Patents Assigned to Advanced Technology Materials, Inc.
  • Patent number: 9546321
    Abstract: Compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to metal conducting, e.g., tungsten, and insulating materials from a microelectronic device having same thereon. The removal compositions contain at least one oxidant and one etchant, may contain various corrosion inhibitors to ensure selectivity.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: January 17, 2017
    Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventors: Jeffrey A. Barnes, Emanuel I. Cooper, Li-Min Chen, Steven Lippy, Rekha Rajaram, Sheng-Hung Tu
  • Patent number: 9528078
    Abstract: An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: December 27, 2016
    Assignee: Advanced Technology Materials, Inc.
    Inventors: David Angst, Peng Zhang, Jeffrey Barnes, Prerna Sonthalia, Emanuel Cooper, Karl Boggs
  • Patent number: 9520617
    Abstract: An improved solvent containing sulfolane and at least one dialkyl sulfone, preferably dimethyl sulfone, wherein the improved solvent is a liquid at room temperature and can be used for reaction media and electrochemistry.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: December 13, 2016
    Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventor: Emanuel I. Cooper
  • Patent number: 9476019
    Abstract: A cleaning agent for a microelectronic device provided with metal wiring, which has an excellent ability to remove polishing particle residues derived from a polishing agent and an excellent ability to remove metallic residues on an insulating film, and has excellent anticorrosiveness to the metal wiring. The cleaning agent is used at a step subsequent to chemical mechanical polishing in a manufacturing process of a microelectronic device in which a metal wiring, e.g., copper or tungsten, is formed.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: October 25, 2016
    Assignee: Advanced Technology Materials, Inc.
    Inventors: Mutsumi Nakanishi, Hiroshi Yoshimochi, Yukichi Koji
  • Patent number: 9443713
    Abstract: An oxidizing aqueous cleaning composition and process for cleaning post-plasma etch residue and/or hardmask material from a microelectronic device having said residue thereon. The oxidizing aqueous cleaning composition includes at least one oxidizing agent, at least one oxidizing agent stabilizer comprising an amine species selected from the group consisting of primary amines, secondary amines, tertiary amines and amine-N-oxides, optionally at least one co-solvent, optionally at least one metal-chelating agent, optionally at least one buffering species, and water. The composition achieves highly efficacious cleaning of the residue material from the microelectronic device while simultaneously not damaging the interlevel dielectric and metal interconnect material also present thereon.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: September 13, 2016
    Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventors: David W. Minsek, Michael B. Korzenski, Martha M. Rajaratnam
  • Patent number: 9422513
    Abstract: A liquid removal composition and process for removing sacrificial anti-reflective coating (SARC) material from a substrate having same thereon. The liquid removal composition includes at least one fluoride-containing compound, at least one organic solvent, optionally water, and optionally at least one chelating agent. The composition achieves at least partial removal of SARC material in the manufacture of integrated circuitry with minimal etching of metal species on the substrate, such as aluminum, copper and cobalt alloys, and without damage to low-k dielectric materials employed in the semiconductor architecture.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: August 23, 2016
    Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventors: Melissa K. Rath, David D. Bernhard, Thomas H. Baum, David W. Minsek
  • Publication number: 20160236806
    Abstract: The present disclosure relates to an integrated liner-based system having an overpack and a liner provided within the overpack, the liner comprising a mouth and a liner wall forming an interior cavity of the liner and having a thickness such that the liner is substantially self-supporting in an expanded state, but is collapsible at a pressure of less than about 20 psi. The liner and overpack may be made by blow molding the liner and the overpack at the same time using nested preforms.
    Type: Application
    Filed: April 27, 2016
    Publication date: August 18, 2016
    Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventors: Glenn Tom, Greg Nelson, Wei Liu, Amy Koland, Don Ware, Daniel J. Durham, Tracy M. Momany, Chantel Ortega
  • Patent number: 9416338
    Abstract: Cleaning compositions and processes for cleaning residue from a microelectronic device having said residue thereon. The composition comprises at least one amine, at least one oxidizing agent, water, and at least one borate species and achieves highly efficacious cleaning of the residue material, including post-ash residue, post-etch residue, post-CMP residue, particles, organic contaminants, metal ion contaminants, and combinations thereof from the microelectronic device while simultaneously not damaging the titanium nitride layers and low-k dielectric materials also present on the device.
    Type: Grant
    Filed: October 13, 2011
    Date of Patent: August 16, 2016
    Assignees: ADVANCED TECHNOLOGY MATERIALS, INC., INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Emanuel I. Cooper, George Gabriel Totir, Makonnen Payne
  • Patent number: 9340760
    Abstract: A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions are substantially devoid of amine and ammonium-containing compounds, e.g., quaternary ammonium bases. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: May 17, 2016
    Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventors: Jeffrey A. Barnes, Jun Liu, Peng Zhang
  • Publication number: 20160130500
    Abstract: Compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to metal conducting, e.g., cobalt, ruthenium and copper, and insulating materials from a microelectronic device having same thereon. The removal compositions contain at least one oxidant and one etchant, may contain various corrosion inhibitors to ensure selectivity.
    Type: Application
    Filed: June 6, 2014
    Publication date: May 12, 2016
    Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventors: Li-Min CHEN, Steven LIPPY, Emanuel I Cooper, Lingyan Song
  • Patent number: 9290296
    Abstract: The present disclosure relates to a blow-molded, rigid collapsible container that can be suitable for storage and dispensing systems of practically any size. The rigid collapsible container may be a stand-alone container. The container may be blow-molded as a unitary piece that may include folds or pre-folds that allows the container to collapse into a relatively flat position. In an expanded state, the container may have a generally trapezoidal prism shape.
    Type: Grant
    Filed: August 22, 2012
    Date of Patent: March 22, 2016
    Assignee: Advanced Technologies Materials, Inc.
    Inventors: Glenn Tom, Thea Annette Ellingson, Amy Koland, Dale Gene Mowrey
  • Publication number: 20160075971
    Abstract: A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include corrosion inhibitor(s) and surfactant(s). The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
    Type: Application
    Filed: April 22, 2014
    Publication date: March 17, 2016
    Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventors: Jun LIU, Laisheng SUN, Steven MEDD, Jeffrey A. BARNES, Peter WRSCHKA, Elizabeth THOMAS
  • Patent number: 9256134
    Abstract: Disclosed herein is a composition and method for semiconductor processing. In one embodiment, a wet-cleaning composition for removal of photoresist is provided. The composition comprises a strong base; an oxidant; and a polar solvent. In another embodiment, a method for removing photoresist is provided. The method comprises the steps of applying a wet-cleaning composition comprising about 0.1 to about 30 weight percent strong base; about one to about 30 weight percent oxidant; about 20 to about 95 weight percent polar solvent; and removing the photoresist.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: February 9, 2016
    Assignee: Advanced Technology Materials, Inc.
    Inventors: David W. Minsek, Melissa K. Rath, David D. Bernhard, Thomas H. Baum
  • Patent number: 9238850
    Abstract: Processes for recycling electronic components removed from printed wire boards, whereby precious metals and base metals are extracted from the electronic components using environmentally friendly compositions. At least gold, silver and copper ions can be extracted from the electronic components and reduced to their respective metals using the processes and compositions described herein.
    Type: Grant
    Filed: August 19, 2011
    Date of Patent: January 19, 2016
    Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventors: Michael B. Korzenski, Ping Jiang, James Norman, John Warner, Laura Ingalls, Dinakar Gnanamgari, Fred Strickler, Ted Mendum
  • Patent number: 9221114
    Abstract: Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: December 29, 2015
    Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventors: Tianniu Chen, Michael B. Korzenski, Ping Jiang
  • Patent number: 9215813
    Abstract: Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling.
    Type: Grant
    Filed: April 15, 2011
    Date of Patent: December 15, 2015
    Assignee: Advanced Technology Materials, Inc.
    Inventors: André Brosseau, Svitlana Grigorenko, Ping Jiang, Michael B. Korzenski
  • Patent number: 9211993
    Abstract: The present disclosure relates to an integrated liner-based system having an overpack and a liner provided within the overpack, the liner comprising a mouth and a liner wall forming an interior cavity of the liner and having a thickness such that the liner is substantially self-supporting in an expanded state, but is collapsible at a pressure of less than about 20 psi. The liner and overpack may be made by blow molding the liner and the overpack at the same time using nested preforms.
    Type: Grant
    Filed: October 10, 2011
    Date of Patent: December 15, 2015
    Assignee: Advanced Technology Materials, Inc.
    Inventors: Glenn Tom, Greg Nelson, Wei Liu, Amy Koland, Don Ware, Daniel J. Durham, Tracy M. Momany, Chantel Roush
  • Patent number: 9175404
    Abstract: Object is to provide an etching solution which generates less foam and can etch copper or copper alloy at high selectivity when used in a step of etching copper or copper alloy in an electronic substrate having both of copper or copper alloy and nickel. The etching solution to be used in a step of selectively etching copper or copper alloy in an electronic substrate having both of copper or copper alloy and nickel has, as essential components thereof, (A) a linear alkanolamine, (B) a chelating agent having an acid group in the molecule thereof, and (C) hydrogen peroxide.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: November 3, 2015
    Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventors: Tsutomu Kojima, Yukichi Koji
  • Patent number: 9158203
    Abstract: Compositions useful for the selective removal of silicon nitride materials relative to poly-silicon, silicon oxide materials and/or silicide materials from a microelectronic device having same thereon. The removal compositions include fluorosilicic acid, silicic acid, and at least one organic solvent. Typical process temperatures are less than about 100° C. and typical selectivity for nitride versus oxide etch is about 200:1 to about 2000:1. Under typical process conditions, nickel-based silicides as well as titanium and tantalum nitrides are largely unaffected, and polysilicon etch rates are less than about 1 ? min?1.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: October 13, 2015
    Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventors: Emanuel I. Cooper, Eileen Sparks, William R. Bowers, Mark A. Biscotto, Kevin P. Yanders, Michael B. Korzenski, Prerna Sonthalia, Nicole E. Thomas
  • Patent number: 9126749
    Abstract: The present disclosure relates to novel and advantageous connector assemblies for use with a liner-based assembly. In one embodiment, a connector assembly for use with a liner-based assembly can include a pressure port, a dispense port, a headspace removal port, and a locking mechanism. The pressure port can be adapted for connection to a pressure source. The dispense port can be adapted for fluid communication with a source of material to be dispensed from the liner-based assembly. The headspace removal port may be configured for removing a gas from the liner-based assembly. The locking mechanism may be used for locking the connector to the liner-based assembly when contents therein are under pressure. In some embodiments, the dispense port and headspace removal port may be operably coupled providing a flow path for recirculation of the contents within a liner of the liner-based assembly.
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: September 8, 2015
    Assignee: Advanced Technology Materials, Inc.
    Inventors: Jordan Henery Hodges, Amy Koland, Greg Nelson, Rick Wilson, Don Ware