Abstract: An electronic device is provided. The electronic device includes a first carrier, a second carrier, a first support, and a plurality of voltage regulating components. The second carrier is stacked over the first carrier. The first support is disposed between the first carrier and the second carrier and is at a central region of the first carrier. The voltage regulating components are disposed between the first carrier and the second carrier. At least one of the voltage regulating components is outside of the central region of the first carrier.

Abstract: A package structure is provided. The package structure includes a photonic carrier, a circuit structure, and an optical transmission structure. The circuit structure includes a plurality of electronic components. The optical transmission structure separates the circuit structure from the photonic carrier and is configured to optically communicate between the electronic components. The photonic carrier is configured to support the circuit structure and the optical transmission structure and is configured to dissipate heat from the electronic components.

Abstract: The present disclosure provides an electronic device. The electronic device includes an electronic component, an optical transceiver disposed over the electronic component, and an interposer disposed between the electronic component and the optical transceiver. The interposer is configured to reduce thermal interference to the optical transceiver.

Abstract: A package structure includes a substrate, a redistribution layer (RDL) structure, a first electronic component and a second electronic component. The redistribution layer (RDL) structure is disposed on the substrate. The first electronic component is disposed over the redistribution layer (RDL) structure. The second electronic component is disposed over the redistribution layer (RDL) structure. The first electronic component is electrically communicated with the second electronic component through the substrate and the redistribution layer (RDL) structure. A number of input/output (I/O) count of the redistribution layer (RDL) structure is less than a number of input/output (I/O) count of the substrate.

Abstract: A power module is disclosed. The power module includes a first conductive plate, a first power component, and a second power component. The first conductive plate has a first side and a second side opposite to the first side; The first power component is disposed at the first side. The second power component is disposed at a first location of the second side distinct from a second location of the second side. The second location is configured to transfer most heat from the first power component to the second power component if the second power component is disposed at the second location.

Abstract: A semiconductor package structure and a method of manufacturing a semiconductor package structure is provided. The semiconductor package structure includes a carrier and a component. The carrier includes a first part and a second part separated from the first part. The component is disposed under the first part and electrically connected to the second part. The first part is configured to be electrically connected to a device disposed over the first part.

Abstract: An electronic device is disclosed. The electronic component has a front side and a backside opposite to the front side. The front side is configured to receive a first power. The backside is configured to receive a second power greater than the first power.

Abstract: The present disclosure relates to an electronic device that includes a first radiating element configured to radiate a first electromagnetic wave and a second radiating element configured to radiate a second electromagnetic wave. A first radiation pattern of the first electromagnetic wave is configured to be adjusted, and a second radiation pattern of the second electromagnetic wave is configured to be fixed.

Abstract: A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes at least one electronic component, a heat source, and a heat dissipation element. The heat source is adjacent to the electronic component. The heat dissipation element is disposed adjacent to the heat source and the electronic component. The heat dissipation element includes a heat transmitting structure configured to reduce heat, which is from the heat source, through the heat dissipation element, and transmitting in a direction toward the electronic component.

Abstract: An optoelectronic device includes a photonic component. The photonic component includes an active side, a second side different from the active side, and an optical channel extending from the active side to the second side of the photonic component. The optical channel includes a non-gaseous material configured to transmit light.

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a semiconductor package structure includes a semiconductor die and a light absorbing layer. The semiconductor die has a first surface, a second surface and a third surface. An active layer of the semiconductor die is adjacent to the first surface. The second surface is opposite to the first surface. The third surface extends from the first surface to the second surface. The light absorbing layer covers the second surface and the third surface of the semiconductor die. The semiconductor die has a thickness defined from the first surface to the second surface, and the thickness of the semiconductor die is less than or equal to about 300 micrometers (?m).

Abstract: The present disclosure provides an electronic device. The electronic device includes an operating module, a first converter, a first circuit structure, and a second converter. The first circuit structure supports the first converter. The second converter electrically connects the first converter and the operating module. The first converter is configured to receive an external power not passing through the first circuit structure.

Abstract: An electronic device is provided. The electronic device includes a photonic component, a waveguide structure, and a cladding structure. The waveguide structure is configured to optically couple to the photonic component. The cladding structure includes a first portion and a second portion including different materials and covering different regions of the waveguide structure.

Abstract: The present disclosure provides an electronic device. The electronic device includes a first stage power module, a second stage power, a first circuit structure, and a connector. The second stage power module is at least partially vertically overlapping the first stage power module. The first circuit structure separates the first stage power module from the second stage power module. The connector is supported by the first circuit structure and configured to transmit an external power to the first stage power module.

Abstract: An electronic device is disclosed. The electronic device includes a carrier and a first interposer disposed on the carrier. The first interposer has a first region configured for providing an external electrical connection to outside the electronic device and a second region distinct from the first region. The electronic device also includes a first antenna component disposed on the second region of the first interposer.

Abstract: The present disclosure relates to an electronic device for detecting a robotic motion. The electronic device includes a 6-axis movable module and a plurality of sensing modules. The plurality of sensing modules are mounted on and protrude from an outer surface of the 6-axis movable module for detecting an amount of a rotation along at least one axis.

Abstract: A package structure is disclosed. The package structure includes a first substrate, a second substrate, a gap, and a directing structure. The second substrate is disposed under the first substrate. The gap is between the first substrate and the second substrate. The gap includes a first region and a second region. The first region is configured to accommodate a filling material. The directing structure is disposed in a flow path of the filling material and configured to reduce a migration of the filling material from the first region to the second region.

Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic structure, an alignment component and a light transmission element. The photonic structure includes an optical I/O. The alignment component includes a through hole extending through the alignment component and aligned with the optical I/O of the photonic structure. The light transmission element entirely fills the through hole of the alignment component.

Abstract: At least some embodiments of the present disclosure relate to an electronic structure. The package structure includes a lead frame, an electronic component, and a conductive wire physically and electrically connecting the electronic component to the lead frame. An elevation of a first end of the conductive wire is substantially equal to an elevation of a second end of the conductive wire.

Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component, a connection structure, and an electronic component. The photonic component has an active surface. The connection structure is in contact with the active surface of the photonic component. The electronic component is embedded in the connection structure. The connection structure includes a first redistribution structure in contact with the active surface of the photonic component.