Abstract: An electronic package structure includes an encapsulant, an interconnection element, a first metal material and a second metal material. The interconnection element is disposed in the encapsulant. A top surface of the interconnection element is not level with a top surface of the encapsulant. The first metal material is disposed on the top surface of the interconnection element. The second metal material is conformally disposed on the first metal material.

Abstract: An optical device is provided. The optical device includes a first photonic component and a second photonic component. The first photonic component is configured to communicate with the second photonic component through a first optical path or an electrical path depending on a distance between the first photonic component and the second photonic component.

Abstract: A semiconductor package device includes a substrate, an electronic component, and a thermal conductive layer. The electronic component is disposed on the substrate and includes a first surface facing away from the substrate. The thermal conductive layer is disposed above the first surface of the electronic component. The thermal conductive layer includes a plurality of portions spaced apart from each other.

Abstract: The present disclosure provides an electronic device. The electronic device includes a heat dissipating structure, a first conductive element, and a first electronic component. The first conductive element penetrates the heat dissipating structure. The first electronic component is disposed under the heat dissipating structure and electrically connected to the first conductive element. The heat dissipating structure is configured to provide the first electronic component with a heat transmission path without passing through the first conductive element.

Abstract: A package structure and a method of manufacturing a package structure are provided. The method includes providing a structure including a substrate and a metal-containing structure over the substrate; applying a first laser beam to a first surface of the structure, the first laser beam having a first beam size and at least a first intensity; applying a second laser beam to the first surface of the structure, wherein the second laser beam has a second beam size less than the first beam size and a second intensity higher than the first intensity; and breaking the structure from a second surface opposite to the first surface of the structure.

Abstract: The present disclosure provides a machine. The machine includes a main body, a first detection module connected to the main body, a second detection module connected to the main body, and an electronic component wirelessly communicating with the first detection module and the second detection module. A detection distance of the first detection module and a detection distance of the second detection module are different. The electronic component is configured to control a movement of the main body. A detection module is also provided.

Abstract: An electronic device is provided. The electronic device includes an inductor and a dielectric layer. The inductor includes a first magnetic layer, a conductive trace over the first magnetic layer, and a second magnetic layer over the conductive trace. The dielectric layer includes a first portion between the second magnetic layer and an inclined surface of the first magnetic layer. A substantially constant distance between the second magnetic layer and the inclined surface of the first magnetic layer is defined by the dielectric layer.

Abstract: A semiconductor package includes: (1) a package substrate including an upper surface; (2) a semiconductor device disposed adjacent to the upper surface of the package substrate, the semiconductor device including an inactive surface; and (3) an antenna substrate disposed on the inactive surface of the semiconductor device.

Abstract: An electronic device is provided. The electronic device includes a photonic component, an optical guiding element, and a reinforcement element. The photonic component includes a first region and a second region having a thickness less than a thickness of the first region. The optical guiding element is disposed over the second region and is configured to direct a first optical signal upwardly and away from the photonic component. The reinforcement element is disposed over the first region.

Abstract: The present disclosure provides an electronic device. The electronic device includes a sensor and a bionic structure. The sensor is configured to detect an object and to generate a sensing signal. The bionic structure includes a plurality of contact surfaces. The bionic structure is configured to select one of the plurality of contact surfaces to contact the object in response to the sensing signal from the sensor.

Abstract: A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first circuit layer, a second circuit layer under the first circuit layer, a first electronic component between the first circuit layer and the second circuit layer and connected to the first circuit layer and a sub-package between the first circuit layer and the second circuit layer and connected to the second circuit layer. The sub package comprises a second electronic component under the first electronic component and a conductive structure configured to dissipate heat generated from the first electronic component.

Abstract: The present disclosure relates to an electronic device. The electronic device includes a first sensing element and a second sensing element. The first sensing element is configured to detect a distance to an object to be grabbed on a first scale. The second sensing element is configured to detect the distance to the object on a second scale. A precision of the second scale is different than that of the first scale.

Abstract: An electronic device and method of manufacturing the same are provided. The electronic device includes a carrier and an electronic component. The carrier includes a first conductive layer, wherein the first conductive layer includes a non-nanotwin copper layer and has an average grain size equal to or less than about 150 nm. The electronic component includes a pad electrically connected to the first conductive layer. The pad of the electronic component and the first conductive layer define a copper-to-copper bond.

Abstract: An electronic device and method of manufacturing the same are provided. The electronic device includes a carrier, a conductive layer over the carrier, and an optical component. The optical component includes an electrode bonded to the conductive layer. An average grain size of the electrode is greater than an average grain size of the conductive layer.

Abstract: An electronic device and method of manufacturing the same are provided. The electronic device includes a carrier, a first conductive layer, and a cover. The carrier has a first upper surface and a second upper surface at an elevation higher than that of the first upper surface. The first conductive layer is disposed over the second upper surface. The cover is disposed over the first conductive layer. The carrier, the first conductive layer, and the cover define a hermetic space. The first conductive layer includes a non-nanotwin copper layer and has an average grain size equal to or less than about 150 nm.

Abstract: The present disclosure provides a bionic mechanical sensor. The bionic mechanical sensor includes a first rotatable region, a second rotatable region, an encapsulant, a plurality of sensors, and a conductive element. The encapsulant covers the first rotatable region and the second rotatable region and is exposed to an external environment. The plurality of sensors are within the first rotatable region and the second rotatable region. The conductive element is electrically connected to the plurality of sensors and embedded within the encapsulant.

Abstract: The present disclosure relates to an electronic device. The electronic device includes a substrate and a chip antenna disposed over the substrate at a first elevation with respect to the substrate. The first elevation is greater than a thickness of the chip antenna. The chip antenna is configured to radiate a first signal through a first electrical path.

Abstract: An electronic device is provided. The electronic device includes a carrier and a protection layer. The carrier has a predetermined region and includes a pad disposed in the predetermined region. The protection layer is disposed over the carrier and defines the predetermined region. The protection layer is configured to block an encapsulation layer from covering the pad.

Abstract: The present disclosure provides an electronic device. The electronic device includes a first interposer, a first interconnection array, a first shielding wall, and a second interconnection array. The first interconnection array is disposed in the first interposer and electrically connected to ground. The first shielding wall continuously extends at a side of the first interconnection array. The second interconnection array is disposed between the first shielding wall and the first interconnection array. The second interconnection array is configured to transmit a signal.

Abstract: The present disclosure provides an electronic device. The electronic device includes a carrier, a connector structure, and a first antenna structure. The carrier has a first surface and a second surface opposite to the first surface. The connector structure is disposed over the second surface of the carrier and defines at least one first recess configured to accommodate an external device. The first antenna structure is in directly contact with the connector structure.