Abstract: A sound insulation plate includes a patterned frame and an elastic membrane, wherein the patterned frame includes a central pattern region and multiple peripheral pattern regions arranged around the central pattern region, the multiple peripheral pattern regions being separated from the central pattern region by a separation bar, and wherein the elastic membrane is mounted on the patterned frame to block passage of air and converts airborne sound waves into elastic waves.

Abstract: An image processing device according to one embodiment estimates optical flow information, pixel by pixel, on the basis of a reference image and input images of consecutive frames, and estimates a term corresponding to temporal consistency between the frames of the input images. The image processing device determines a mesh on the basis of the term corresponding to temporal consistency and the optical flow information, and transforms the reference image on the basis of the mesh. The image processing device preforms image blending on the basis of the input image, the transformed reference image, and mask data.

Abstract: A gesture recognition apparatus by which a gesture for an interface operation is performed includes an image capturer that captures distance image data, a closest point detector that detects a closest point from the imaging apparatus, a gesture measurer that calculates an input switching border for switching ON and OFF of interface input, a gesture recognizer that determines whether the input is ON or OFF, and an interface controller that performs the interface control associated with the gesture if it is determined that the input has been turned on.

Abstract: A package structure includes a wiring structure and a first electronic device. The wiring structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The first electronic device is electrically connected to the wiring structure, and has a first surface, a second surface and at least one lateral side surface extending between the first surface and the second surface. The first electronic device includes a first active circuit region and a first protrusion portion. The first protrusion portion protrudes from the at least one lateral side surface of the first electronic device. A portion of the first active circuit region is disposed in the first protrusion portion.

Abstract: Proposed are an ultra-low jitter low-power phase-locked loop using a power-gating injection-locked frequency multiplier-based phase detector (PG-ILFM PD) and an operating method thereof. The proposed PG-ILFM PD includes a replica voltage controlled oscillator (R-VCO) configured to cut off the power supply of the R-VCO repeatedly based on a reference signal SREF and a fundamental sampling phase detector (FSPD) configured to receive an output signal SILFM of the R-VCO as a reference signal for sampling and detect a phase error of a main voltage controlled oscillator (M-VCO).

Abstract: An optical system and a method of manufacturing an optical system are provided. The optical system includes a carrier, a light emitter, a light receiver, a block structure and an encapsulant. The light emitter is disposed on the carrier. The light receiver is disposed on the carrier and physically spaced apart from the light emitter. The light receiver has a light detecting area. The block structure is disposed on the carrier. The encapsulant is disposed on the carrier and covers the light emitter, the light receiver and the block structure. The encapsulant has a recess over the block structure.

Abstract: The present disclosure provides a semiconductor substrate, including a first dielectric layer with a first surface and a second surface, a first conductive via extending between the first surface and the second surface, a first patterned conductive layer on the first surface, and a second patterned conductive layer on the second surface. The first conductive via includes a bottom pattern on the first surface and a second patterned conductive layer on the second surface. The bottom pattern has at least two geometric centers corresponding to at least two geometric patterns, respectively, and a distance between one geometric center and an intersection of the two geometrical patterns is a geometric radius. A distance between the at least two geometric centers is greater than 1.4 times the geometric radius. A method for manufacturing the semiconductor substrate described herein and a semiconductor package structure having the semiconductor substrate are also provided.

Abstract: A road vibration coefficient which defines a relation between vibration and a movement velocity of a vehicle during traveling is obtained. An information processing device includes: an acquisition section that acquires a measurement value which has been measured by a sensor provided in a vehicle while the vehicle is traveling on a road surface; a vibration feature quantity calculation section that calculates a vibration feature quantity Pv(t); and a road vibration coefficient calculation section that calculates a road vibration coefficient ?.

Abstract: A bacteriophage which consists of the nucleotide sequence represented by SEQ ID NO: 1 or a nucleotide sequence having 90% or more identity thereto, as its genome, is capable of infecting and lysing a diabetes-inducible bacterium belonging to Fusimonas intestini,containing a cyclic single-stranded DNA.

Abstract: A method for soil data interpolation includes collecting first and second agricultural field point data values corresponding to a variable grid and generating interpolated point data values by analyzing the first and second agricultural field point data values. A computing system includes a processor and a memory storing instructions that, when executed by the processor, cause the computing system to collect first and second agricultural field point data values corresponding to a variable grid and generate interpolated point data values by analyzing the first and second agricultural field point data values. A non-transitory computer readable medium includes program instructions that when executed, cause a computer to collect first and second agricultural field point data values corresponding to a variable grid and generate interpolated point data values by analyzing the first and second agricultural field point data values.

Abstract: An energy storage module comprising a plurality of electrochemical cells for storing electric energy and comprising at least one contacting device for electrically contacting the plurality of electrochemical cells. Each of the electrochemical cells has a first flat connection lug for contacting a first electrode of the respective electrochemical cell and a second flat connection lug for contacting a second electrode of the respective electrochemical cell. The electrochemical cells are arranged in a stacked formation and form a cell pack such that the first and second flat connection lugs extend outwards from two opposing sides of the cell pack in an at least substantially perpendicular manner. According to the invention, the at least one contacting device is substantially comb-shaped in particular and has a plurality of teeth which are formed and arranged such that a first or second connection lug is or can be received between two adjacent teeth.

Abstract: The present application relates to a new stimulation design which can be utilized to treat neurological conditions. The stimulation system produces a burst mode stimulation which alters the neuronal activity of the predetermined site, thereby treating the neurological condition or disorder. The burst stimulus comprises a plurality of groups of spike pulses having a maximum inter-spike interval of 100 milliseconds. The burst stimulus is separated by a substantially quiescent period of time between the plurality of groups of spike pulses. This inter-group interval may comprise a minimum of 5 seconds.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.

Abstract: A process for producing a chalcogen-containing compound semiconductor includes providing at least one substrate coated with a precursor for the chalcogen-containing compound semiconductor in a process chamber; heat treating the at least one coated substrate in the process chamber, wherein during a heat treatment, a gas atmosphere comprising at least one gaseous chalcogen compound is provided in the process chamber; removing the gas atmosphere present after the heat treatment of the at least one coated substrate as a waste gas from the process chamber; cooling the waste gas in a gas processor, wherein a plurality of gaseous chalcogen compounds-present in the waste gas after the heat treatment of the at least one coated substrate are separated in time and space from one another from the waste gas by respective conversion into a liquid or solid form. Further provided is a device designed to carry out the process.

Abstract: A semiconductor package includes multiple dies that share the same package pin. An output enable register provided on each die is used to select the die that drives an output to the shared pin. A hardware arbitration circuit ensures that two or more dies do not drive an output to the shared pin at the same time.

Abstract: The present disclosure provides a temperature field device for crystal growth. The temperature field device may include a first drum; a second drum located inside the first drum; a filler filled in a space between the first drum and the second drum; a bottom plate mounted on a bottom of the temperature field device and covering a bottom end of the first drum; and a first cover plate mounted on a top of the temperature filed device and covering a top end of the first drum.

Abstract: A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.

Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) measuring an amount of a molding powder; (b) controlling the amount of a molding powder; and (c) dispensing the molding powder on an assembly structure including a carrier and at least one semiconductor device disposed on the carrier.

Abstract: A universal chemical processor (UCP) including a reactor vessel having a central longitudinal axis and main chamber comprises a first inlet port for a main feedstock, a second inlet port for a fluidizing medium and a third inlet port for one or more reactants. The UCP also includes a reactive radioactive chemical processor (R2CP) that contains a radioactive element positioned extending along the longitudinal axis in the main chamber. In operation, a fluidized bed can be supported in the main chamber when a fluidizing medium and feedstock are supplied to the main chamber through the first and second inlet ports and the radioactive element of the R2CP emits ionizing radiation that is capable of ionizing feedstock and reactants, inducing chemical reactions, and sterilizing and decomposing any organic materials within a radiation zone.

Abstract: A recessed portion in a semiconductor substrate and a method of forming the same are provided. The method comprises: forming a mask on the semiconductor substrate; forming a protection layer on a top surface of the mask and on at least one sidewall of the mask, and on at least one surface of the semiconductor substrate exposed by the mask; performing a first etching process to remove the protection layer on the top surface of the mask and on a bottom surface of the semiconductor substrate exposed by the mask; and performing a second etching process to remove the remaining protection layer and to etch the semiconductor substrate to form the recessed portion. In this way, a recessed portion with relatively smooth and vertical sidewalls can be realized.