Abstract: A low pressure Ultra Violet (UV) light source produces a high intensity output proportional to the inside diameter and length of a arc discharge column. The light source includes a cathode and anode contained within a high density ceramic body and a sapphire window mounted in line with the arc discharge column. The anode is in line with the arc column at the end opposite the sapphire window, and the cathode is disposed to an area outside the arc discharge column to which the arc moves through an aperture in the side of the arc discharge column structure. As the electrons move through the low pressure gas ionization of the gas occurs releasing photons in the UV region of the spectrum. The sum of the photons generated at each location along the arc discharge column produces the high intensity UV radiation that exits the lamp through a sapphire window.

Abstract: Embodiments of the invention provide silicon-based nanoparticle composites, where the silicon nanoparticles are highly luminescent. Preferred embodiments of the invention are Si—O solid composite networks, e.g., glass, having a homogenous distribution of luminescent hydrogen terminated silicon nanoparticles in a homogenous distribution throughout the solid. Embodiments of the invention also provide fabrication processes for silicon-based silicon nanoparticle composites. A preferred method for forming a silicon-based nanoparticle composite disperses hydrogen terminated silicon nanoparticles and an inorganic precursor of an organosilicon gel in an aprotic solvent to form a sol. A catalyst is mixed into the sol. The sol is then permitted to dry into a gel of the silicon-based nanoparticle composite.

Abstract: Embodiments disclosed herein utilize Habitats to perform incremental updates on virtual machines (VMs) over time. A VM Habitat comprises a collection of VMs and a specification shared between these VMs. Each Habitat specification may define an image name, processing power, etc. A Habitat specification may exist across a cluster of servers. In some embodiments, to dynamically update a Habitat specification, only “spare” VMs in the Habitat are updated, subject to some scheduling parameters and server concurrency limit. As spare VMs are updated, they move towards the new Habitat specification. Eventually, all VMs reach this goal over time, given sufficient spare VM resources. This approach can allow the service provided by the VMs to remain operational, thus maintaining the service level required for its users. This automated process can also eliminate or otherwise reduce human error either in the server removal/insertion from/to the cluster or in the VM update itself.

Abstract: A reverse-flow nozzle generates a cavitating and/or pulsed jet of pressurized liquid. The nozzle includes a body having an inlet for receiving a stream of liquid and a main channel through the body extending from the inlet to an outlet. A flow-reversing channel in the nozzle diverts a portion of the liquid from the main channel to a point downstream of a mixing chamber. The channel returns the diverted liquid back into the mixing chamber as a reverse-flow jet relative to a main stream of liquid flowing toward the outlet. This reverse-flow jet interacts with the main stream to generate the cavitating jet that discharges from the outlet. By angling the reverse-flow jet relative to the main stream, a naturally pulsed jet may be generated.

Abstract: A hinge assembly including a first hinge leaf hingedly connected to a second hinge leaf by a hinge pin (14), the hinge pin (14) being rotatably mounted in one hinge leaf (12) non-rotatably mounted in the other hinge leaf (11), and a check mechanism (30) operably connected to the hinge pin (14) and said one hinge leaf (12) to releasably hold the first and second hinge leaves (11, 12) at at least one angular position about the hinge axis, the check mechanism (30) including check means (32) resiliently biased in a radial direction relative to the hinge axis and into contact with an annular cam track (34) formed on a reaction member (33), the check means (32) being driven along said annular cam (34) by relative rotation between said first an second hinge leafs (11, 12), the cam track (34) including at desired locations therealong one or more check formations (38) which cooperate with said check means (32) to releasably retain the first and second hinge leafs (11, 12) at a desired angular position relative to one

Abstract: An embodiment of the invention is luminescent silicon nanoparticle polymer composite that can serve as a wavelength converter or a UV absorber. The composite includes a polymer or an organosilicon compound; and within the polymer or organosilicon compound, a dispersion of luminescent silicon nanoparticles. In a preferred composite, the silicon nanoparticles have multiple Si—H termination sites, the silicon nanoparticles being linked to a C site to produce a silicon carbide bond (Si—C). In a preferred embodiment, the polymer comprises polyurethane. A composite of the invention can perform wavelength conversion. In a wavelength converted film of the invention, the silicon nanoparticles are incorporated into the polymer or organosilicon compound in a quantity sufficient for wavelength conversion but small enough to have no or an insubstantial effect on the properties of the polymer or the organosilicon compound. A white LED of the invention includes a light emitting diode having a narrow band wavelength output.

Abstract: A method for manufacturing a multilayer FPCB includes the steps of: providing a first substrate, a second substrate and a binder layer; defining an opening on the binder layer; defining a first slit in the dielectric layer of the first substrate; laminating the first substrate, the binder layer and the second substrate; forming a second slit in the conductive layer of the first substrate, the second slit is configured to be aligned with the first slit, cutting the first substrate, the binder layer and the second substrate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.

Abstract: An exemplary mounting support for a flexible printed circuit board is provided. The flexible printed circuit board has a side surface and at least one electronic component mounted on the side surface. The mounting support includes a first surface for contacting with the side surface of the flexible printed circuit board and a second surface on an opposite side of the mounting support to the first surface. The mounting support has at least one first recess defined in the first surface for receiving the at least one electronic component therein and at least one through-hole defined through the first surface and the second surface. The mounting support has at least one second recess defined in the second surface. The mounting support can fix a double surface mounted flexible printed circuit board flatly, thereby enhancing laser processing precision.

Abstract: An exemplary method for manufacturing flexible printed circuit board is provided. A metal foil is supplied from a first feeding roller. The metal foil has a first surface and a second surface on two opposite sides of the metal foil. A first coverlay having a number of first openings defined therein is supplied from a second feeding roller and laminated on the first surface of the metal foil. Electrical traces are formed with the metal foil. A second coverlay having a number of second openings defined therein is supplied from a third feeding roller and laminated on the second surface of the metal foil. Each of the second openings registers with the respective first opening so that the electrical traces are exposed from the corresponding first and second openings. The method can improve quality and efficiency of manufacturing flexible printed circuit boards in a hollowed out form.

Abstract: An electroplating method includes steps of: providing a substrate having a first portion and a second portion connected to the first portion; forming a metallic layer on a surface of the second portion; immersing the first portion of the substrate in an electrolyte solution, applying a current to the metallic layer to electroplate the first portion of the substrate with a metal layer; and moving the substrate in a direction away from the electrolyte solution during electroplating the first portion of the substrate. The method can improve a uniformity of the obtained plating layer.

Abstract: A flexible base includes a main region configured for forming flexible printed circuit board units; and two conveying regions respectively arranged on two sides of the main region. Each of the conveying regions includes an insulating substrate, a plurality of sprocket holes, and a patterned supporting layer. The sprocket holes are defined along a lengthwise direction of the insulating substrate. The patterned supporting layer is formed on the insulating substrate. The patterned supporting layer extends from an edge of each sprocket hole towards a periphery region of the corresponding sprocket.

Abstract: A method for manufacturing a printed circuit board (PCB) having different thicknesses in different areas includes: providing a first substrate having two lateral unwanted portions bounded two imaginary boundary lines, a binder layer having a through opening and a second substrate having a mounting area for mounting electronic elements; forming two slots bounded the imaginary boundary lines in an intermediated unwanted portion of the first substrate corresponding to the mounting area; laminating the first and second substrates, and the binder layer with the mounting area exposed via the through opening; filling the two slots and the through opening with a filling material, thereby obtaining a semifinished PCB board; cutting the semifinished PCB board along the imaginary boundary lines to remove the two lateral unwanted portions and a portion of the second substrate corresponding to the two lateral unwanted portions; and removing the intermediate unwanted portion and the filling material.

Abstract: A stiffener sheet for flexible printed flexible printed circuit boards, includes alternately laminated polyimide layers and polyamideimide layers, wherein a molecular structure of the polyamideimide is represented by the following formula: wherein Ar and Ar? represents different substituted aromatic groups.

Abstract: A process for preparing parenteral iron-saccharidic complexes, and the complexes produced, comprising: (1) providing an aqueous solution or dispersion including (i) Fe(III) and (OH)? ions and (ii) at least one saccharide, to form a reaction mixture, where the molar ratio of (i): (ii) is about 30:1 to about 1:30; and the mixture temperature and pH are at or above the complex assembly point (CAP); and (2) maintaining temperature and pH at or above the CAP for a time sufficient to form an iron-saccharidic complex having a molecular weight of about 25,000 Daltons or more. Control of the temperature and pH efficiently produces a high molecular weight complex. The complex can be separated by precipitation, dialysis and/or column fractionation and, if desired, dried, e.g., lyophilized or spray dried. The process can controllably synthesize complexes of varying molecular weight and/or chemical composition, particularly sodium ferric gluconate and ferric hydroxide-sucrose.

Abstract: The present invention relates to a method of cutting PCB module using a laser. The method includes steps of: providing a coverlay film, the coverlay film including at least one opening defined therein; attaching the coverlay film onto the PCB module such that the through holes of the PCB module are covered by the coverlay film and the laser cutting area thereof is exposed via the at least one opening; applying a laser beam to the exposed laser cutting area of the PCB module to cut the PCB module; and removing the coverlay film. A high positioning precision of the PCB module and better cutting result can be obtained.

Abstract: An electromagnetic absorber assembly capable of minimizing reflectivity caused by reflected and diffracted waves within a test chamber is presented. The absorber assembly includes a plurality of first wedges and a plurality of second wedges disposed in a symmetrical arrangement so as to form a continuous and smoothly changing v-shaped pattern along one or more walls of an anechoic test chamber. Each wedge has a triangular-shaped first end and second end formed by a pair of side walls and a base wall. One second end of each first wedge contacts and covers one first end of each second wedge along a contact plane. First and second wedges are disposed at a first angle and a second angle, respectively, about the contact plane in a symmetrical arrangement. The assemblies described could be installed on a flat or shaped absorber base or wall to divert reflected and refracted fields away from a quiet zone.

Abstract: In one embodiment, a holder for holding printed circuit boards includes a base plate with a plurality of holding unit formed thereon. Each of the holding units includes a spring member, a securing member, and a blocking structure. The spring member includes a first end and a second end. The first end is attached to the base plate. The securing member is slideably mounted on the base plate. The securing member includes a connecting end and a securing end. The connecting end is connected with the second end of the spring member. The blocking structure is located on the base plate. The spring member is configured for pressing the securing member to move toward the blocking structure such that a printed circuit board is retainable between the securing end of the securing member and the blocking structure on the base plate. The holder is capable of holding printed circuit boards in batches.

Abstract: In one embodiment, a holder for holding a flexible printed circuit board includes a main body and at least one securing member. The main body includes a hook portion and a holding member, wherein one of the securing member and the holding member comprises at least one magnet, and the other comprises at least one magnetic portion, at least one magnet or combination thereof such that the securing member capable of being magnetically attached to the holding member.

Abstract: The present inventions relates to a method for manufacturing a multilayer FPCB having different number of layers in different areas. The method includes the steps of: providing a binder layer; removing a portion of the binder layer thereby defining an opening in the binder layer; forming a multilayer FPCB which having a first copper clad laminate structure and a second copper clad laminate structure disposed on two opposite sides of the binder layer respectively using the binder layer; cutting the first copper clad laminate structure; cutting the multilayer FPCB in manner that a portion of first copper clad laminate structure that is exposed to the opening is separated from the first copper clad structure thereby obtain a multilayer FPCB having different number of layers in different areas.

Abstract: A method for plating a FPCB base board, comprising the steps of: providing a FPCB base board comprising a sprocket region; and placing an insulation shielding plate spatially opposite to the sprocket region of the FPCB base board to limit a thickness of a plating layer formed on the sprocket region of the FPCB base board.