Abstract: An innovative method of prepping a surface entails entraining a coating particle into a fluid stream, directing the fluid stream containing the coating particle at the surface to be prepped to thereby prep the surface using the coating particle. The prepped surface can then be coated using the same or substantially similar coating particle. This method can be used with a continuous airjet, a forced pulsed airjet, a continuous waterjet or a forced pulsed waterjet as the carrier stream. This invention solves the problem of foreign blasting particles becoming embedded in the atomic matrix of the surface to be prepped, which can result in unpredictable behavior of the surface properties and even catastrophic failure.

Abstract: Embodiments of the invention provide silicon-based nanoparticle composites, where the silicon nanoparticles are highly luminescent. Preferred embodiments of the invention are Si—O solid composite networks, e.g., glass, having a homogenous distribution of luminescent hydrogen terminated silicon nanoparticles in a homogenous distribution throughout the solid. Embodiments of the invention also provide fabrication processes for silicon-based silicon nanoparticle composites. A preferred method for forming a silicon-based nanoparticle composite disperses hydrogen terminated silicon nanoparticles and an inorganic precursor of an organosilicon gel in an aprotic solvent to form a sol. A catalyst is mixed into the sol. The sol is then permitted to dry into a gel of the silicon-based nanoparticle composite.

Abstract: Embodiments disclosed herein utilize Habitats to perform incremental updates on virtual machines (VMs) over time. A VM Habitat comprises a collection of VMs and a specification shared between these VMs. Each Habitat specification may define an image name, processing power, etc. A Habitat specification may exist across a cluster of servers. In some embodiments, to dynamically update a Habitat specification, only “spare” VMs in the Habitat are updated, subject to some scheduling parameters and server concurrency limit. As spare VMs are updated, they move towards the new Habitat specification. Eventually, all VMs reach this goal over time, given sufficient spare VM resources. This approach can allow the service provided by the VMs to remain operational, thus maintaining the service level required for its users. This automated process can also eliminate or otherwise reduce human error either in the server removal/insertion from/to the cluster or in the VM update itself.

Abstract: A method for separating and purifying the active hematinic species (AHS) present in iron-saccharidic compositions, including AHS such as sodium ferric gluconate complex, ferric hydroxide-sucrose complex and ferric saccharate complex and others of similar form and function. The method separates the AHS from one or more excipients and, preferably, lyophilizes the separated AHS. Separation of the AHS permits its analytical quantification, further concentration, purification and/or lyophilization as well as preparation of new and useful products and pharmaceutical compositions, including those useful for the treatment of humans and animals.

Abstract: A reverse-flow nozzle generates a cavitating and/or pulsed jet of pressurized liquid. The nozzle includes a body having an inlet for receiving a stream of liquid and a main channel through the body extending from the inlet to an outlet. A flow-reversing channel in the nozzle diverts a portion of the liquid from the main channel to a point downstream of a mixing chamber. The channel returns the diverted liquid back into the mixing chamber as a reverse-flow jet relative to a main stream of liquid flowing toward the outlet. This reverse-flow jet interacts with the main stream to generate the cavitating jet that discharges from the outlet. By angling the reverse-flow jet relative to the main stream, a naturally pulsed jet may be generated.

Abstract: Embodiments of the invention provide, among other things, a method of preparing nanoparticles including silicon nanoparticles. A mixture is prepared that includes auric acid (HAuCl4) and HF. A silicon substrate is exposed to the prepared mixture to treat the silicon substrate. The treated silicon substrate is immersed in an etchant mixture, wherein nanoparticles are formed on a surface of the substrate. The nanoparticles are recovered from the substrate.

Abstract: A clamping apparatus includes a receiving frame, a guide plate, two drive assemblies, and two clamping assemblies. The receiving frame includes two parallel securing arms and a connection arm. The securing arms and the connection arm define a first receiving space. Each of the securing arms defines a slot. The guide plate is configured for mounting of a workpiece thereon. The drive assemblies are configured for cooperatively moving the guide plate between a first position and a second position. When the guide plate is located at the first position, the workpiece is loaded on the guide plate and distant from the connection arm. When the guide plate is located at the second position, the workpiece is adjacent to the connection arm and entirely received in the first receiving space and the slots. The clamping assemblies are configured for cooperatively clamping the workpiece.

Abstract: A method and system for loading and centering a crucible in a furnace is disclosed. The method comprises, in part, the steps of centering a rail loader over a furnace bottom; placing the crucible on the rail loader; and moving the crucible over the crucible block in the center of the furnace bottom. A rail loader system that is capable of centering the crucible in the furnace is also disclosed.

Abstract: An exemplary wet processing apparatus includes a tank, a conveyor configured for conveying a substrate, and a spraying system. The tank receives a wet processing liquid. The conveyor includes a first conveying portion, a second conveying portion, and a third conveying portion. The first conveying portion is in the tank and conveys the substrate in the wet processing liquid. The second conveying portion is obliquely interconnected between the first and third conveying portions. The third conveying portion conveys the substrate above the wet processing liquid in the tank. The spraying system is above the third conveying portion, sprays the wet processing liquid onto the substrate on the third conveying portion.

Abstract: A method for screen printing a printed circuit board substrate comprises the following steps. A printed circuit board substrate including a copper foil layer is provided. Pluralities of marks are formed on the copper foil layer. A plurality of printing screens are provided, each includes an screen pattern and an opening corresponding to a respective mark. Printing material is applied on the ith screen Si to form an ith printing pattern and cover the ith mark at the ith opening, the ith printing pattern conforms to the ith screen pattern; checking whether the ith mark is covered by the printing material when i is less than N. Printing material is applied on the (i+1)th screen Si+1 so as to form an (i+1)th printing pattern on the copper foil layer and covers the (i+1)th Mark Mi+1 at the (i+1)th opening, if the ith mark is covered by the printing material.

Abstract: A printed circuit board comprises a circuit substrate, an electrically conductive cloth structure, and a shielding structure. The circuit substrate comprises a base layer, a grounded circuit layer, and a connecting pad formed on the grounded circuit layer. The cloth structure comprises an anisotropic conductive adhesive connected to the connecting pad, an insulating layer, and a metallic deposition layer arranged between the anisotropic conductive adhesive and the insulating layer. The shielding structure comprises a shielding metal layer, an adhesive matrix, and a number of electrically conductive particles electrically connected to the shielding metal layer. The insulating layer defines a number of through holes corresponding to the particles, the particles is arranged in the through holes respectively and electrically connected the metallic deposition layer and the shielding metal layer. A method for manufacturing the above PCB is also provided.

Abstract: In a method for manufacturing a printed circuit board, a substrate, including a number of plated through holes (PTHs) is provided. Each of the PTHs has an electrically conductive layer plated on its inner wall and includes an electrically connecting portion and a stub. A protective layer is formed on a surface of the substrate adjacent to the stub. An etching device, including an upper plate and a number of spray tubes corresponding to the PTHs, is provided. Each of the spray tubes includes a protruding portion beyond the upper plate. The substrate is arranged in such a manner that the protective layer is in contact with the upper plate and the protruding portions are received in the stubs. After that, the protruding portions spray an etchant to etch and remove the electrically conductive layer of the stubs, and the protective layer is removed.

Abstract: An electroplating apparatus includes an electroplating tank, a first anode plate, a first cathode plate, a second cathode plate, a number of first and second elastic elements, a number of pairs of clamping assemblies, a first drive member, and a second drive member. The electroplating tank holds an electrolyte solution. The first elastic elements are interconnected between the first anode plate and the first cathode plate. The second elastic elements are interconnected between the first anode plate and the second cathode plate. Each pair of clamping assemblies are used to clamp opposite ends of a plated-shaped workpiece. The first drive member and the second drive member are used to cooperatively move the clamping assemblies.

Abstract: A hinge assembly including a first hinge leaf hingedly connected to a second hinge leaf by a hinge pin (14), the hinge pin (14) being rotatably mounted in one hinge leaf (12) non-rotatably mounted in the other hinge leaf (11), and a check mechanism (30) operably connected to the hinge pin (14) and said one hinge leaf (12) to releasably hold the first and second hinge leaves (11, 12) at at least one angular position about the hinge axis, the check mechanism (30) including check means (32) resiliently biased in a radial direction relative to the hinge axis and into contact with an annular cam track (34) formed on a reaction member (33), the check means (32) being driven along said annular cam (34) by relative rotation between said first an second hinge leafs (11, 12), the cam track (34) including at desired locations therealong one or more check formations (38) which cooperate with said check means (32) to releasably retain the first and second hinge leafs (11, 12) at a desired angular position relative to one

Abstract: In a method for manufacturing multilayer PCBs having n circuit layers, a flexible substrate strip is provided. The strip comprises a number of PCB units, each comprising n segmental portions. The strip is treated in a reel to reel process to form traces in n?2 segmental portions of each of the PCB units, the other two segmental portions are left untreated without traces. Then the strip is cut to obtain a number of separated PCB units. The PCB unit is folded in such a manner that the n?2 segmental portions having traces are arranged between the other two segmental portions without traces. The folded PCB unit is laminated to form a multilayer substrate and traces are formed in the two segmental portions.

Abstract: A method for manufacturing multilayer printed circuit board includes steps below. A first copper clad laminate includes a central portion and a peripheral portion is provided. A group of concentric copper annular collars is formed by etching the peripheral portion. A second copper clad laminate and an adhesive layer is laminated on to the first copper clad laminate in a manner that the adhesive is sandwiched between the first copper clad laminate and the second copper clad laminate to form a multilayer substrate. A detection hole is formed run through the multilayer substrate. An offset distance is determined and plated through holes in the central portion of the multilayer substrate is formed based on the offset distance.

Abstract: A method for manufacturing a printed circuit board with cavity includes following steps. First, a first substrate is provided. The first substrate includes a first electrically conductive layer defining an exposed portion and a laminating portion. Second, a second substrate is provided. The second substrate includes an unwanted portion corresponding to the exposed portion and a preserving portion. Third, a first annular bump surrounding the exposed portion is formed. Fourth, a second annular bump surrounding the unwanted portion is formed. Fifth, a first adhesive layer defining an opening is provided. Sixth, the first and second substrates are laminated to the first adhesive layer, the exposed portion and the unwanted portion are exposed in the opening, and the second annular bump is in contact with the first annular bump. Seventh, the unwanted portion is removed and a cavity is defined, the exposed portion is exposed in the cavity.

Abstract: An embodiment of the invention is luminescent silicon nanoparticle polymer composite that can serve as a wavelength converter or a UV absorber. The composite includes a polymer or an organosilicon compound; and within the polymer or organosilicon compound, a dispersion of luminescent silicon nanoparticles. In a preferred composite, the silicon nanoparticles have multiple Si—H termination sites, the silicon nanoparticles being linked to a C site to produce a silicon carbide bond (Si—C). In a preferred embodiment, the polymer comprises polyurethane. A composite of the invention can perform wavelength conversion. In a wavelength converted film of the invention, the silicon nanoparticles are incorporated into the polymer or organosilicon compound in a quantity sufficient for wavelength conversion but small enough to have no or an insubstantial effect on the properties of the polymer or the organosilicon compound. A white LED of the invention includes a light emitting diode having a narrow band wavelength output.

Abstract: An electronic component device for electrically and mechanically connecting to a lead wire includes a base and a cover. The base includes a receiving body, at least one electronic component, and two spaced stripping connectors. The receiving body defining an installation groove. The at least one electronic component and the stripping connectors are received in the receiving body. Each stripping connector is in electrically connected with the at least one electronic component. The stripping connector defines a stripping slot for extension of the core therethrough, which has a size smaller than or equal to the diameter of the core. The cover includes a pressing surface and an electrically insulating cutting body. The cutting body is used for cutting off the lead wire. The pressing surface is configured for pressing the lead wire into the stripping slot, thus making the core in electrical connection with the at least one electronic component.

Abstract: A method for manufacturing printed circuit board includes steps below. An inner substrate including a first electrically conductive layer is provided. A first electrically conductive pattern is formed in the first electrically conductive layer. The first electrically conductive pattern includes an exposed region and an attaching region. A protective layer is formed on the entire exposed region. A first adhesive layer and a second electrically conductive layer are laminated on a surface of the first electrically conductive pattern in the attaching region and a surface of the protective layer. A slit along a boundary of the exposed region passing through the second electrically conductive pattern and the first adhesive layer is defined. The second electrically conductive layer corresponding to the exposed region, the first adhesive layer corresponding to the exposed region and the protective layer is removed.