Patents Assigned to Advanced Optoelectronic Technology, Inc.
  • Backlight module having optcial fiber
    Patent number: 8985826
    Abstract: A backlight module includes a back cover, a light source located on the back cover, an optical fiber located on the back cover and over the light source and having a light-incident hole facing the light source and a plurality of light-emergent windows opposite to the light-incident hole. A plurality of light shutters correspondingly covers the light-emergent windows. A controlling device is provided for controlling the open and close of the light shutters. Light emitted from the light source and entering the optical fiber is permitted to leave the optical fiber from the light-emergent windows whose light shutters are opened. The light is not permitted to leave the optical fiber from the light-emergent windows whose light shutters are closed.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: March 24, 2015
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Hou-Te Lin, Chao-Hsiung Chang
  • Light emitting diode assembly having a deformable lens
    Patent number: 8981387
    Abstract: A light emitting diode assembly includes a base, a light emitting chip mounted on the base, an elastic lens covering the light emitting chip, two rotation members rotatably arranged on the base, and two stopper poles fixed on the base. The two rotation members are capable of driving the elastic lens to rotate with respect to the two stopper poles. The stopper poles compress the elastic lens to cause the elastic lens to deform resiliently when the elastic lens is rotated by the rotation members to engage with the stopper poles.
    Type: Grant
    Filed: December 18, 2012
    Date of Patent: March 17, 2015
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Hou-Te Lin, Chao-Hsiung Chang
  • Light emitting diode die and light emitting diode package incorporating the same
    Patent number: 8981406
    Abstract: An LED die comprises a substrate and an epitaxial layer formed thereon. The epitaxial layer comprises a first n-type semiconductor layer, an active layer and a p-type semiconductor layer grown on the substrate in sequence. The LED die defines a receiving recess formed in a center of a top face of the p-type semiconductor layer. The receiving recess extends through the p-type semiconductor layer, the active layer and into the n-type semiconductor layer along a top-to-bottom direction of the epitaxial layer. A pair of p-pads are located at two opposite sides of the p-type semiconductor layer, respectively. A first n-pad is received in the receiving recess and located on the n-type layer.
    Type: Grant
    Filed: April 15, 2013
    Date of Patent: March 17, 2015
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chia-Hui Shen, Tzu-Chien Hung
  • LED
    Patent number: 8981419
    Abstract: An LED includes a base, a pair of leads fixed on the base, a housing fixed on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity in a central area thereof and a chamber adjacent to a circumferential periphery thereof. Top faces of the leads are exposed in the chamber. A blocking wall is formed in the chamber to contact the exposed top faces of the leads. A bonding force between the blocking wall and the leads is larger than that between the leads and the housing.
    Type: Grant
    Filed: June 17, 2013
    Date of Patent: March 17, 2015
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Hsin-Chiang Lin, Pin-Chuan Chen
  • Light emitting diode package with lens and method for manufacturing the same
    Patent number: 8981407
    Abstract: A light emitting diode (LED) package includes a substrate with a flat top surface, an LED chip mounted on the substrate, and a group of blocking structure and encapsulation body. The LED chip electrically connects with the substrate. The blocking structure surrounds the LED chip. The encapsulation body covers the LED chip. A bottom of the encapsulation body is enclosed by the blocking structure; the encapsulation body has a light outputting surface, and an outer surface of the blocking structure is continuously connected with the light outputting surface. The light outputting surface has a semispherical profile. An angle between a normal line extending from the outer surface of the blocking structure and perpendicular to the substrate and a tangent line tangent to the light outputting surface at a point thereof adjacent to the outer surface is smaller than 60 degrees.
    Type: Grant
    Filed: June 17, 2013
    Date of Patent: March 17, 2015
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chung-Min Chang, Chien-Lin Chang-Chien, Hsuen-Feng Hu, Yu-Wei Tsai, Chang-Wen Sun
  • Light emitting diode package
    Patent number: 8981447
    Abstract: An LED package includes a first electrode, a second electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED chip. The first electrode includes a first main portion and a first connecting portion extending outwardly from the first main portion. The first connecting portion has a first connecting face away from the first main portion. The second electrode includes a second main portion and a second connecting portion extending outwardly from the second main portion. The second connecting portion has a second connecting face away from the second main portion. The first main portion and the second main portion are embedded into the receiving cup, and the first connecting face of the first connecting portion and the second connecting face of the second connecting portion are exposed outside the receiving cup.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: March 17, 2015
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Hou-Te Lin, Pin-Chuan Chen, Lung-Hsin Chen
  • Light emitting diode bulb
    Patent number: 8979312
    Abstract: A light emitting diode (LED) bulb includes a connecting body, a mounting base located on the connecting body and a plurality of LED modules mounted on the mounting base. The mounting base has a top face spaced from the connecting body and at least three surrounding walls. The top face of the mounting base orients toward a direction different that of each of the at least three surrounding walls. A lamp cover is secured to the connecting body and encloses the LED modules. An extension of the top face of the mounting base interests with the lamp cover at a point. A tangent line of the lamp cover through the point and the extension of the top face form an included angle which is less than 60 degrees. Furthermore, a center of the lamp cover is located above the top face.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: March 17, 2015
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Lung-Hsin Chen, Wen-Liang Tseng
  • LIGHT EMITTING DIODE PACKAGE HAVING ZENER DIODE COVERED BY REFLECTIVE MATERIAL
    Publication number: 20150060912
    Abstract: An exemplary light emitting diode package includes a substrate comprising a first electrode, a second electrode and an insulation layer electrically insulating the first electrode from the second electrode; a light emitting diode is located on the substrate, and electrically connects with the first and second electrodes; a zener diode is located on the substrate, and electrically connects with the first and second electrodes; and a reflecting layer is formed on the zener diode to reflect light emitted from the light emitting diode and toward the zener diode. The disclosure also relates to a method for manufacturing the light emitting diode package.
    Type: Application
    Filed: March 21, 2014
    Publication date: March 5, 2015
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HOU-TE LIN, FU-HSIANG YEH, CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN
  • LED lamp having a large illumination angle
    Patent number: 8960955
    Abstract: An LED bulb includes a connecting member having an Edison male screw base and an LED module engaging with the connecting member. The LED module includes a circuit board, a first LED and a plurality of second LEDs mounted on the circuit board. The first LED is arranged on a center of the circuit board. The second LEDs are located surround the first LED. The LED bulb furthermore includes a plurality of lens. Each lens covers a corresponding second LED. Each lens includes a light-guiding portion which includes a light input surface and a light output surface. Light emitted from each of the second LEDs travels into the lens via the light input surface, and is refracted out to lateral directions of the LED bulb by the light output surface of the light-guiding portion to obtain a wider illumination range.
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: February 24, 2015
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chao-Hsiung Chang, Lung-Hsin Chen, Pin-Chuan Chen, Wen-Liang Tseng
  • LIGHT EMITTING DIODE HAVING CARBON NANOTUBES THEREIN AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20150048302
    Abstract: A light emitting diode includes a substrate, an un-doped GaN layer, a plurality of carbon nanotubes, an N-type GaN layer, an active layer formed on the N-type GaN layer, and a P-type GaN layer formed on the active layer. The substrate includes a first surface and a second surface opposite and parallel to the first surface. A plurality of convexes is formed on the first surface of the substrate. The un-doped GaN layer is formed on the first surface of the substrate. The plurality of carbon nanotubes is formed on an upper surface of the un-doped GaN layer. The plurality of carbon nanotubes is spaced from each other to expose a portion of the upper surface of the un-doped GaN layer. The N-type GaN layer is formed on the exposed portion of the upper surface of the un-doped GaN layer and covering the carbon nanotubes therein.
    Type: Application
    Filed: March 20, 2014
    Publication date: February 19, 2015
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: YA-WEN LIN, CHING-HSUEH CHIU, PO-MIN TU, SHIH-CHENG HUANG
  • Metiod of making LED with bat-wing emitting field lens
    Patent number: 8956893
    Abstract: A method for manufacturing an LED (light emitting diode) with bat-wing emitting field lens is disclosed. Firstly, a substrate is provided. The substrate includes a plurality of depressions each corresponding to a pair of electrodes. A plurality of LED chips are fastened in the depressions and electrically connected to the pairs of electrodes. A plurality of unsolidified lenses are formed in the depressions to cover the LED chips. A pressing mold including a plurality of protrusions is provided. The pressing mold is moved towards the substrate to force the protrusions of the pressing mold to insert into the unsolidified lenses. The lenses are solidified and the pressing mold is removed and concavities are defined at the lenses. The substrate is cut to obtain a plurality of separated and finished LEDs.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: February 17, 2015
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Lung-Hsin Chen, Wen-Liang Tseng
  • Method for packaging light emitting diodes and light emitting module having LED packages formed by the method
    Patent number: 8946734
    Abstract: A method for making a light emitting module includes: a. providing a flexible substrate; b. forming a plurality of rigid portions in the flexible substrate; c. forming an electrically conductive layer on the rigid portions, the electrically conductive layer having several electrodes apart from each other; d. arranging a plurality of LED dies on the electrically conductive layer with each LED die striding over and electrically connected to two neighboring electrodes; e. forming an encapsulating layer to cover the LED dies; and f. cutting through the flexible substrate. At least one of above steps b, c, d, e is performed by a roll applying process.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: February 3, 2015
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventor: Hsing-Fen Lo
  • Light emitting diode and manufacturing method thereof
    Patent number: 8946737
    Abstract: A light emitting diode (LED) includes a substrate, a buffer layer and an epitaxial structure. The substrate has a first surface with a patterning structure formed thereon. The patterning structure includes a plurality of projections. The buffer layer is arranged on the first surface of the substrate. The epitaxial structure is arranged on the buffer layer. The epitaxial structure includes a first semiconductor layer, an active layer and a second semiconductor layer arranged on the buffer layer in sequence. The first semiconductor layer has a second surface attached to the active layer. A distance between a peak of each the projections and the second surface of the first semiconductor layer is ranged from 0.5 ?m to 2.5 ?m.
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: February 3, 2015
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Ya-Wen Lin, Po-Min Tu, Shih-Cheng Huang, Chia-Hung Huang, Shun-Kuei Yang
  • LED with thin package struture and method for manufacturing the same
    Patent number: 8945959
    Abstract: A method for manufacturing an LED (light emitting diode) is disclosed wherein a metal substrate is provided. A chip fastening area with a depression and two wire fixing areas on the first metal substrate are defined on the metal substrate. The chip fastening area and the wire fixing areas are separated by a plurality of first grooves. An LED chip is provided in the depression of the chip fastening area and electrically connected to the wire fixing areas by wires. An encapsulant is formed to cover and connect the chip fastening area and the wire fixing areas. Portions of the metal substrate except the chip fastening area and the wire fixing areas are removed.
    Type: Grant
    Filed: June 17, 2013
    Date of Patent: February 3, 2015
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Pin-Chuan Chen, Chao-Hsiung Chang, Hsin-Chiang Lin
  • Method for manufacturing light emitting diodes
    Patent number: 8936955
    Abstract: An LED manufacturing method includes following steps: providing an LED die; providing an electrode layer having a first section and a second section electrically insulated from the first section, and arranging the LED die on the second section wherein an electrically conductive material electrical connects a bottom of the LED die with second section; forming a transparent conductive layer to electrically connect a top of the LED die with the first section; providing a base and coating an outer surface of the base with a layer of electrically conductive material, defining a continuous gap in the electrically conductive material to divide the electrically conductive material into a first electrode part, and a second electrode part, arranging the electrode layer on the base so that the first section contacts the first electrode part, and the second section contacts the second electrode part.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: January 20, 2015
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Po-Min Tu, Shih-Cheng Huang, Ya-Wen Lin
  • LED lighting apparatus having snow melting function
    Patent number: 8926125
    Abstract: An LED (light emitting diode) lighting apparatus includes an LED, a light adjusting device and a shell. The LED includes a main lighting surface and a heat dissipating surface. The shell receives the LED and the light adjusting device therein, the shell having a light emitting window for light emitted from the LED to transmit therethrough after the light is directed by the light adjusting device. The heat dissipating surface of the LED connects the light emitting window, and heat generated by the LED is transferred from the heat dissipating surface to the light emitting window to prevent snow from accumulating on the light emitting window.
    Type: Grant
    Filed: April 10, 2013
    Date of Patent: January 6, 2015
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chung-Min Chang, Chien-Lin Chang-Chien, Hsuen-Feng Hu, Yu-Wei Tsai, Chang-Wen Sun
  • Method for manufacturing light emitting diode package
    Patent number: 8921131
    Abstract: An exemplary method for manufacturing an LED package includes following steps: providing a substrate; forming a reflector on the substrate with a receiving chamber defined in the reflector; providing an LED chip and mounting the LED chip on the substrate wherein the LED chip is received in the receiving chamber; providing a gelatinous phosphor layer and arranging the gelatinous phosphor layer on a top end of the reflector wherein the gelatinous phosphor layer covers the receiving chamber and phosphor powder is evenly distributed in the gelatinous phosphor layer; providing a pressing mold and arranging the pressing mold on a top end of the gelatinous phosphor layer; pressing the pressing mold toward the gelatinous phosphor layer to make the gelatinous phosphor layer fill in the receiving chamber; solidifying the gelatinous phosphor layer.
    Type: Grant
    Filed: October 17, 2012
    Date of Patent: December 30, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Lung-Hsin Chen, Wen-Liang Tseng
  • Light emitting diode light source device
    Patent number: 8921880
    Abstract: An LED light source device includes an LED light source, a first translucent structure covering the LED light source and a second translucent structure covering the first translucent structure. An interior of the first translucent structure has light scattering powder distributed therein. The LED light source is embedded in the first translucent structure. The LED light source is covered by the light scattering powder. The second translucent structure has a radius of R and an index of refraction of N1, while the first translucent structure has a radius of r, wherein R, r and N1 satisfy the following relation: N1<R/(2r?R).
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: December 30, 2014
    Assignee: Advanced Optoelectronics Technology, Inc.
    Inventors: Chih-Peng Hsu, Chung-Min Chang, Hsuen-Feng Hu, Chien-Lin Chang-Chien, Yu-Wei Tsai
  • Light emitting diode with multiple quantum well structure
    Patent number: 8921828
    Abstract: An exemplary light emitting diode includes a first type semiconductor layer, a second type semiconductor layer, and a multi quantum well layer sandwiched between the first and second type semiconductor layers. The multi quantum well layer includes a first barrier layer, a second barrier layer, two well layers sandwiched between the first and second barrier layers, and a third barrier layer sandwiched between the two well layers. The first and second barrier layers each have an energy level of conduction band higher than that of the third barrier layer. The first and second barrier layers each have an energy level of valence band higher than that of the third barrier layer.
    Type: Grant
    Filed: April 2, 2013
    Date of Patent: December 30, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Ya-Wen Lin, Shih-Cheng Huang, Po-Min Tu
  • Method for manufacturing LED package
    Patent number: 8921132
    Abstract: A method for manufacturing an LED package includes providing a substrate including an insulating layer inlayed with first and second electrodes. The first and second electrodes define a chip fastening area. An LED chip is fastened on the chip fastening area and electrically connected to the first and second electrodes. A buffer layer including a shelter and grooves is brought to be located over the substrate wherein the shelter covers the chip fastening area and the grooves are located over portions of the substrate beside the first and second electrodes. A reflecting layer is formed in the grooves of the buffer layer by injecting liquid material into the grooves. The buffer layer is removed after the liquid material is solidified and a through hole is defined. An encapsulant is formed to cover the LED chip by injecting the encapsulant into the through hole and the chip fastening area.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: December 30, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventor: Hsing-Fen Lo