021
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Seyedmohammad Seyedzadehdelcheh, Shomit N. Das
  • Patent number: 10943391
    Abstract: Accesses to a mipmap by a shader in a graphics pipeline are monitored. The mipmap is stored in a memory or cache associated with the shader and the mipmap represents a texture at a hierarchy of levels of detail. A footprint in the mipmap of the texture is marked based on the monitored accesses. The footprint indicates, on a per-tile, per-level-of-detail (LOD) basis, tiles of the mipmap that are expected to be accessed in subsequent shader operations. In some cases, the footprint is defined by a plurality of footprint indicators that indicate whether the tiles of the mipmap are expected to be accessed in subsequent shader operations. In that case, the plurality of footprint indicators are set to a first value to indicate that the tile was not access during the first frame or a second value to indicate that the tile was accessed during the first frame.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: March 9, 2021
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventor: Christopher J. Brennan
  • Patent number: 10944693
    Abstract: A system is described that includes an integrated circuit chip having a network-on-chip. The network-on-chip includes multiple routers arranged in a topology and a separate communication link coupled between each router and each of one or more neighboring routers of that router among the multiple routers in the topology. The integrated circuit chip also includes multiple nodes, each node coupled to a router of the multiple routers. When operating, a given router of the multiple routers keeps a record of operating states of some or all of the multiple routers and corresponding communication links. The given router then routes flits to destination nodes via one or more other routers of the multiple routers based at least in part on the operating states of the some or all of the multiple routers and the corresponding communication links.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: March 9, 2021
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Srikant Bharadwaj, Shomit N. Das
  • Patent number: 10938559
    Abstract: Security key identifier remapping includes associating a system-level security key identifier to a local-level identifier requiring fewer bits of storage space. The remapped security key identifiers are used to receive, at a first compute complex of a processing system, a memory access request including a memory address value and a system-level security key identifier. The compute complex responds to the memory access request based on a determination of whether a security key identifier map of the first compute complex includes a mapping of the system-level security key identifier to a local-level security key identifier. In response to determining that the security key identifier map of the first compute complex does not include a mapping of the system-level security key identifier to the local-level security key identifier, a cache miss message may be returned without probing caches of the first compute complex.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: March 2, 2021
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventor: Douglas Benson Hunt
  • Patent number: 10936533
    Abstract: Methods, devices, and systems for transmitting data over a computer communications network are disclosed. A queue of communications commands can be pre-generated using a central processing unit (CPU) and stored in a device memory of a network interface controller (NIC). Thereafter, if a graphics processing unit (GPU) has data to communicate to a remote GPU, it can store the data in a send buffer, where the location in the buffer is pointed to by a pre-generated command. The GPU can then signal to the interface device that the data is ready, triggering execution of the pre-generated command to send the data.
    Type: Grant
    Filed: October 18, 2016
    Date of Patent: March 2, 2021
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Michael W. LeBeane, Steven K. Reinhardt
  • Patent number: 10937755
    Abstract: Various chip stacks and methods and structures of interconnecting the same are disclosed. In one aspect, an apparatus is provided that includes a first semiconductor chip that has a first glass layer and plural first groups of plural conductor pads in the first glass layer. Each of the plural first groups of conductor pads is configured to bumplessly connect to a corresponding second group of plural conductor pads of a second semiconductor chip to make up a first interconnect of a plurality interconnects that connect the first semiconductor chip to the second semiconductor chip. The first glass layer is configured to bond to a second glass layer of the second semiconductor chip.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: March 2, 2021
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Priyal Shah, Milind S. Bhagavat
  • Patent number: 10929141
    Abstract: A state of a first architectural register in a processing system is changed from a first state to a second state that indicates that the first architectural register is to be monitored during speculative execution. A second architectural register in the processing system is associated with a third state in response to the first architectural register being a source register for a memory load instruction that loads data from a memory into the second architectural register during speculative execution. Use of data in the second architectural register is constrained during speculative operations while the second architectural register is in the third state. In some cases, a “set taint” instruction is executed to change the state of the first architectural register from the first state to the second state.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: February 23, 2021
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: David Kaplan, Marius Evers
  • Patent number: 10930621
    Abstract: Various die stacks and methods of creating the same are disclosed. In one aspect, a method of manufacturing is provided that includes mounting a first semiconductor die on a second semiconductor die of a first semiconductor wafer. The second semiconductor die is singulated from the first semiconductor wafer to yield a first die stack. The second semiconductor die of the first die stack is mounted on a third semiconductor die of a second semiconductor wafer. The third semiconductor die is singulated from the second semiconductor wafer to yield a second die stack. The second die stack is mounted on a fourth semiconductor die of a third semiconductor wafer.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: February 23, 2021
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Rahul Agarwal, Milind S. Bhagavat
  • Patent number: 10923430
    Abstract: Various multi-die arrangements and methods of manufacturing the same are disclosed. In one aspect, a semiconductor chip device is provided that includes a first molding layer and an interconnect chip at least partially encased in the first molding layer. The interconnect chip has a first side and a second side opposite the first side and a polymer layer on the first side. The polymer layer includes plural conductor traces. A redistribution layer (RDL) structure is positioned on the first molding layer and has plural conductor structures electrically connected to the plural conductor traces. The plural conductor traces provide lateral routing.
    Type: Grant
    Filed: June 30, 2019
    Date of Patent: February 16, 2021
    Assignees: ADVANCED MICRO DEVICES, INC., ATI TECHNOLOGIES ULC
    Inventors: Chun-Hung Lin, Rahul Agarwal, Milind Bhagavat, Fei Guo
  • Patent number: 10922230
    Abstract: A processing system indicates the pendency of a memory access request for data at the cache entry that is assigned to store the data in response to the memory access request. While executing instructions, the processor issues requests for data to the cache most proximal to the processor. In response to a cache miss, the cache controller identifies an entry of the cache to store the data in response to the memory access request, and stores an indication that the memory access request is pending at the identified cache entry. If the cache controller receives a subsequent memory access request for the data while the memory access request is pending at the higher level of the memory hierarchy, the cache controller identifies that the memory access request is pending based on the indicator stored at the entry.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: February 16, 2021
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventor: Paul James Moyer
  • Patent number: 10915330
    Abstract: A computing device includes a processor having a plurality of cores, a core translation component, and a core assignment component. The core translation component provides a set of registers, one register for each core of the multiple processor cores. The core assignment component includes components to provide a core index to each of the registers of the core translation component according to a core assignment scheme during processor initialization. Process instructions from an operating system are transferred to a respective core based on the core indices.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: February 9, 2021
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Amitabh Mehra, Krishna Sai Bernucho
  • Patent number: 10915322
    Abstract: A processor predicts a number of loop iterations associated with a set of loop instructions. In response to the predicted number of loop iterations exceeding a first loop iteration threshold, the set of loop instructions are executed in a loop mode that includes placing at least one component of an instruction pipeline of the processor in a low-power mode or state and executing the set of loop instructions from a loop buffer. In response to the predicted number of loop iterations being less than or equal to a second loop iteration threshold, the set of instructions are executed in a non-loop mode that includes maintaining at least one component of the instruction pipeline in a powered up state and executing the set of loop instructions from an instruction fetch unit of the instruction pipeline.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: February 9, 2021
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Arunachalam Annamalai, Marius Evers, Aparna Thyagarajan, Anthony Jarvis
  • Patent number: 10908991
    Abstract: A computing device having a cache memory that is configured in a write-back mode is described. A cache controller in the cache memory acquires, from a record of bit errors that are present in each of a plurality of portions of the cache memory, a number of bit errors in a portion of the cache memory. The cache controller detects a coherency state of data stored in the portion of the cache memory. Based on the coherency state and the number of bit errors, the cache controller selects an error protection from among a plurality of error protections. The cache controller uses the selected error protection to protect the data stored in the portion of the cache memory from errors.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: February 2, 2021
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: John Kalamatianos, Shrikanth Ganapathy
  • Patent number: 10909053
    Abstract: An electronic device includes a processor that executes a guest operating system, an input-output memory management unit (IOMMU), and a main memory that stores an IOMMU backing store. The IOMMU backing store includes a separate copy of a set of IOMMU memory-mapped input-output (MMIO) registers for each guest operating system in a set of supported guest operating systems. The IOMMU receives, from the guest operating system, a communication that accesses data in a given IOMMU MMIO register. The IOMMU then performs a corresponding access of the data in a copy of the given IOMMU MMIO register in the IOMMU backing store associated with the guest operating system.
    Type: Grant
    Filed: May 27, 2019
    Date of Patent: February 2, 2021
    Assignees: ADVANCED MICRO DEVICES, INC., ATI TECHNOLOGIES ULC
    Inventors: Maggie Chan, Philip Ng, Paul Blinzer
  • Patent number: 10902087
    Abstract: A processing device is provided which includes memory and a processor comprising a plurality of processor cores in communication with each other via first and second hierarchical communication links. Each processor core in a group of the processor cores is in communication with each other via the first hierarchical communication links. Each processor core is configured to store, in the memory, one of a plurality of sub-portions of data of a first matrix, store, in the memory, one of a plurality of sub-portions of data of a second matrix, determine an outer product of the sub-portion of data of the first matrix and the sub-portion of data of the second matrix, receive, from another processor core of the group of processor cores, another sub-portion of data of the second matrix and determine another outer product of the sub-portion of data of the first matrix and the other sub-portion of data of the second matrix.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: January 26, 2021
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Shaizeen Aga, Nuwan Jayasena, Allen H. Rush, Michael Ignatowski
  • Patent number: 10895901
    Abstract: A method and apparatus for scrambling and descrambling data in a computer system includes transmitting non-scrambled data from a first high speed inter chip (IP) link circuit located on a first chip to a first serializer/deserializer (SERDES) physical (PHY) circuit located on the first chip, the first high speed link IP indicating the data is not scrambled. The received non-scrambled data is scrambled by the first SERDES PHY circuit and transmitted to a second chip. The received scrambled data is descrambled by a second SERDES PHY circuit located on the second chip. The non-scrambled data is transmitted by the second SERDES PHY circuit to a second high speed link IP circuit located on the second chip to a third circuit for further processing or transmission.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: January 19, 2021
    Assignees: ADVANCED MICRO DEVICES INC., ATI TECHNOLOGIES ULC
    Inventors: Yanfeng Wang, Michael J. Tresidder, Kevin M. Lepak, Larry David Hewitt, Noah Beck
  • Patent number: 10884319
    Abstract: A system and method for controlling characteristics of collected image data are disclosed. The system and method include performing pre-processing of an image using GPUs, configuring an optic based on the pre-processing, the configuring being designed to account for features of the pre-processed image, acquiring an image using the configured optic, processing the acquired image using GPUs, and determining if the processed acquired image accounts for feature of the pre-processed image, and the determination is affirmative, outputting the image, wherein if the determination is negative repeating the configuring of the optic and re-acquiring the image.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: January 5, 2021
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Allen H. Rush, Hui Zhou
  • Patent number: 10884477
    Abstract: The described embodiments include a computing device with a plurality of clients and a shared resource for processing job items. During operation, a given client of the plurality of clients stores first job items in a queue for the given client. When the queue for the given client meets one or more conditions, the given client notifies one or more other clients that the given client is to process job items using the shared resource. The given client then processes the first job items from the queue using the shared resource. Based on being notified, at least one other client that has second job items to be processed using the shared resource, processes the second job items using the shared resource. The given client can transition the shared resource between power states to enable the processing of job items.
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: January 5, 2021
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Alexander J. Branover, Benjamin Tsien
  • Patent number: 10880587
    Abstract: Virtual Reality (VR) processing devices and methods are provided for transmitting user feedback information comprising at least one of user position information and user orientation information, receiving encoded audio-video (A/V) data, which is generated based on the transmitted user feedback information, separating the A/V data into video data and audio data corresponding to a portion of a next frame of a sequence of frames of the video data to be displayed, decoding the portion of a next frame of the video data and the corresponding audio data, providing the audio data for aural presentation and controlling the portion of the next frame of the video data to be displayed in synchronization with the corresponding audio data.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: December 29, 2020
    Assignees: ATI TECHNOLOGIES ULC, ADVANCED MICRO DEVICES, INC.
    Inventors: Lei Zhang, Gabor Sines, Khaled Mammou, David Glen, Layla A. Mah, Rajabali M. Koduri, Bruce Montag