Abstract: A vehicle hinge assembly (10) for hanging a vehicle door on a vehicle body. The assembly (10) comprises a first hinge leaf (12) hingedly connected to a second hinge leaf (14) by a pivot pin (15). The pivot pin (15) is immovably mounted in one hinge leaf (14) and is rotatably mounted in, and axially withdrawable from, the other hinge leaf (12). Hinge pin retention means (35) is associated with the other hinge leaf (12) for preventing axial withdrawal of the hinge pin (15) therefrom. The hinge pin retention means (35) having hinge pin engagement means (38) movably mounted between first and second positions. The engagement means (38) in its first position engages with the hinge pin (15) to permit rotation of the hinge pin (15) but prevent its axial movement relative to the other hinge leaf (12). The engagement means (38) in its second position is spaced from the hinge pin (15) to permit its axial withdrawal from the other hinge leaf (12).

Abstract: A method for assembling an electronic component on a printed circuit board includes following steps. Firstly, a printed circuit board substrate including a central main portion and a peripheral unwanted portion is provided. Secondly, electrically conductive patterns and reinforcing patterns are formed on the main portion and the unwanted portion respectively. Thirdly, an electronic component is mounted on the main portion and electrically connected with the electrically conductive patterns. Fifthly, the unwanted portion is removed.

Abstract: Embodiments of the invention provide organosilicon silicon nanoparticle composites, where the silicon nanoparticles are highly luminescent. Preferred embodiments of the invention are Si—O solid composite networks, e.g., glass, having a homogenous distribution of luminescent hydrogen terminated silicon nanoparticles in a homogenous distribution throughout the solid. Embodiments of the invention also provide fabrication processes for organosilicon silicon nanoparticle composites. A preferred method for forming an organosilicon nanoparticle composite disperses hydrogen terminated silicon nanoparticles and an inorganic precursor of an organosilicon gel in an aprotic solvent to form a sol. A catalyst is mixed into the sol. The sol is then permitted to dry into a gel of the organosilicon nanoparticle composite.

Abstract: A method for manufacturing a rigid-flexible printed circuit boards includes following steps. Firstly, a flexible substrate is provided. Secondly, at least one slit is defined in the flexible substrate. Thirdly, a rigid substrate having a structure corresponding to the flexible substrate is provided. Fourthly, the flexible substrate is laminated to the rigid substrate to obtain a laminated substrate. Fifthly, part of the rigid substrate is removed. Sixthly, the laminated substrate is cut along an imaginary boundary line to remove waste portion of the laminated substrate. Thus, a rigid-flexible printed circuit board is obtained.

Abstract: An apparatus (100) for spraying an etchant solution on a preformed printed circuit board (30) includes a number of feed pipes (40) for supplying the etchant solution and a number of nozzles (45) mounted on the feed pipes. Each of the feed pipes has a middle portion (402) and two end portions (401). The middle portions of the feed pipes are located on a first plane and the end portions of the feed pipes are located on a second plane parallel to the first plane. The number of nozzles are mounted on the middle portion and the two end portions of each feed pipe. The number of nozzles are in fluid communication with the feed pipes.

Abstract: An exemplary film hole forming apparatus (400) includes a chemical etching system (410) and a driving system (420). The driving system includes a transmission belt, which passes through the chemical etching system. A material of the transmission belt is polytetrafluoroethylene, polytetrafluoroethylene-containing material, polyvinylidene fluoride, metal, or metal-sandwiched composite. An exemplary method for forming film holes includes the following steps: providing a flexible printed circuit board (300) to be etched, with copper holes (321) pre-formed thereat and the copper holes exposing a base film (310) at corresponding positions; and transporting the flexible printed circuit board into a chemical etching system by a transmission belt to form film holes in the base film.

Abstract: An exemplary apparatus for wet processing a substantially rectangular substrate includes a conveyor, a supporting mechanism, an adjusting mechanism, a processing module and a dosing system. The conveyor is configured for conveying the substrate to a wet process work station. The supporting mechanism is configured for supporting the substrate away from the conveyor. The adjusting mechanism is configured for adjusting the orientation of the substrate. The processing module is configured for obtaining an area of a surface of the substrate. The dosing system communicates with the processing unit, and is configured for dispensing a corresponding amount of wet processing liquid to the substrate to wet process the substrate according to the area of the surface of the substrate from the processing module.

Abstract: The present invention is directed to the use of electromagnetic radiation, acoustic energy, and surfactant injection to recover hydrocarbon-containing materials from a hydrocarbon-bearing formation.

Abstract: A method for separating and purifying the active hematinic species (AHS) present in iron-saccharidic compositions, including AHS such as sodium ferric gluconate complex, ferric hydroxide-sucrose complex and ferric saccharate complex and others of similar form and function. The method separates the AHS from one or more excipients and, preferably, lyophilizes the separated AHS. Separation of the AHS permits its analytical quantification, further concentration, purification and/or lyophilization as well as preparation of new and useful products and pharmaceutical compositions, including those useful for the treatment of humans and animals.

Abstract: An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line of weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other.

Abstract: An apparatus for forming a metal article includes a station which receives and supports a workpiece. The station has a source of electrical current and a source of a fluid. The station further includes a first and a second electrode clamp. Each clamp is in electrical communication with the source of current and in fluid communication with the source of fluid. The clamps engage a workpiece and deliver an electrical current and a fluid thereto. The system includes an actuator mechanically associated with at least one of the clamps. The actuator is operable in combination with a clamp to apply mechanical force to the workpiece. The system is operable to selectably control the temperature profile and/or ambient conditions of a workpiece during forming or processing steps. Disclosed are specific systems including modular systems. Also disclosed are methods for using the systems.

Abstract: A roll-formed one-piece vehicle bed member has a plurality of ribs and valleys extending longitudinally along the bed member in sidewardly adjacent, parallel relation. The bed member terminates at front and rear edges wherein preferably along the rear edge of the bed member, rib channels are formed centrally along the end portion of each rib for direct contacting engagement with a rear sill to provide an improved connection therebetween.

Abstract: An exemplary adhesive layer includes an adhesive main body having a first adhesive surface and a second adhesive surface on an opposite side of the adhesive main body to the first adhesive surface. The adhesive main body defines a number of through-holes between the first adhesive surface and the second adhesive surface therein. The through-holes are filled with an inner adhesive that has a higher adhesion than the adhesive main body. Adhesiveness of the first adhesive surface and the second adhesive surface of the adhesive main body can be improved, thereby preventing a printed circuit board having the adhesive layer from distortion.

Abstract: The invention provides homogenous dispersions of luminescent silicon nanoparticles in organoslicoon compounds, fatty acids and oils. In methods of the invention, a fatty acid or oil and silicon nanoparticle homogenous dispersion is formed by mixing. The dispersion of nanoparticles in organosilicon compounds, fatty acid(s) or oil(s) can used as a delivery mechanism to homogenously incorporate the nanoparticles into a variety of cosmetic compounds and oils, such as foundation creams and other make-up products, sun tan lotions, sun tan oils, etc. Compounds of the invention with homogenous nanoparticle dispersions display homogeneous UV/blue absorption as well as down conversion to visible luminescence. The compounds can be tailored to exhibit white luminescence under UV illumination. Preferred skin care compounds provide a pleasing cosmetic effect in response to light. Preferred skin care compounds also provide uv protection.

Abstract: A method for forming electrical traces on a substrate includes the steps of: providing a substrate; printing an ink pattern using an ink on the substrate, the ink including a aqueous medium containing silver ions and a heat sensitive reducing agent; heating the ink pattern to reduce silver ions into silver particles thereby forming an semi-finished traces; and forming a metal overcoat on the semi-finished traces by electroless plating thereby obtaining patterned electrical traces.

Abstract: A method for providing a controlled heating profile in an article being heated in a resistance heating process is provided. The method includes contacting the article with a plurality of electrodes, selecting a first correlated group that includes at least two electrodes, and establishing a flow of electrical current between the electrodes of the first correlated group. The method also includes selecting a second correlated group that includes at least two electrodes, the second correlated group differing from the first correlated group. A flow of electrical current is also established between the electrodes of the second correlated group for the purpose of providing a controlled heating profile for an article undergoing resistance heating.

Abstract: A system providing methodology for policy-based resource allocation is described. In one embodiment, for example, a system for allocating computer resources amongst a plurality of applications based on a policy is described that comprises: a plurality of computers connected to one another through a network; a policy engine for. specifying a policy for allocation of resources of the plurality of computers amongst a plurality of applications having access to the resources; a monitoring module at each computer for detecting demands for the resources and exchanging information regarding demands for the resources at the plurality of computers; and an enforcement module at each computer for allocating the resources amongst the plurality of applications based on the policy and information regarding demands for the resources.

Abstract: An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other. An exemplary method for manufacturing multilayer printed circuit boards using the inner substrate is also provided. The method can improve efficiency of manufacturing multilayer printed circuit boards.

Abstract: A method for separating and purifying the active hematinic species (AHS) present in iron-saccharidic compositions, including AHS such as sodium ferric gluconate complex, ferric hydroxide-sucrose complex and ferric saccharate complex and others of similar form and function. The method separates the AHS from one or more excipients and, preferably, lyophilizes the separated AHS. Separation of the AHS permits its analytical quantification, further concentration, purification and/or lyophilization as well as preparation of new and useful products and pharmaceutical compositions, including those useful for the treatment of humans and animals.

Abstract: A method of water desalination and purification includes steps of flowing salted or contaminated water concentration into a narrow or pointed portion of a corona electrode; applying an electrical potential difference between the water and an opposite electrode; generating a corona discharge in the narrow or pointed portion; evaporating the water; electrically charging water droplets and molecules formed by the evaporating step by means of the corona discharge; moving the charged droplets and molecules toward the oppositely charged electrode; condensing fresh water; and collecting fresh water. A corresponding desalination device includes a corona electrode; at least one attracting electrode; a power supply generating electrical potential difference between the corona electrode and the attracting electrode; and at least one water condensing member.