Patents Assigned to Advanced Technology Materials, Inc.
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Patent number: 9546321Abstract: Compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to metal conducting, e.g., tungsten, and insulating materials from a microelectronic device having same thereon. The removal compositions contain at least one oxidant and one etchant, may contain various corrosion inhibitors to ensure selectivity.Type: GrantFiled: December 27, 2012Date of Patent: January 17, 2017Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.Inventors: Jeffrey A. Barnes, Emanuel I. Cooper, Li-Min Chen, Steven Lippy, Rekha Rajaram, Sheng-Hung Tu
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Patent number: 9528078Abstract: An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.Type: GrantFiled: March 25, 2014Date of Patent: December 27, 2016Assignee: Advanced Technology Materials, Inc.Inventors: David Angst, Peng Zhang, Jeffrey Barnes, Prerna Sonthalia, Emanuel Cooper, Karl Boggs
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Patent number: 9520617Abstract: An improved solvent containing sulfolane and at least one dialkyl sulfone, preferably dimethyl sulfone, wherein the improved solvent is a liquid at room temperature and can be used for reaction media and electrochemistry.Type: GrantFiled: March 14, 2014Date of Patent: December 13, 2016Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.Inventor: Emanuel I. Cooper
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Patent number: 9476019Abstract: A cleaning agent for a microelectronic device provided with metal wiring, which has an excellent ability to remove polishing particle residues derived from a polishing agent and an excellent ability to remove metallic residues on an insulating film, and has excellent anticorrosiveness to the metal wiring. The cleaning agent is used at a step subsequent to chemical mechanical polishing in a manufacturing process of a microelectronic device in which a metal wiring, e.g., copper or tungsten, is formed.Type: GrantFiled: May 29, 2015Date of Patent: October 25, 2016Assignee: Advanced Technology Materials, Inc.Inventors: Mutsumi Nakanishi, Hiroshi Yoshimochi, Yukichi Koji
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Patent number: 9443713Abstract: An oxidizing aqueous cleaning composition and process for cleaning post-plasma etch residue and/or hardmask material from a microelectronic device having said residue thereon. The oxidizing aqueous cleaning composition includes at least one oxidizing agent, at least one oxidizing agent stabilizer comprising an amine species selected from the group consisting of primary amines, secondary amines, tertiary amines and amine-N-oxides, optionally at least one co-solvent, optionally at least one metal-chelating agent, optionally at least one buffering species, and water. The composition achieves highly efficacious cleaning of the residue material from the microelectronic device while simultaneously not damaging the interlevel dielectric and metal interconnect material also present thereon.Type: GrantFiled: July 1, 2014Date of Patent: September 13, 2016Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.Inventors: David W. Minsek, Michael B. Korzenski, Martha M. Rajaratnam
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Metal and dielectric compatible sacrificial anti-reflective coating cleaning and removal composition
Patent number: 9422513Abstract: A liquid removal composition and process for removing sacrificial anti-reflective coating (SARC) material from a substrate having same thereon. The liquid removal composition includes at least one fluoride-containing compound, at least one organic solvent, optionally water, and optionally at least one chelating agent. The composition achieves at least partial removal of SARC material in the manufacture of integrated circuitry with minimal etching of metal species on the substrate, such as aluminum, copper and cobalt alloys, and without damage to low-k dielectric materials employed in the semiconductor architecture.Type: GrantFiled: December 2, 2014Date of Patent: August 23, 2016Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.Inventors: Melissa K. Rath, David D. Bernhard, Thomas H. Baum, David W. Minsek -
Publication number: 20160236806Abstract: The present disclosure relates to an integrated liner-based system having an overpack and a liner provided within the overpack, the liner comprising a mouth and a liner wall forming an interior cavity of the liner and having a thickness such that the liner is substantially self-supporting in an expanded state, but is collapsible at a pressure of less than about 20 psi. The liner and overpack may be made by blow molding the liner and the overpack at the same time using nested preforms.Type: ApplicationFiled: April 27, 2016Publication date: August 18, 2016Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.Inventors: Glenn Tom, Greg Nelson, Wei Liu, Amy Koland, Don Ware, Daniel J. Durham, Tracy M. Momany, Chantel Ortega
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Patent number: 9416338Abstract: Cleaning compositions and processes for cleaning residue from a microelectronic device having said residue thereon. The composition comprises at least one amine, at least one oxidizing agent, water, and at least one borate species and achieves highly efficacious cleaning of the residue material, including post-ash residue, post-etch residue, post-CMP residue, particles, organic contaminants, metal ion contaminants, and combinations thereof from the microelectronic device while simultaneously not damaging the titanium nitride layers and low-k dielectric materials also present on the device.Type: GrantFiled: October 13, 2011Date of Patent: August 16, 2016Assignees: ADVANCED TECHNOLOGY MATERIALS, INC., INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Emanuel I. Cooper, George Gabriel Totir, Makonnen Payne
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Patent number: 9340760Abstract: A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions are substantially devoid of amine and ammonium-containing compounds, e.g., quaternary ammonium bases. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.Type: GrantFiled: June 16, 2014Date of Patent: May 17, 2016Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.Inventors: Jeffrey A. Barnes, Jun Liu, Peng Zhang
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Publication number: 20160130500Abstract: Compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to metal conducting, e.g., cobalt, ruthenium and copper, and insulating materials from a microelectronic device having same thereon. The removal compositions contain at least one oxidant and one etchant, may contain various corrosion inhibitors to ensure selectivity.Type: ApplicationFiled: June 6, 2014Publication date: May 12, 2016Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.Inventors: Li-Min CHEN, Steven LIPPY, Emanuel I Cooper, Lingyan Song
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Patent number: 9290296Abstract: The present disclosure relates to a blow-molded, rigid collapsible container that can be suitable for storage and dispensing systems of practically any size. The rigid collapsible container may be a stand-alone container. The container may be blow-molded as a unitary piece that may include folds or pre-folds that allows the container to collapse into a relatively flat position. In an expanded state, the container may have a generally trapezoidal prism shape.Type: GrantFiled: August 22, 2012Date of Patent: March 22, 2016Assignee: Advanced Technologies Materials, Inc.Inventors: Glenn Tom, Thea Annette Ellingson, Amy Koland, Dale Gene Mowrey
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Publication number: 20160075971Abstract: A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include corrosion inhibitor(s) and surfactant(s). The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.Type: ApplicationFiled: April 22, 2014Publication date: March 17, 2016Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.Inventors: Jun LIU, Laisheng SUN, Steven MEDD, Jeffrey A. BARNES, Peter WRSCHKA, Elizabeth THOMAS
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Patent number: 9256134Abstract: Disclosed herein is a composition and method for semiconductor processing. In one embodiment, a wet-cleaning composition for removal of photoresist is provided. The composition comprises a strong base; an oxidant; and a polar solvent. In another embodiment, a method for removing photoresist is provided. The method comprises the steps of applying a wet-cleaning composition comprising about 0.1 to about 30 weight percent strong base; about one to about 30 weight percent oxidant; about 20 to about 95 weight percent polar solvent; and removing the photoresist.Type: GrantFiled: March 25, 2014Date of Patent: February 9, 2016Assignee: Advanced Technology Materials, Inc.Inventors: David W. Minsek, Melissa K. Rath, David D. Bernhard, Thomas H. Baum
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Patent number: 9238850Abstract: Processes for recycling electronic components removed from printed wire boards, whereby precious metals and base metals are extracted from the electronic components using environmentally friendly compositions. At least gold, silver and copper ions can be extracted from the electronic components and reduced to their respective metals using the processes and compositions described herein.Type: GrantFiled: August 19, 2011Date of Patent: January 19, 2016Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.Inventors: Michael B. Korzenski, Ping Jiang, James Norman, John Warner, Laura Ingalls, Dinakar Gnanamgari, Fred Strickler, Ted Mendum
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Patent number: 9221114Abstract: Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.Type: GrantFiled: December 13, 2012Date of Patent: December 29, 2015Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.Inventors: Tianniu Chen, Michael B. Korzenski, Ping Jiang
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Patent number: 9211993Abstract: The present disclosure relates to an integrated liner-based system having an overpack and a liner provided within the overpack, the liner comprising a mouth and a liner wall forming an interior cavity of the liner and having a thickness such that the liner is substantially self-supporting in an expanded state, but is collapsible at a pressure of less than about 20 psi. The liner and overpack may be made by blow molding the liner and the overpack at the same time using nested preforms.Type: GrantFiled: October 10, 2011Date of Patent: December 15, 2015Assignee: Advanced Technology Materials, Inc.Inventors: Glenn Tom, Greg Nelson, Wei Liu, Amy Koland, Don Ware, Daniel J. Durham, Tracy M. Momany, Chantel Roush
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Patent number: 9215813Abstract: Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling.Type: GrantFiled: April 15, 2011Date of Patent: December 15, 2015Assignee: Advanced Technology Materials, Inc.Inventors: André Brosseau, Svitlana Grigorenko, Ping Jiang, Michael B. Korzenski
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Patent number: 9175404Abstract: Object is to provide an etching solution which generates less foam and can etch copper or copper alloy at high selectivity when used in a step of etching copper or copper alloy in an electronic substrate having both of copper or copper alloy and nickel. The etching solution to be used in a step of selectively etching copper or copper alloy in an electronic substrate having both of copper or copper alloy and nickel has, as essential components thereof, (A) a linear alkanolamine, (B) a chelating agent having an acid group in the molecule thereof, and (C) hydrogen peroxide.Type: GrantFiled: September 28, 2012Date of Patent: November 3, 2015Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.Inventors: Tsutomu Kojima, Yukichi Koji
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Patent number: 9158203Abstract: Compositions useful for the selective removal of silicon nitride materials relative to poly-silicon, silicon oxide materials and/or silicide materials from a microelectronic device having same thereon. The removal compositions include fluorosilicic acid, silicic acid, and at least one organic solvent. Typical process temperatures are less than about 100° C. and typical selectivity for nitride versus oxide etch is about 200:1 to about 2000:1. Under typical process conditions, nickel-based silicides as well as titanium and tantalum nitrides are largely unaffected, and polysilicon etch rates are less than about 1 ? min?1.Type: GrantFiled: July 15, 2014Date of Patent: October 13, 2015Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.Inventors: Emanuel I. Cooper, Eileen Sparks, William R. Bowers, Mark A. Biscotto, Kevin P. Yanders, Michael B. Korzenski, Prerna Sonthalia, Nicole E. Thomas
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Patent number: 9126749Abstract: The present disclosure relates to novel and advantageous connector assemblies for use with a liner-based assembly. In one embodiment, a connector assembly for use with a liner-based assembly can include a pressure port, a dispense port, a headspace removal port, and a locking mechanism. The pressure port can be adapted for connection to a pressure source. The dispense port can be adapted for fluid communication with a source of material to be dispensed from the liner-based assembly. The headspace removal port may be configured for removing a gas from the liner-based assembly. The locking mechanism may be used for locking the connector to the liner-based assembly when contents therein are under pressure. In some embodiments, the dispense port and headspace removal port may be operably coupled providing a flow path for recirculation of the contents within a liner of the liner-based assembly.Type: GrantFiled: October 14, 2011Date of Patent: September 8, 2015Assignee: Advanced Technology Materials, Inc.Inventors: Jordan Henery Hodges, Amy Koland, Greg Nelson, Rick Wilson, Don Ware