Patents Assigned to Advanced Optoelectronic Technology, Inc.
  • Method for manufacturing LED
    Patent number: 8871535
    Abstract: A method for manufacturing an LED package includes following steps: providing a base with an LED chip mounted on the base; providing a porous carrier with a plurality of holes, and disposing the base on the porous carrier; providing a film with a phosphor layer attached on the film; providing a mold, and putting the porous carrier, the base, the LED chip, and the film into the mold; extracting air from the mold to an external environment through the holes of the porous carrier, and/or, blowing air toward the film to urge the film to move toward the LED chip, resulting in that the film is conformably attached onto the LED chip and the base; and solidifying the phosphor layer on the LED chip by means of heating whereby the phosphor is conformably and securely attached on the LED chip.
    Type: Grant
    Filed: April 17, 2013
    Date of Patent: October 28, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Hsing-Fen Lo, Chieh-Ling Chang
  • LIGHT EMITTING DIODE LIGHT BULB HAVIGN A LIGHT DISPERSING LAYER ATTACHED ON AN ENVELOPE THEREOF
    Publication number: 20140312762
    Abstract: An LED light bulb includes a holder for electrically connecting with a power source, an LED mounted on the holder, an envelope mounted on the holder and covering the LED, and a light dispersing plate attached to an inner surface of the envelope. The light dispersing plate is made of a transparent material with a plurality of irregular air bubbles therein. Light generated by the LED and radiating to the envelope is refracted, reflected and scattered by the bulbs before the light emits out of the LED light bulb.
    Type: Application
    Filed: November 12, 2013
    Publication date: October 23, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: MING-TA TSAI, CHUNG-MIN CHANG, PEI-YING WANG
  • TESTING SYSTEM FOR LIGHT-EMITTING DIODE AND METHOD FOR TESTING LIGHT-EMITTING DIODE USING THE SAME
    Publication number: 20140314303
    Abstract: A testing system for light-emitting diodes (LEDs) includes a data storage module, a data obtaining module and a comparison module. The data storage module stores pre-setting CIE spectrum data of a standard LED. The data obtaining module includes an image sensing module including a charge-coupled device sensor for capturing an image of a light distribution of an LED to be tested, a data reading module and a computing module. The data obtaining module obtains optical data from the captured and recorded image. The computing module computes to get CIE spectrum data based on the optical date. The comparsion module compares the pre-setting CIE spectrum data with the CIE spectrum data computed by the computing module to determine whether the tested LED passes the test. This disclosure also relates to a method for testing LEDs using the testing system.
    Type: Application
    Filed: November 12, 2013
    Publication date: October 23, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventor: CHE-HSANG HUANG
  • LIGHT EMITTING DIODE CHIP
    Publication number: 20140312299
    Abstract: A light emitting diode (LED) includes a substrate, a semiconductor structure formed on the substrate, and two electrodes formed on the semiconductor structure. The semiconductor structure includes a bearing surface via which light generated by the semiconductor structure radiates out of the LED. A plurality of microstructures is formed on the bearing surface. A cross section of each microstructure is rectangular triangular having a vertical side surface. Each microstructure includes a top surface. The top surface is inclined relative to the bearing surface.
    Type: Application
    Filed: March 7, 2014
    Publication date: October 23, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: CHIA-HUI SHEN, TZU-CHIEN HUNG
  • Light-emitting semiconductor device having sub-structures for reducing defects of dislocation therein
    Patent number: 8866161
    Abstract: A structure of semiconductor device includes a first semiconductor layer; an intermediate layer on a surface of said first semiconductor layer; a second semiconductor layer on said intermediate layer, wherein said intermediate layer and said second semiconductor layer are integrated to a set of sub-structures; and a semiconductor light emitting device on said second semiconductor layer.
    Type: Grant
    Filed: December 8, 2011
    Date of Patent: October 21, 2014
    Assignee: Advanced Optoelectronics Technology, Inc.
    Inventors: Shih-Cheng Huang, Po-Min Tu, Ying-Chao Yeh, Wen-Yu Lin, Peng-Yi Wu, Shih-Hsiung Chan
  • METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGES
    Publication number: 20140308767
    Abstract: A method for manufacturing LED packages includes steps: providing a lead frame including many pairs of first and second electrodes and first and second tie bars respectively located at opposite ends of each pair of the electrodes, the first and second electrodes each including a main body and an extension electrode protruding outwardly from the main body; forming many molded bodies to engage with the first and second electrodes, the first and second main bodies being embedded into the molded bodies, and the first and second extension electrodes being exposed from a periphery of the molded body; removing the first and second tie bars from the lead frame; disposing LED dies in corresponding receiving cavities defined by the molded bodies; and cutting the molded bodies and the lead frame to obtain a plurality of individual LED packages.
    Type: Application
    Filed: March 20, 2014
    Publication date: October 16, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HOU-TE LIN, CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN
  • LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODES
    Publication number: 20140306176
    Abstract: An exemplary light emitting diode includes a substrate and a first undoped gallium nitride (GaN) layer formed on the substrate. The first undoped GaN layer defines a groove in an upper surface thereof. A distributed Bragg reflector is formed in the groove of the first undoped GaN layer. The distributed Bragg reflector includes a plurality of second undoped GaN layers and a plurality of air gaps alternately stacked one on the other. An n-type GaN layer, an active layer and a p-type GaN layer are formed on the distributed Bragg reflector and the first undoped GaN layer. A p-type electrode and an n-type electrode are electrically connected with the p-type GaN layer and the n-type GaN layer, respectively. A method for manufacturing plural such light emitting diodes is also provided.
    Type: Application
    Filed: November 18, 2013
    Publication date: October 16, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: CHING-HSUEH CHIU, YA-WEN LIN, PO-MIN TU, SHIH-CHENG HUANG
  • LIGHT EMITTING DIODE PACKAGE
    Publication number: 20140306240
    Abstract: An exemplary light emitting diode package includes a substrate, a first electrode and a second electrode embedded in the substrate, and a light emitting chip fixed onto the first electrode by first glue. The first electrode has a first barrier member at a periphery of the first glue and below the light emitting chip. The first barrier member obstructs the first glue from spreading toward a side of the first barrier member away from the first glue and the light emitting chip, whereby a contamination by the first glue to an area of the top surface beside the side of the first barrier of the first electrode away from the first glue and the light emitting chip is prevented.
    Type: Application
    Filed: October 24, 2013
    Publication date: October 16, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HOU-TE LIN, YAU-TZU JANG, CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN
  • Light emitting diode package and method for manufacturing the same
    Patent number: 8853733
    Abstract: An light-emitting diode (LED) package includes a substrate, a electrode structure embedded in the substrate, and a plurality of LED chips electrically connecting with the electrode structure. The substrate includes a main portion and a protruding portion extending from a bottom surface of the main portion. The main portion is located above the protruding portion. The electrode structure includes a first, a second and a third electrode spaced from each other. The third electrode is located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of the top surface of the main portion. Bottom surfaces of the first and second electrodes are exposed out of the bottom surface of the main portion. Bottom surface of the third electrode is covered by the protruding portion. The present disclosure also relates to a method for manufacturing the LED package.
    Type: Grant
    Filed: August 12, 2013
    Date of Patent: October 7, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Che-Hsang Huang, Pin-Chuan Chen, Lung-Hsin Chen, Wen-Liang Tseng, Yu-Liang Huang
  • LIGHT EMITTING DIODE WITH WAVE-SHAPED BRAGG REFLECTIVE LAYER AND METHOD FOR MANUFACTURING SAME
    Publication number: 20140291689
    Abstract: An exemplary light emitting diode includes a substrate and a first undoped GaN layer formed on the substrate. The first undoped GaN layer has ion implanted areas on an upper surface thereof. A plurality of second undoped GaN layers is formed on the first undoped GaN layer. Each of the second undoped GaN layers is island shaped and partly covers at least one corresponding ion implanted area. A Bragg reflective layer is formed on the second undoped GaN layer and on portions of upper surfaces of the ion implanted areas not covered by the second undoped GaN layers. An n-type GaN layer, an active layer and a p-type GaN layer are formed on an upper surface of the Bragg reflective layer in that sequence. A method for manufacturing the light emitting diode is also provided.
    Type: Application
    Filed: November 18, 2013
    Publication date: October 2, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: CHING-HSUEH CHIU, YA-WEN LIN, PO-MIN TU, SHIH-CHENG HUANG
  • FLIP-CHIP LIGHT EMITTING DIODE PACKAGE WITH MOISTURE BARRIER LAYER
    Publication number: 20140291713
    Abstract: An exemplary light emitting diode (LED) package includes a substrate, a first electrode penetrating downward through the substrate, a second electrode penetrating downward through the substrate and spaced from the first electrode, an LED die arranged on the substrate and mounted to the first and second electrodes by flip-chip technology, and an encapsulation layer formed on the substrate to encapsulate the LED die therein. The substrate includes a top surface and a bottom surface at opposite sides thereof. Top ends of the first and second electrodes are exposed at the top surface of the substrate, and bottom ends of the first and second electrodes are exposed at the bottom surface of the substrate. A moisture barrier layer is attached on the bottom of the LED package to cover a joint of the first and/or second electrode and the substrate.
    Type: Application
    Filed: December 4, 2013
    Publication date: October 2, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HOU-TE LIN, CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN
  • LIGHT EMITTING DIODE DEVICE AND METHOD FOR MANUFACTURING SAME
    Publication number: 20140291720
    Abstract: An LED device includes a substrate having a top surface and a bottom surface. The substrate defines a through hole at a center thereof. The LED device also includes an electrode board. The electrode board defines a concave portion at a center thereof, and a convex portion connected to and surrounding two sides of the concave portion. The concave portion includes a first electrode and a second electrode isolated from each other, and is located in the through hole of the substrate. A bottommost surface of the concave portion is substantially coplanar with the bottom surface of the substrate, and a top surface of the convex portion is substantially coplanar with the top surface of the substrate. An LED chip is arranged on the concave portion, and is electrically connected to the first electrode and the second electrode. A method for manufacturing plural such LED devices is also provided.
    Type: Application
    Filed: November 21, 2013
    Publication date: October 2, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HSING-FEN LO, LUNG-HSIN CHEN
  • Method for manufacturing light emitting diode chip with electrodes having smooth surfaces
    Patent number: 8846428
    Abstract: A method for manufacturing a light emitting diode chip includes the following steps: providing an epitaxial structure having an epitaxial layer; forming a first electrode and a second electrode on the epitaxial layer; coating an inert layer on the epitaxial structure, the first electrode and the second electrode continuously; annealing the first electrode and the second electrode; and removing the inert layer coated on the first electrode and the second electrode to expose the first electrode and the second electrode.
    Type: Grant
    Filed: July 16, 2013
    Date of Patent: September 30, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Ya-Chi Lien, Tzu-Chien Hung
  • Method for manufacturing LED package struture and method for manufacturing LEDs using the LED packange struture
    Patent number: 8846422
    Abstract: A method for manufacturing an LED package structure is disclosed wherein a substrate with a first electrode, a second electrode and a connecting layer is provided. A photoresist coating is provided to cover the substrate, the first electrode, the second electrode and the connecting layer. A portion of the photoresist coating is removed to define a groove corresponding to the connecting layer. A metal layer is formed in the groove to join the connecting layer. A remaining portion of the photoresist coating is removed and a concave is formed and surrounded by the metal layer. A reflective layer is formed on an inside surface of the concave to join the metal layer to form a reflective cup. An LED die is mounted in the reflective cup and electrically connects with the first and second electrodes.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: September 30, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Pin-Chuan Chen, Hsin-Chiang Lin, Lung-Hsin Chen
  • LIGHT EMITTING DIODE PACKAGE
    Publication number: 20140284639
    Abstract: A light emitting diode (LED) package includes a substrate, a first electrode and a second electrode embedded in the substrate and spaced from each other, an LED die mounted on a top surface of the substrate and electrically connected to the first and the second electrodes. Both the first and the second electrodes include a top face and a bottom face, with the top face and the bottom face of each of the first and the second electrodes being exposed at the top surface and a bottom surface of the substrate, respectively. The top face of the first electrode defines a first groove corresponding to a positive bonding pad (p-pad) of the LED die. The p-pad is partially inserted into the first groove. An oxidation-resistant metal coating layer is filled between an insertion portion of the p-pad and an inner surface of the first groove.
    Type: Application
    Filed: November 12, 2013
    Publication date: September 25, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HOU-TE LIN, PIN-CHUAN CHEN, LUNG-HSIN CHEN
  • LIGHT EMITTING DIODE PACKAGE
    Publication number: 20140284640
    Abstract: A light emitting diode (LED) package includes a substrate, a first electrode, a second electrode, an LED die mounted on the substrate and electrically connected to the first and the second electrodes, and an encapsulation layer encapsulating the LED die. Both the first and the second electrodes are embedded in the substrate and spaced from each other. Each of the first and the second electrodes includes a top face and a bottom face, with the top face and the bottom face thereof being exposed at a top surface and a bottom surface of the substrate, respectively. The top face of the first electrode defines a first groove therein. An oxidation-resistant metal coating layer is filled in the first groove. A positive bonding pad of the LED die directly contacts with a top face of the first oxidation-resistant metal coating layer.
    Type: Application
    Filed: November 12, 2013
    Publication date: September 25, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HOU-TE LIN, PIN-CHUAN CHEN, LUNG-HSIN CHEN
  • LED and backlight module using the same
    Patent number: 8840262
    Abstract: An LED includes a base, an LED chip, a first electrode, a second electrode, an encapsulating layer, and a reflective layer. The base forms a concave recessed from a top face thereof and a recess above the concave. The reflective layer is attached on the concave. The LED chip is received in the recess and located over the reflective layer. The LED chip has a light output face facing towards the reflective layer. The encapsulating layer is filled in the recess to cover the reflective layer and encapsulate the LED chip. The reflective layer includes a first reflective layer and a second reflective layer. The first reflective layer is located at a center of the concave. The second reflective layer surrounds and connects the first reflective layer. The first reflective layer has a curvature smaller than that of the second reflective layer.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: September 23, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chao-Hsiung Chang, Hou-Te Lin
  • Light emitting diode package with improved optical lens structure
    Patent number: 8835958
    Abstract: An LED package includes a substrate, two electrodes, an LED die and a lens. The substrate includes a top surface, a bottom surface, a plurality of side surfaces interconnecting the top surface with the bottom surface, and two opposite notches depressed downward from lateral peripheral portions of the top surface. The two electrodes penetrate through the substrate, and each of the two electrodes is exposed at both the top surface and the bottom surface of the substrate. The LED die is arranged on the substrate and electrically connected to the two electrodes. The lens is arranged on the substrate and covers the LED die. The lens includes a contacting surface adjoining the top surface of the substrate, and two protrusions extending from lateral peripheral portions of the contacting surface and respectively embedded in the two notches.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: September 16, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventor: Yu-Lun Hsieh
  • Method for manufacturing LED
    Patent number: 8835198
    Abstract: An LED (light emitting diode) includes a base, a pair of leads fixed on the base, a housing secured on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity to receive the chip. The cavity includes an upper chamber and a lower chamber communicating with the upper chamber. The lower chamber is gradually expanded along a top-to-bottom direction of the LED, and the upper chamber is gradually expanded along a bottom-to-top direction of the LED. The encapsulant substantially fills the lower chamber and the upper chamber. A method for manufacturing the LED is also disclosed.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: September 16, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Pin-Chuan Chen, Hsin-Chiang Lin
  • Light-emitting element package and fabrication method thereof
    Patent number: 8828755
    Abstract: A fabrication method for a light-emitting element package, the method comprising: providing a high precision wafer level mold module, the high precision wafer level mold module comprising an upper mold and a bottom mold; mounting a substrate with a plurality of light-emitting elements between the upper mold and the bottom mold; filling package materials into the high precision wafer level mold module to obtain package members mounted on the light-emitting elements; and removing the high precision wafer level mold module.
    Type: Grant
    Filed: August 22, 2013
    Date of Patent: September 9, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Min-Tsun Hsieh, Wen-Liang Tseng, Lung-Hsin Chen, Chih-Yung Lin, Ching-Lien Yeh, Chi-Wei Liao